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Patent # Description
US-9,478,484 Semiconductor packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over...
US-9,478,409 Method for coating a workpiece
In various embodiments, a method for coating a workpiece is provided. The method may include drying a workpiece, the workpiece being coated with at least one...
US-9,476,915 Magnetic field current sensors
Embodiments relate to magnetic field current sensors. In an embodiment, a magnetic field current sensor includes a semiconductor die having first and second...
US-9,476,701 Apparatus for detecting a pre-aligning element at a wafer
An apparatus detects a pre-aligning element at a wafer. The wafer has the pre-aligning element at a wafer edge. The apparatus includes a sensor arrangement and...
US-9,475,691 Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically...
US-9,473,071 System and method for a radio frequency system
In accordance with an embodiment, a method includes producing a baseband variable frequency signal and producing a substantially fixed frequency signal by...
US-9,473,043 System on chip with power switches
According to an exemplary implementation, an integrated circuit (IC) includes a logic circuit monolithically formed on the IC. The logic circuit is configured...
US-9,473,025 System and method for providing adaptive dead times for a half bridge circuit
System and method for adaptively altering a power supply's dead time. A method comprises detecting a start of a dead time, detecting an ending condition of the...
US-9,472,948 On chip reverse polarity protection compliant with ISO and ESD requirements
A semiconductor device is disclosed. In one embodiment a semiconductor device includes a semiconductor chip including a substrate, a ground terminal configured...
US-9,472,799 Switch arrangements and battery arrangements
A switch arrangement may include at least one carrier having a first side and a second side and a plurality of electrically conductive through connections...
US-9,472,626 High performance III-nitride power device
A III-nitride semiconductor device which includes a barrier body between the gate electrode and the gate dielectric thereof.
US-9,472,625 Operational Gallium Nitride devices
A power circuit is described that includes a semiconductor body having a common substrate and a Gallium Nitride (GaN) based substrate. The GaN based substrate...
US-9,472,544 Semiconductor device comprising electrostatic discharge protection structure
A semiconductor device comprises a semiconductor body having a first surface and a second surface opposite to the first surface. The semiconductor device...
US-9,472,541 Methods for manufacturing an electronic module
A method for manufacturing an electronic module is disclosed. In an embodiment the method includes providing a passive component having an upper surface of a...
US-9,472,395 Semiconductor arrangement including buried anodic oxide and manufacturing method
In accordance with a method of manufacturing a semiconductor arrangement, a first trench is formed into a semiconductor body from a first side. An anodic oxide...
US-9,471,793 System on chip with embedded security module
An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors...
US-9,471,523 Serial interface systems and methods having multiple modes of serial communication
An enhanced serial interface system is disclosed. The system includes a master component and a slave component. The master component is configured to operate in...
US-9,470,738 Ground fault detection
In one example, a method includes receiving, at an input of a system, an AC signal, rectifying the AC signal into a DC signal, and determining, based on a value...
US-9,470,582 Temperature sensing circuit and method for sensing temperature
According to one embodiment, a temperature sensing circuit is described comprising a multiplicity of transistor circuits having a multiplicity of different...
US-9,470,552 Axial and perpendicular angle sensor in single package
Embodiments relate to magnetic field angle sensors that utilize axial and perpendicular sensors collectively to infer a rotational angle. In embodiments, a...
US-9,470,506 Systems and methods for rapid detection of rotation direction
Embodiments relate to sensor systems and methods for rapidly detecting a direction of rotation. In one embodiment, a sensor system is configured to identify...
US-9,469,306 Sensor interface transceiver
Some embodiments of the present disclosure relate to a sensor interface module that selectively varies the resistance of an RLC network based upon one or more...
US-9,467,774 System and method for a PCM interface for a capacitive signal source
In accordance with embodiment, a method includes amplifying signal provided by a microphone to form an amplified signal. The method also includes converting the...
US-9,467,185 Receiver and method for receiving a signal
A receiver includes a receiver circuit to receive a pulse width encoded signal and a sampling circuit to determine a position of a transition of the pulse of...
US-9,467,061 System and method for driving a transistor
In accordance with an embodiment, a circuit for driving a control terminal of a switching transistor includes a driver having an output configured to be coupled...
US-9,467,053 Controlling a multi-mode switching converter
Systems and methods for controlling a switching converter using a duty cycle associated with either a buck mode or a boost mode of the switching converter. More...
US-9,466,979 Communication line driver protection circuitry, systems and methods
Embodiments relate to fault detection comparator circuitry and methods that can operate in conjunction with a power-on-reset (POR) scheme to put a chip into a...
US-9,466,677 Semiconductor structure including guard ring
One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer...
US-9,466,377 Method and device for processing an erase counter
A embodiment relates to a method for processing an erase counter comprising erase counter fields, the method comprising the steps of (i) determining an unused...
US-9,465,705 Processing a target memory
A method is suggested for processing a target memory, the method comprising the steps of (i) checking the target memory subsequent to an erase operation...
US-9,465,683 Apparatus and a method for providing an error signal for a control unit
An apparatus for providing an error signal for a control unit, the error signal indicating a malfunction of a sensor unit. The apparatus includes an input...
US-9,465,055 Electronic circuit and method for measuring a load current
An electronic circuit is described comprising a load, a power supply node, a first transistor coupled between the supply node and the load such that the input...
US-9,461,624 Output driver slew control
In one example, a method includes, in response to a voltage level of an input signal satisfying an input voltage threshold, activating a first driver of a...
US-9,461,583 System and method for a voltage controlled oscillator
In accordance with an embodiment, a voltage controlled oscillator (VCO) includes a VCO core having a plurality of transistors and a varactor circuit that has a...
US-9,461,536 Digital controller with nested loops for switched mode power converter
In one example, a method includes receiving a voltage value and comparing the voltage value to a reference voltage value to determine a delta voltage value. The...
US-9,461,474 Power converter circuit with AC output
A power converter circuit includes output terminals configured to receive an external voltage. A series circuit with a number of converter units is connected...
US-9,461,463 DC/DC converter with III-nitride switches
Disclosed is a buck converter for converting a high voltage at the input of the buck converter to a low voltage at the output of the buck converter. The buck...
US-9,461,182 Memory cell
A memory cell including a substrate with a protruding portion, the protruding portion having a side wall and a bottom, an upper doped region connected to a bit...
US-9,461,164 Semiconductor device and method of manufacturing the same
A semiconductor device includes a semiconductor body having a first surface and a second surface opposite to the first surface. The semiconductor device further...
US-9,461,120 Electronic device
According to various embodiments, an electronic device may include: a layer including a two-dimensional material; a dielectric structure at a first side of the...
US-9,461,119 Semiconductor structure with compositionally-graded transition layer
The invention provides semiconductor materials including a gallium nitride material layer formed on a silicon substrate and methods to form the semiconductor...
US-9,461,034 Composite group III-V and group IV transistor having a switched substrate
There are disclosed herein various implementations of a group III-V composite transistor having a switched substrate. Such a group III-V composite transistor...
US-9,461,022 Power semiconductor package with a common conductive clip
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input,...
US-9,461,004 Semiconductor workpiece having a semiconductor substrate with at least two chip areas
A semiconductor workpiece includes a semiconductor substrate, at least two chip areas, components of semiconductor devices being formed in the semiconductor...
US-9,460,810 Method and device for evaluating a chip manufacturing process
A method for evaluating a chip manufacturing process is described comprising measuring, for each of a plurality of chips manufactured in a chip manufacturing...
US-9,460,759 Sense amplifier of a memory cell
A sense amplifier of a memory cell having a sense voltage generating circuit configured to generate a sense voltage; and a sensing circuit configured to compare...
US-9,459,288 Wide interposer for an electronic testing system
A test interposer includes an interposer layer configured to receive a test socket, and a stiffening layer attached to the interposer layer so that the...
US-9,458,009 Semiconductor devices and methods of forming thereof
In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface...
US-9,455,849 Edge-based communication
Methods, devices and systems are disclosed where to generate a pulse a data line is actively driven to a first voltage followed by actively driving the data...
US-9,455,734 Sensor system using multiple modes for analog to digital conversion
A device for converting analog to digital is disclosed. The device includes a dual mode converter and a control unit. The dual mode converter has a coarse mode...
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