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Patent # Description
US-9,922,912 Package for die-bridge capacitor
In some examples, a device comprises a first leadframe segment, a second leadframe segment, and a first transistor, wherein the first transistor is electrically...
US-9,922,910 Functionalized interface structure
An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating...
US-9,922,904 Semiconductor device including lead frames with downset
A semiconductor device includes a planar first lead frame including a die pad, a semiconductor chip coupled to the die pad, and a second lead frame coupled to...
US-9,922,427 Time-of-flight camera with location sensor system
A time-of-flight (TOF) camera system includes a radiation source, a radiation detector, a location sensor system and a processor. The radiation source is...
US-9,918,367 Current source regulation
Current source regulation circuitry that is arranged in a loop with power supply circuitry and current source circuitry. The current source regulation circuitry...
US-9,917,575 Circuit comprising an accelerating element
A circuit includes a switching element with a first terminal, a second terminal and a control terminal. The circuit also includes an impedance network coupled...
US-9,916,278 Slave device for a serial synchronous full duplex bus system
A slave device for a serial synchronous full duplex bus system, which has a data input stage, a clock input stage, an interface logic, a synchronization delay...
US-9,912,385 Contactless circuit arrangement
Various embodiments provide a contactless circuit arrangement. The contactless circuit arrangement includes at least one antenna, an antenna tuning circuit...
US-9,912,341 Data conversion with redundant split-capacitor arrangement
Representative implementations of devices and techniques provide analog to digital conversion of time-discrete analog inputs. A redundant split-capacitor...
US-9,912,241 System and method for a cascode switch
In some embodiments, a power system includes an integrated circuit (IC). The IC includes a first switching transistor having a load path coupled between a...
US-9,912,058 Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangement
According to one embodiment, a hybrid antenna is described comprising a plurality of windings wherein each winding comprises a loop antenna portion arranged in...
US-9,911,966 Battery cell
A battery cell having a first switching member switchable between a first position and a second position, wherein in the first position of the first switching...
US-9,911,946 Optoelectronic component, a method for manufacturing an optoelectronic component, and a method for processing a...
According to various embodiments, an optoelectronic component may be provided, the optoelectronic component including: an electrode structure disposed at least...
US-9,911,822 Method for manufacturing vertically integrated semiconductor device
A vertically integrated semiconductor device in accordance with various embodiments may include: a first semiconducting layer; a second semiconducting layer...
US-9,911,808 Method for forming a semiconductor device and a semiconductor device
A method for forming a semiconductor device includes incorporating first dopant atoms of a first conductivity type into a semiconductor substrate to form a...
US-9,911,731 Operational gallium nitride devices
A power circuit is described that includes a semiconductor body having a common substrate and a Gallium Nitride (GaN) based substrate. The GaN based substrate...
US-9,911,720 Power switch packaging with pre-formed electrical connections for connecting inductor to one or more transistors
In some examples, device includes an integrated circuit (IC) inside a first insulating layer, an inductor, and a second insulating layer arranged between the...
US-9,911,686 Source down semiconductor devices and methods of formation thereof
A method for forming a semiconductor device includes forming device regions in a semiconductor substrate having a first side and a second side. The device...
US-9,911,679 Semiconductor package with integrated output inductor on a printed circuit board
A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding...
US-9,911,655 Method of dicing a wafer and semiconductor chip
A method of dicing a wafer may include forming a plurality of active regions in a wafer, each active region including at least one electronic component, the...
US-9,911,610 Semiconductor device having a metal-semiconductor junction and manufacturing therefor
A method for manufacturing a semiconductor device includes providing a wafer having a first semiconductor layer, forming at the first semiconductor layer a...
US-9,911,600 Fabrication of semiconductor device using alternating high and low temperature layers
A method for fabricating a III-nitride semiconductor body that includes high temperature and low temperature growth steps.
US-9,910,794 Processing data
A method for executing a program code is suggested, the method comprising: checking a memory access policy resource based on a trigger; and comparing a current...
US-9,910,145 Wireless communication system, a radar system and a method for determining a position information of an object
A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor...
US-9,910,133 Systems and methods for cascading radar chips having a low leakage buffer
A cascaded radar sensor arrangement is disclosed. The arrangement includes a first buffer and a second buffer. The first buffer is within a first radar chip and...
US-9,903,816 Photonic crystal sensor structure and a method for manufacturing the same
A sensor and methods of making a sensor are disclosed. The sensor may include a substrate, an optical source, an optical detector, a plurality of optical...
US-9,903,779 Sensor network supporting self-calibration of pressure sensors
A pressure sensor system comprises one or more self-calibrating pressure sensors for self-calibrating sensor parameters based on a membrane deflection or a...
US-9,903,766 Remote temperature sensing
An example method includes outputting, by a device, a first current through a temperature sensor that is that is external to the device; determining, by the...
US-9,903,741 Magnetic position sensor and sensing method
Embodiments of the present disclosure relate to a magnetic position sensor (100; 200). The magnetic position sensor (100; 200) includes a magnetic field source...
US-9,902,612 Method for forming a microelectromechanical device
A method for forming a microelectromechanical device may provide forming a first layer at least one of in or over a semiconductor carrier; forming a second...
US-9,899,930 Method and apparatus for phase alignment in semi-resonant power converters to avoid switching of power switches...
Each phase of a multi-phase voltage converter includes a power stage, passive circuit, synchronous rectification (SR) switch, and control circuit. Each passive...
US-9,899,377 Insulated gate semiconductor device with soft switching behavior
A semiconductor device and a method for producing thereof is provided. The semiconductor device includes a plurality of device cells, each comprising a body...
US-9,899,282 Robust high performance semiconductor package
A semiconductor package includes a suspended substrate having one or more semiconductor devices thereon, a metallic case covering the suspended substrate, the...
US-9,897,657 Method and apparatuses for determining a state of charge
Methods and apparatuses for determining a state of charge of a battery are provided, wherein measurements of a terminal voltage of the battery and stored...
US-9,897,504 System and method for a MEMS sensor
A measurement method includes generating, by a sensor, a response signal in response to an excitation signal. The method also includes generating a sampling...
US-9,896,329 Integrated semiconductor device and manufacturing method
The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a...
US-9,893,704 Circuit with an RC-filter
A circuit (290) comprises an RC filter circuit (100), which comprises an ohmic resistor (112) and a capacitor (113). In addition, the circuit (290) comprises a...
US-9,893,663 Safety circuit and brush holder for preventing fault conditions in an alternator
A fault protection circuit for an alternator is provided for preventing faults such as a prolonged full-field condition in the alternator. The fault protection...
US-9,893,618 Voltage regulator with fast feedback
In some examples, a voltage regulator comprises an amplifier stage and a pass element configured to receive an output of the amplifier stage and an output of a...
US-9,893,602 Switched-mode power converter with sampled feedback signal
In accordance with an embodiment, a method of operating a switched-mode power converter includes driving a switching element in successive drive cycles, in...
US-9,893,178 Semiconductor device having a channel separation trench
A semiconductor device includes a transistor formed in a semiconductor substrate having a main surface. The transistor includes a source region of a first...
US-9,893,175 Integrated circuit with a power transistor and a driver circuit integrated in a common semiconductor body
An integrated circuit includes a power transistor and a drive circuit. The drive circuit includes at least one drive transistor. The power transistor and the at...
US-9,893,158 Semiconductor device comprising a gradually increasing field dielectric layer and method of manufacturing a...
A semiconductor device is provided that includes a transistor in a semiconductor body having a main surface. The transistor includes a source region, a drain...
US-9,892,997 Adaptable molded leadframe package and related method
A semiconductor package includes at least one semiconductor device situated on a leadframe island, a first at least one lead protruding from a first side of the...
US-9,892,991 Connectable package extender for semiconductor device package
A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure...
US-9,892,851 DC-DC converter assembly, method of manufacturing a DC-DC converter assembly and method of manufacturing an...
A DC-DC converter assembly a power stage die of a DC-DC converter attached to a board, an output inductor attached to the board and electrically connected to an...
US-9,892,836 Rotary encoder with shielded magnet
A magnetic set-up for use in a rotary encoder is disclosed. The set-up includes a permanent magnet arrangement including at least one permanent magnet, which is...
US-9,892,765 Circuit for injecting compensating charge in a bias line
According to one embodiment, a circuit is described including a circuit component configured to switch from a first state into a second state including a node...
US-9,892,089 Arithmetic logical unit array, microprocessor, and method for driving an arithmetic logical unit array
In various embodiments an arithmetic logical unit array is provided, which may include: at least two data registers for storing data, a plurality of fixed...
US-9,891,917 System and method to increase lockstep core availability
A system and method for increasing lockstep core availability provides for writing a state of a main CPU core to a state buffer, executing one or more...
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