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Patent # Description
US-9,559,293 Integrated circuit including sensor having injection molded magnetic material
An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
US-9,559,238 Arrangement and method for determining the spatial direction of radiation incidence
The present disclosure relates to an optical receiver. The optical receiver has a first photosensor and a second photosensor disposed within a substrate. The...
US-9,559,204 Strained semiconductor device and method of making the same
In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate...
US-9,559,167 Semiconductor component with dynamic behavior
One embodiment provides a semiconductor component including a semiconductor body having a first side and a second side and a drift zone; a first semiconductor...
US-9,559,161 Patterned back-barrier for III-nitride semiconductor devices
A compound semiconductor device includes a III-nitride buffer and a III-nitride barrier on the III-nitride buffer. The III-nitride barrier has a different band...
US-9,559,108 Chip and an electronic device
A method for processing a carrier accordance with various embodiments may include: forming a structure over the carrier, the structure including at least two...
US-9,559,089 Semiconductor arrangement with active drift zone
A semiconductor device arrangement includes a semiconductor layer and at least one series circuit with a first semiconductor device and a plurality of n second...
US-9,559,078 Electronic component
An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip...
US-9,559,068 Wafer scale package for high power devices
A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper...
US-9,559,065 Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor...
A semiconductor arrangement includes upper and lower contact plates and basic chip assemblies. Each chip assembly has a semiconductor chip having a...
US-9,559,056 Electronic component
In an embodiment, an electronic component includes a dielectric core layer having a first major surface, a semiconductor die embedded in the dielectric core...
US-9,559,047 Passive component as thermal capacitance and heat sink
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board...
US-9,559,026 Semiconductor package having a multi-layered base
A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic case, a conductive base coupled to the...
US-9,559,020 Method for postdoping a semiconductor wafer
A method for treating a semiconductor wafer having a basic doping is disclosed. The method includes determining a doping concentration of the basic doping, and...
US-9,558,948 Laser thermal annealing of deep doped region using structured antireflective coating
A semiconductor body having a first surface is provided. A deep doped region of the semiconductor body is formed using masked ion implantation to implant dopant...
US-9,558,933 Method for forming a semiconductor device
A method for forming a semiconductor device includes carrying out an anodic oxidation of a surface region of a semiconductor substrate to form an oxide layer at...
US-9,558,797 Method and apparatus for controlling current in an array cell
A method and an apparatus for controlling current in an array cell is disclosed. The method includes applying a supply voltage to a first access point of a...
US-9,558,607 Relay attack prevention using RSSIPPLX
The disclosed invention relates to a passive keyless entry receiver system having an application controller that is activated upon receipt of an entire payload...
US-9,558,114 System and method to store data in an adjustably partitionable memory array
The disclosure relates to an electronic memory system, and more specifically, to a system for storing data in an adjustably partitionable memory array, and a...
US-9,557,799 Sensor interface systems and methods
A sensor interface system includes a system bus, a bus master and a sensor. The bus master is coupled to the system bus. The bus master is configured to provide...
US-9,557,763 Electronic circuit and method for providing a clock signal
According to an embodiment, an electronic circuit is described comprising a processing circuit, a power supply configured to supply power to the processing...
US-9,557,756 Bias drift compensation
Representative implementations of devices and techniques provide detection of a voltage drift of an electrical component or system. A detection circuit detects...
US-9,557,417 Sonic sensors and packages
Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one...
US-9,553,208 Current sensor device
A current sensor device for sensing a measuring current includes a semiconductor chip having a magnetic field sensitive element. The current sensor device...
US-9,553,183 Gate stack for normally-off compound semiconductor transistor
A normally-off compound semiconductor transistor includes a heterostructure body and a gate stack on the heterostructure body. The heterostructure body includes...
US-9,553,179 Semiconductor device and insulated gate bipolar transistor with barrier structure
A semiconductor device includes a semiconductor mesa which is formed between cell trench structures extending from a first surface into a semiconductor body....
US-9,553,178 Semiconductor component with an emitter control electrode
A semiconductor component includes a first emitter zone of a first conductivity type, a second emitter zone of a second conductivity type, a first base zone...
US-9,553,155 Semiconductor device and method
In an embodiment, a semiconductor device includes a High Electron Mobility Transistor (HEMT) including a floating gate. The floating gate includes two or more...
US-9,553,051 Electronic component
In an embodiment, an electronic component includes a dielectric layer having a first surface and a second surface, one or more semiconductor dies embedded in...
US-9,553,022 Method for use in manufacturing a semiconductor device die
In one embodiment, a wafer includes a number of die areas each including a semiconductor device and dedicated to become a separate die. The die areas are...
US-9,553,021 Method for processing a wafer and method for dicing a wafer
In various embodiments, a method for processing a wafer may include: providing a wafer having at least one die region and at least one metallization disposed...
US-9,553,016 Contacts for semiconductor devices and methods of forming thereof
A method for a method of forming a semiconductor device includes providing a semiconductor substrate having a bottom surface opposite a top surface with...
US-9,552,499 Circuit arrangement and method for safeguarding a circuit arrangement with respect to repeated light attacks
In various embodiments, a circuit arrangement is provided. The circuit arrangement may include a detection circuit, which is designed to detect light attacks on...
US-9,551,837 Silicon optical line multiplexer devices
Embodiments relate to silicon optical line multiplexers. In an embodiment, an optical line multiplexer includes at least one microprism etched from a silicon...
US-9,550,669 Vertical pressure sensitive structure
Embodiments related to pressure sensitive structures are described and depicted.
US-9,549,494 Method for populating circuit carriers
A set of circuit carriers includes a number of N.gtoreq.1 circuit carriers, each of which has an upper side, an underside opposite from the upper side, a...
US-9,548,737 Method for manufacturing a digital circuit and digital circuit
A method for manufacturing a digital circuit is described including forming a plurality of field effect transistor pairs, connecting the field effect...
US-9,548,710 Methods and circuitry to provide common mode transient immunity
Embodiments herein include a replica communication path and monitor circuit to provide increased common mode transient immunity. As its name suggests, the...
US-9,548,647 Low EMI driver circuit
A driver circuit, in accordance with one example, includes a controllable current source operably coupled to the load and configured to sink or source a first...
US-9,548,400 Method of controlling breakdown voltage of a diode having a semiconductor body
A diode includes a semiconductor body, a first emitter region of a first conductivity type, a second emitter region of a second conductivity type, a base region...
US-9,548,399 Junction field effect transistor cell with lateral channel region
A semiconductor device includes a junction field effect transistor cell with a top gate region, a lateral channel region and a buried gate region. The lateral...
US-9,548,370 Transistor device with integrated gate-resistor
A transistor device includes an individual transistor cell arranged in a transistor cell field on a semiconductor body, the individual transistor cell having a...
US-9,548,295 System and method for an integrated circuit having transistor segments
In accordance with an embodiment, an integrated circuit has a first transistor made of a plurality of first transistor segments disposed in a well area, and a...
US-9,548,293 III-nitride based ESD protection device
An ESD (electrostatic discharge) protection device includes a first III-nitride p-i-n diode and a second III-nitride p-i-n diode connected to the first...
US-9,548,248 Method of processing a substrate and a method of processing a wafer
According to various embodiments, a method of processing a substrate may include: forming a plurality of trenches into a substrate between two chip structures...
US-9,548,247 Methods for producing semiconductor devices
A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first...
US-9,547,069 Automotive radar transmitter architecture
One embodiment of the present invention relates to a transmitter within a single integrated chip substrate, which is capable of continuous beam steering of a...
US-9,546,923 Sensor structures, systems and methods with improved integration and optimized footprint
Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and...
US-9,544,971 Single LED short detection in multichannel LED
A method and circuit are described in which a maximum voltage is determined from among a plurality of series load voltages, where each series load voltage of...
US-9,543,997 System and method for a mixer
In accordance with an embodiment, a circuit includes a mixer having a signal input port, a local oscillator input port and an output port, a lowpass filter...
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