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Patent # Description
US-1,012,8228 Type III-V semiconductor device with integrated diode
A semiconductor device includes a type IV semiconductor base substrate, a first type III-V semiconductor layer formed over the base substrate, a second type...
US-1,012,8204 RF module
In accordance with an embodiment, an RF module includes a bulk semiconductor substrate with at least one integrated RF component integrated in a first main...
US-1,012,8180 Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an...
US-1,012,8173 Common contact leadframe for multiphase applications
In some examples, a device includes an input leadframe segment and a reference leadframe segment that is electrically isolated from the input leadframe segment....
US-1,012,8165 Package with vertically spaced partially encapsulated contact structures
A package comprising at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, a first electrically...
US-1,012,8133 Method of conditioning an etch chamber for contaminant free etching of a semiconductor device
An etching tool that includes an interior chamber is provided. A plurality of type III-V semiconductor wafers is provided. A process cycle is performed for each...
US-1,012,7176 Receiver architecture
In accordance with an embodiment, a receiver includes a receiving unit configured to receive a first received bus signal and a second received bus signal based...
US-1,012,7171 Circuit arrangement, network-on-chip and method for transmitting information
A circuit arrangement, network-on-chip, and a method for transmitting information are disclosed. In one embodiment, an electrical circuit is provided comprising...
US-1,012,6773 Circuit and method for providing a secondary reference voltage from an initial reference voltage
According one embodiment, a circuit is described comprising a first reference voltage generating circuit comprising an output to provide a first reference...
US-1,012,6355 Semiconductor probe test card with integrated hall measurement features
A probe test card for testing semiconductor devices includes a printed circuit board, a pair of electrically conductive probes extending towards one another and...
US-1,012,6353 Verification of gate driver protection logic
A gate driver is described that includes a gate signal module configured to output a gate signal of the gate driver for driving a gate terminal of a...
US-1,012,6347 Passive bridge circuit with oxide windows as leakage sink
Leakage current detection systems and detection methods are provided. A leakage current detection system includes a passive bridge circuit including a first...
US-1,012,5012 MEMS device
A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main...
US-1,012,3429 Mounting of components on a printed circuit board
A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed...
US-1,012,3103 Sigma delta modulator for sensors
In various embodiments, a circuit is provided. The circuit includes: a voltage biasing circuit coupled to a microelectro-mechanical system (MEMS) microphone...
US-1,012,2449 Access control devices and a transceiver device
An access control device includes a time of flight circuit configured to determine a distance information related to a distance between the access control...
US-1,012,2374 Method and apparatus for analog-to-digital conversion using a tank capacitor
An apparatus for converting an analog signal to a digital signal comprises an input node to be set to an input voltage that is based on the analog signal. The...
US-1,012,2362 Dynamic biasing circuitry for level-shifter circuitry
In some examples, a device includes level-shifter circuitry and biasing circuitry including at least four diodes, wherein each diode of the at least four diodes...
US-1,012,2293 Power module package having a multi-phase inverter and power factor correction
According to an exemplary implementation, a power module package includes a multi-phase inverter. The power module package also includes a multi-phase inverter...
US-1,012,2287 Power supply systems and feedback through a transformer
A power converter circuit includes a transformer. The transformer includes a primary winding and a secondary winding. A primary circuit is coupled to the...
US-1,012,2276 Method for operating a power converter circuit and power converter circuit
In accordance with an embodiment, a method includes converting power by a power converter circuit having a plurality of converter cells coupled to a supply...
US-1,012,2256 Method and apparatus for zero-current switching control in switched-capacitor converters
A switched-capacitor converter includes a plurality of legs coupled between the input and a rectifier at the output. Each leg includes a capacitor. A first...
US-1,012,1859 Method of manufacturing semiconductor devices with transistor cells and semiconductor device
First reinforcement stripes are formed on a process surface of a base substrate. A first epitaxial layer covering the first reinforcement stripes is formed on...
US-1,012,1753 Enhanced solder pad
A solder pad includes a surface. A tin layer is arranged on the surface. At least one out of a bismuth layer, an antimony layer and a nickel layer is arranged...
US-1,012,1751 Integrated antennas in wafer level package
A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially...
US-1,012,1723 Semiconductor component and method for producing a semiconductor component
According to an embodiment of a method, the method includes forming a first thermally conductive layer on an outer surface of a semiconductor package. The first...
US-1,012,1691 Semiconductor substrate arrangements and a method for forming a semiconductor substrate arrangement
A semiconductor substrate arrangement includes a carrier wafer and a plurality of semiconductor substrate pieces fixed to the carrier wafer and distributed...
US-1,012,1690 Method of manufacturing a semiconductor component and semiconductor component
Various embodiments provide method of manufacturing a semiconductor component, wherein the method comprises providing a layer stack comprising a carrier and a...
US-1,012,0829 Bus device with programmable address
An embodiment bus device with a programmable address includes a bus communication circuit connected to a bus terminal, a first pin terminal, a memory having a...
US-1,012,0434 Semiconductor device chip package with electronic switching using dedicated ground pin coupled to a virtual...
A semiconductor device is described herein. In accordance with one exemplary embodiment the semiconductor device includes a chip package, which includes at...
US-1,012,0398 Temperature dependent current limiting
In one example, a method includes determining, by a temperature sensor, a temperature of a device that controls an amount of current flowing to a load, and...
US-1,012,0287 Particle irradiation apparatus, beam modifier device, and semiconductor device including a junction termination...
A beam modifier device is provided that includes scattering portions in which particles vertically impinging on an exposure surface of the beam modifier device...
US-1,011,9999 Circuit connectivity and conveyance of power status information
An example system comprises first circuitry (such as a first integrated circuit device having a limited number of input/output pins) and second circuitry (such...
US-1,011,9727 Mechanical relay and solid-state relay for controlling heating elements
A circuit comprises a mechanical relay and a solid-state relay. The mechanical relay is configured to switch a first supply current of the first heating element...
US-1,011,8816 Method of forming a protective coating for a packaged semiconductor device
A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device,...
US-1,011,7621 Implantable device and implantable system comprising the same
An implantable device includes a body part and a piezoelectric part. The body part is configured to grasp a pulsatile organic or inorganic tissue. The...
US-1,011,7321 Device including a printed circuit board and a metal workpiece
A device including a first semiconductor package that includes a semiconductor chip, an encapsulation material at least partly covering the semiconductor chip,...
US-1,011,6301 Cross-coupled, narrow pulse, high voltage level shifting circuit with voltage domain common mode rejection
A system for high voltage level shifting includes a level shifting circuit having a high side circuit that receives a mixed signal having a common mode signal...
US-1,011,6209 System and method for starting a switched-mode power supply
A method of operating a switched-mode power supply (SMPS) includes starting up the switched-mode power supply by determining a rate of increase of a duty cycle...
US-1,011,5817 Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes forming a first semiconductor layer on a semiconductor substrate of a first conductivity type having a...
US-1,011,5812 Semiconductor device having a superjunction structure
A semiconductor device includes a drift region of a first conductivity type, an anode region of a second conductivity type situated below the drift region, an...
US-1,011,5791 Semiconductor device including a super junction structure in a SiC semiconductor body
An embodiment of a semiconductor device includes a body region of a first conductivity type in a SiC semiconductor body of a second conductivity type. A super...
US-1,011,5688 Solder metallization stack and methods of formation thereof
A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact...
US-1,011,5646 Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power...
US-1,011,4992 Electronic identification document
An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave...
US-1,011,4685 System and method for error detection of executed program code employing compressed instruction signatures
A system comprising a first processor and a second processor is provided. The first processor is configured to load an instruction block from a first memory,...
US-1,011,4401 System and method for a serial bus interface
In accordance with an embodiment, a method of operating a charging port having a power connection and a first data connection includes determining whether a...
US-1,011,3884 Diversity in magnetic sensors
A magnetic angle sensor including a first Wheatstone bridge circuit having a plurality of first magnetoresistive elements; and a second Wheatstone bridge...
US-1,011,2861 Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of...
A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a...
US-1,011,1299 Adaptive overvoltage protection for multifunction LED chain
In one example, a method includes determining, by a device of a system, a voltage feedback value that represents a voltage level of a power signal being...
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