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Patent # Description
US-9,509,350 Devices and methods for adaptive crest factor reduction in dynamic predistortion
A non-linear pre-distortion engine maintaining constant peak power at its output is disclosed. The engine includes a compression estimator, a crest factor...
US-9,509,346 Circuit and method for a circuit
A circuit comprises a transmitter to provide a transmit signal. The circuit also comprises a coupler element to receive the transmit signal at an input port, to...
US-9,509,284 Electronic circuit and method for operating a transistor arrangement
An electronic circuit includes a transistor arrangement with a plurality of transistor devices, each including a control node and a load path between a first...
US-9,509,228 Rectifier circuit with a voltage sensor
A rectifier circuit with a semiconductor element is disclosed. The semiconductor element includes at least one field effect transistor with a control electrode,...
US-9,508,812 Semiconductor device
A semiconductor device is provided that comprises a semiconductor substrate comprising an active area and a peripheral region adjacent the active area and...
US-9,508,790 Trench capacitors and methods of forming the same
A method of forming a semiconductor device includes forming an opening having a sidewall in a substrate and forming a first epitaxial layer in the opening. The...
US-9,508,788 Capacitors in integrated circuits and methods of fabrication thereof
In one embodiment, a capacitor includes a first row including a first capacitor element and a second capacitor element coupled in parallel, and a second row...
US-9,508,711 Semiconductor device with bipolar junction transistor cells
A semiconductor device includes a bipolar junction transistor cell including an emitter region which is at least partly formed between mesas of a semiconductor...
US-9,508,625 Semiconductor die package with multiple mounting configurations
A semiconductor die package includes first, second and third metal blocks insulated from one another. The first metal block has a thinner inner section, a first...
US-9,508,035 Smart card
In accordance with various embodiments, a smart card including one or more components to be supplied and a current source, which is configured to provide a...
US-9,507,398 Communication over identification line
In one example a method includes communicating, by a first device, with a second device via an identification (ID) line of a universal serial bus (USB) cable. A...
US-9,507,013 Method, device and system for processing radar signals
An embodiment relates to a method for processing radar signals. The radar signals may include digitized data received by at least two radar antennas. The method...
US-9,507,005 Device and current sensor for providing information indicating a safe operation of the device of the current sensor
An example of a device comprises a signal generator to generate a signal causing a magnetic self test field for a magneto-resistive sensing element. A signal...
US-9,506,996 Apparatus and method for detecting an error in a measurement of a quantity
Embodiments relate to an apparatus comprising a first measurement bridge circuit. The first measurement bridge circuit comprises a first half bridge for...
US-9,504,143 Electrical circuit
An electrical circuit includes a first circuit part and a second circuit part. A first electrical potential is applicable to the first circuit part, wherein a...
US-9,503,823 Capacitive microphone with insulated conductive plate
A capacitive microphone may include a housing, a membrane, and a first backplate, wherein a first insulating layer may be disposed on a first side of the first...
US-9,503,121 Very high dynamic-range switched capacitor ADC with large input impedance for applications tolerating increased...
A modulator is configured to respond to input swings by providing a feedback voltage via a feedback path to compromise an increase in noise and distortion power...
US-9,502,981 Enhanced power factor correction
A power converter is described that includes a switch. The power converter may also include a controller that controls the switch. The controller may be...
US-9,502,980 Circuit and method for producing an average output inductor current indicator
In one implementation, a circuit for producing an average output inductor current indicator in a voltage converter is configured to start a counter when a high...
US-9,502,973 Buck converter with III-nitride switch for substantially increased input-to-output voltage ratio
According to one exemplary embodiment, a buck converter for converting a high voltage at an input of the buck converter to a low voltage at an output of the...
US-9,502,958 Automatic short LED detection for light emitting diode (LED) array load
During a start-up phase, each corresponding test current is delivered to a corresponding chain of loads of a plurality of chain of loads. Each chain of loads is...
US-9,502,468 Nonvolatile memory device having a gate coupled to resistors
A nonvolatile memory device having a first resistive element coupled between a common node and a bit line; a second resistive element coupled between the common...
US-9,502,421 Semiconductor device and method for fabricating a semiconductor device
A semiconductor device is disclosed. In one embodiment, the semiconductor device includes two different semiconductor materials. The two semiconductor materials...
US-9,502,401 Integrated circuit with first and second switching devices, half bridge circuit and method of manufacturing
An integrated circuit includes a first switching device including a first semiconductor region in a first section of a semiconductor portion and a second...
US-9,502,398 Composite device with integrated diode
There are disclosed herein various implementations of composite semiconductor devices. In one implementation, such a composite semiconductor device includes a...
US-9,502,395 Power semiconductor package having vertically stacked driver IC
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the...
US-9,502,338 Semiconductor package with switch node integrated heat spreader
In one implementation, a semiconductor package includes a patterned conductive carrier including partially etched segments. The semiconductor package also...
US-9,502,296 Preventing delamination and cracks in fabrication of group III-V devices
In an exemplary implementation, a method includes growing a III-Nitride body over a group IV substrate in a semiconductor wafer. The method includes forming at...
US-9,502,248 Methods for making a semiconductor chip device
According to various embodiments, a method may include: forming a first layer on a surface using a first lift-off process; forming a second layer over the first...
US-9,501,966 Gate driver with multiple slopes for plasma display panels
According to an exemplary embodiment, a driver circuit for generating a reset pulse of an output waveform includes a plurality of ramp paths, each ramp path...
US-9,501,075 Low-dropout voltage regulator
A low-dropout voltage regulator includes a power transistor configured to receive an input voltage and to provide a regulated output voltage at an output...
US-9,496,888 Asynchronous SAR ADC with binary scaled redundancy
Representative implementations of devices and techniques provide analog to digital conversion of time-discrete analog inputs. A redundant binary scaled...
US-9,496,872 Method for manufacturing a digital circuit and digital circuit
A method for manufacturing a digital circuit is described including forming a plurality of field effect transistor pairs, connecting the field effect...
US-9,496,867 Integrated hall-controlled switch devices
Embodiments relate to Hall-controlled switch devices. In an embodiment, a Hall switch and a load switch are integrated in a single integrated circuit device....
US-9,496,859 Circuit arrangement with a first semiconductor device and with a plurality of second semiconductor devices
A circuit arrangement includes a first semiconductor device having a load path and a number of second semiconductor devices. Each second semiconductor device...
US-9,496,824 Oscillator circuit
The disclosure provides an oscillator circuit for a voltage controlled oscillator. The oscillator circuit includes first and second coupled transmission lines,...
US-9,496,791 Multiphase buck converter with dynamic phase firing
Methods, devices, and circuits are disclosed for a multiphase buck converter with dynamic phase firing that moderates phase output current. In one example, a...
US-9,496,378 IGBT with buried emitter electrode
There are disclosed herein various implementations of an insulated gate bipolar transistor (IGBT) with buried emitter electrodes. Such an IGBT may include a...
US-9,496,364 Field effect semiconductor component and methods for operating and producing it
In accordance with one component, a power field effect transistor is proposed, including a substrate, a channel, a gate electrode, and a gate insulator. The...
US-9,496,351 Semiconductor chip arrangement
A method for processing a semiconductor carrier is provided, the method including: providing a semiconductor carrier including a doped substrate region and a...
US-9,496,346 Silicon carbide device and a method for forming a silicon carbide device
A silicon carbide device includes a silicon carbide substrate, an inorganic passivation layer structure and a molding material layer. The inorganic passivation...
US-9,496,339 Semiconductor device comprising trench structures
A semiconductor device includes a central portion and an edge termination portion outside the central portion. The central portion includes a transistor cell...
US-9,496,337 Method for producing a semiconductor device having a beveled edge termination
A method for producing a semiconductor device includes forming a trench that defines a closed loop in a semiconductor body and extends from a first surface into...
US-9,496,245 Semiconductor package with integrated semiconductor devices and passive component
According to one exemplary embodiment, a semiconductor package includes a substrate having lower and upper surfaces. The semiconductor package further includes...
US-9,496,237 Semiconductor device having solderable and bondable electrical contact pads
A semiconductor device includes a semiconductor chip and a plurality of electrical contact pads disposed on a main face of the semiconductor chip, wherein the...
US-9,496,228 Integrated circuit and method of manufacturing an integrated circuit
In various embodiments, an integrated circuit is provided. The integrated circuit may include a semiconductor chip and an electrically conductive composite...
US-9,496,205 Power semiconductor package
A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body,...
US-9,496,193 Semiconductor chip with structured sidewalls
A semiconductor chip includes a body having a frontside, a backside opposite the frontside, and sidewalls extending between the backside and frontside, at least...
US-9,496,168 Semiconductor package with via-coupled power transistors
In one implementation, a semiconductor package includes a carrier including first and second conductive segments, and first and second transistors attached...
US-9,495,317 Bus driver circuit with improved transition speed
A bus driver circuit may include a first and a second circuit node, wherein the first circuit node is operably coupled to a bus line, which causes a bus...
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