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Patent # Description
US-7,598,126 Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
Inorganic-based nanoparticles, such as nanoparticles based on silicon dioxide, are used in order to produce protective layers for semiconductor chips having...
US-7,597,235 Apparatus and method for producing a bonding connection
One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel...
US-7,596,185 Radio transmitter with variable amplifier units in the baseband section and in the radio-frequency section of...
The invention relates to a radio transmitter for the transmission of transmission signals. Signals to be transmitted are processed to form transmission signals...
US-7,595,618 DC voltage converter with a detector circuit configured to distinguish between operating modes
A DC voltage converter is provided that cyclically converts an input-side supply voltage into an output voltage, and includes an inductive storage element...
US-7,593,255 Integrated circuit for programming a memory element
An integrated circuit includes a resistance changing memory element and a circuit. The circuit is configured to program the memory element by iteratively...
US-7,592,932 Method and device for interpolating or decimating a signal
A method and a device for interpolating or decimating a signal is provided, the signal being processed by a plurality of signal processing means connected in...
US-7,592,875 Injection-locked oscillator circuit
An ILO circuit has a plurality of oscillator stages which are coupled to one another by means of a "tank lock" coupling. The coupling leads to an improved...
US-7,592,874 Phase/frequency detector, phase locked loop, method for phase/frequency detection and method for generating an...
A phase/frequency detector has a modulo counter for outputting a counter word with a predetermined word length depending on an oscillator signal. In addition, a...
US-7,592,696 Power module having at least two substrates
The invention relates to a power module 3 and a method for producing it. The power module 3 has a first substrate 1 having power semiconductor chips 4, and a...
US-7,592,689 Semiconductor module comprising semiconductor chips and method for producing the same
A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the...
US-7,592,678 CMOS transistors with dual high-k gate dielectric and methods of manufacture thereof
CMOS devices with transistors having different gate dielectric materials and methods of manufacture thereof are disclosed. A CMOS device is formed on a workpiece...
US-7,592,648 Integrated circuit arrangement with NPN and PNP bipolar transistors and corresponding production method
An integrated circuit arrangement and fabrication method is provided. The integrated circuit arrangement contains an NPN transistor and a PNP transistor. The PNP...
US-7,592,236 Method for applying a structure of joining material to the back surfaces of semiconductor chips
A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied,...
US-7,590,117 Multichannel processor
An arrangement and a method for processing data of multiprotocol data packets comprises at least one multiplexer connected to input ports; at least one first...
US-7,589,510 Voltage regulator having variable threshold voltage switch
A voltage regulator includes a power field effect transistor and a control-loop circuit. The power field effect transistor has a threshold voltage, a drain...
US-7,589,413 Semiconductor device comprising a vertical semiconductor component and method for producing the same
A semiconductor device (1; 25) has a vertical semiconductor component (2), a first metalization (8) and a second metalization (13). The second metalization (13)...
US-7,589,403 Lead structure for a semiconductor component and method for producing the same
A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for...
US-7,589,019 Memory cell array and method of forming a memory cell array
A memory cell array includes a plurality of first conductive lines running in a first direction, where the first conductive lines have a pitch Bp, a plurality of...
US-7,588,867 Reflection mask, use of the reflection mask and method for fabricating the reflection mask
A reflection mask that includes a structure (20) for lithographically transferring a layout onto a target substrate, in particular for use in EUV lithography,...
US-7,587,655 Method of transferring signals between a memory device and a memory controller
Method and apparatus for communication (e.g., transmitting and/or receiving) command, address and data signals from a memory device to a memory controller or...
US-7,587,533 Digital programming interface between a baseband processor and an integrated radio-frequency module
A circuit receives a clock signal, a data word which is emitted from a control device and has information about a read or write access to the circuit, and an...
US-7,587,193 Signal transmission arrangement having a transformer and a receiver circuit
A signal transmission arrangement includes a transformer and a receiver circuit. The transformer has at least one primary winding and at least one secondary...
US-7,586,994 Interface apparatus and method for data recovery and synchronization
The invention provides an interface apparatus for data recovery which supplies an analog signal (applied to the input and containing data in line with a coding)...
US-7,586,334 Circuit arrangement and method for processing a dual-rail signal
The present invention relates to a circuit arrangement for processing a dual-rail signal, comprising data inputs for feeding at least one dual-rail data input...
US-7,586,161 Edge structure with voltage breakdown in the linear region
One aspect of the invention relates to an edge structure for a semiconductor component having two electrodes arranged opposite one another on opposite sides of a...
US-7,586,158 Piezoelectric stress liner for bulk and SOI
A preferred embodiment of the invention provides a semiconductor device. A preferred device comprises an n-channel transistor and a p-channel transistor disposed...
US-7,586,059 Lithography mask substrate labeling system
A substrate labeling system includes a first laser assembly having a first laser and a first lens, a second laser assembly having a second laser and a second...
US-7,585,763 Methods of fabricating integrated circuit devices using anti-reflective coating as implant blocking layer
A patterned anti-reflective coating may be used as a selective implant-blocking layer during fabrication of an integrated circuit transistor. In particular, the...
US-7,585,701 Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with...
A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the...
US-7,583,638 Device and method for processing a digital data signal in a CDMA radio transmitter
A device for processing a digital data signal in a CDMA radio transmitter includes a channelization device, a spectral shaping device and a frequency correction...
US-7,583,527 Tunable resistor and method for operating a tunable resistor
A tunable resistor includes a resistor input terminal, a resistor output terminal, and at least one current path connected between the resistor input terminal...
US-7,583,362 Stray light feedback for dose control in semiconductor lithography systems
A stray light feedback system and method for a lithography exposure tool. The stray light feedback helps control critical dimension (CD) within a stray light...
US-7,583,129 Integrated circuit and method for operating the integrated circuit
An integrated circuit having cascade-connected multiplexers and a precharge unit. The cascade-connected multiplexers each have a plurality of data inputs, a data...
US-7,583,111 Method for driving a transistor half-bridge
A method drives a transistor half-bridge. The method includes measuring a delay time between an edge of an input signal and an corresponding edge of a phase...
US-7,583,081 Magnetostrictive multi-layer sensor for detecting a deformation
A sensor includes a substrate having a mechanically deformable region that is deformable in a direction non-parallel to a surface of the substrate, and a...
US-7,582,948 Integrated transistor, particularly for voltages and method for the production thereof
Integrated transistor and method for the production is disclosed. An explanation is given of, inter alia, a transistor having an electrically insulating...
US-7,582,922 Semiconductor device
A semiconductor device is disclosed. One embodiment provides a top surface. A first lateral semiconductor region is arranged adjacent to the top surface and...
US-7,582,909 Mounting and adhesive layer for semiconductor components
An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the...
US-7,582,896 Integrated circuit comprising an organic semiconductor, and method for the production of an integrated circuit
An embodiment of the invention provides an integrated circuit having an organic field effect transistor (OFET) with a dielectric layer. The dielectric layer is...
US-7,582,546 Device with damaged breakdown layer
A device utilizing a breakdown layer in combination with a programmable resistance material, a phase-change material or a threshold switching material. The...
US-7,582,531 Method for producing a buried semiconductor layer
A method for producing a region of increased doping in an n-doped semiconductor layer which is buried in a semiconductor body of a vertical power transistor and...
US-7,582,513 Electronic device and method for producing electronic devices
One aspect includes an electronic device including an integrated component with a substrate. An electrically conductive first layer region is arranged at the...
US-7,580,297 Readout of multi-level storage cells
A multi-level sensing scheme compares the state of a multi-level storage cell with monotonously changing reference states, which are associated to different...
US-7,579,909 Bypass circuit for radio-frequency amplifier stages
An amplifier circuit includes an amplifier and a phase shifter coupled in parallel to the amplifier and switchable such that the phase shifter has a first...
US-7,579,881 Write driver circuit
A write driver circuit comprising a first transistor comprising a first source/drain terminal coupled to a first output, a second source/drain terminal coupled...
US-7,579,815 Current controlling circuit arrangement and associated method for reducing crosstalk
A circuit arrangement and associated method for reducing crosstalk are disclosed. A load impedance is connected via a controlled current source to an input...
US-7,579,682 Power semiconductor module
A power semiconductor module has a ceramic substrate (9) which has on at least one side a patterned metallization (50) with a fineness of pattern of smaller than...
US-7,579,679 Chipcard with contact areas and method for producing contact areas
A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which...
US-7,579,675 Semiconductor device having surface mountable external contact areas and method for producing the same
A semiconductor device having surface-mountable external contact areas and a method for producing the same is disclosed. The surface-mountable external contacts...
US-7,579,268 Method of manufacturing an integrated circuit
A method of manufacturing an integrated circuit including a first isolated chip electrically and mechanically connected via wafer bonding to a second isolated...
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