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Devices and methods for adaptive crest factor reduction in dynamic
A non-linear pre-distortion engine maintaining constant peak power at its output is disclosed. The engine includes a compression estimator, a crest factor...
Circuit and method for a circuit
A circuit comprises a transmitter to provide a transmit signal. The circuit also comprises a coupler element to receive the transmit signal at an input port, to...
Electronic circuit and method for operating a transistor arrangement
An electronic circuit includes a transistor arrangement with a plurality of transistor devices, each including a control node and a load path between a first...
Rectifier circuit with a voltage sensor
A rectifier circuit with a semiconductor element is disclosed. The semiconductor element includes at least one field effect transistor with a control electrode,...
A semiconductor device is provided that comprises a semiconductor substrate comprising an active area and a peripheral region adjacent the active area and...
Trench capacitors and methods of forming the same
A method of forming a semiconductor device includes forming an opening having a sidewall in a substrate and forming a first epitaxial layer in the opening. The...
Capacitors in integrated circuits and methods of fabrication thereof
In one embodiment, a capacitor includes a first row including a first capacitor element and a second capacitor element coupled in parallel, and a second row...
Semiconductor device with bipolar junction transistor cells
A semiconductor device includes a bipolar junction transistor cell including an emitter region which is at least partly formed between mesas of a semiconductor...
Semiconductor die package with multiple mounting configurations
A semiconductor die package includes first, second and third metal blocks insulated from one another. The first metal block has a thinner inner section, a first...
In accordance with various embodiments, a smart card including one or more components to be supplied and a current source, which is configured to provide a...
Communication over identification line
In one example a method includes communicating, by a first device, with a second device via an identification (ID) line of a universal serial bus (USB) cable. A...
Method, device and system for processing radar signals
An embodiment relates to a method for processing radar signals. The radar signals may include digitized data received by at least two radar antennas. The method...
Device and current sensor for providing information indicating a safe
operation of the device of the current sensor
An example of a device comprises a signal generator to generate a signal causing a magnetic self test field for a magneto-resistive sensing element. A signal...
Apparatus and method for detecting an error in a measurement of a quantity
Embodiments relate to an apparatus comprising a first measurement bridge circuit. The first measurement bridge circuit comprises a first half bridge for...
An electrical circuit includes a first circuit part and a second circuit part. A first electrical potential is applicable to the first circuit part, wherein a...
Capacitive microphone with insulated conductive plate
A capacitive microphone may include a housing, a membrane, and a first backplate, wherein a first insulating layer may be disposed on a first side of the first...
Very high dynamic-range switched capacitor ADC with large input impedance
for applications tolerating increased...
A modulator is configured to respond to input swings by providing a feedback voltage via a feedback path to compromise an increase in noise and distortion power...
Enhanced power factor correction
A power converter is described that includes a switch. The power converter may also include a controller that controls the switch. The controller may be...
Circuit and method for producing an average output inductor current
In one implementation, a circuit for producing an average output inductor current indicator in a voltage converter is configured to start a counter when a high...
Buck converter with III-nitride switch for substantially increased
input-to-output voltage ratio
According to one exemplary embodiment, a buck converter for converting a high voltage at an input of the buck converter to a low voltage at an output of the...
Automatic short LED detection for light emitting diode (LED) array load
During a start-up phase, each corresponding test current is delivered to a corresponding chain of loads of a plurality of chain of loads. Each chain of loads is...
Nonvolatile memory device having a gate coupled to resistors
A nonvolatile memory device having a first resistive element coupled between a common node and a bit line; a second resistive element coupled between the common...
Semiconductor device and method for fabricating a semiconductor device
A semiconductor device is disclosed. In one embodiment, the semiconductor device includes two different semiconductor materials. The two semiconductor materials...
Integrated circuit with first and second switching devices, half bridge
circuit and method of manufacturing
An integrated circuit includes a first switching device including a first semiconductor region in a first section of a semiconductor portion and a second...
Composite device with integrated diode
There are disclosed herein various implementations of composite semiconductor devices. In one implementation, such a composite semiconductor device includes a...
Power semiconductor package having vertically stacked driver IC
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the...
Semiconductor package with switch node integrated heat spreader
In one implementation, a semiconductor package includes a patterned conductive carrier including partially etched segments. The semiconductor package also...
Preventing delamination and cracks in fabrication of group III-V devices
In an exemplary implementation, a method includes growing a III-Nitride body over a group IV substrate in a semiconductor wafer. The method includes forming at...
Methods for making a semiconductor chip device
According to various embodiments, a method may include: forming a first layer on a surface using a first lift-off process; forming a second layer over the first...
Gate driver with multiple slopes for plasma display panels
According to an exemplary embodiment, a driver circuit for generating a reset pulse of an output waveform includes a plurality of ramp paths, each ramp path...
Low-dropout voltage regulator
A low-dropout voltage regulator includes a power transistor configured to receive an input voltage and to provide a regulated output voltage at an output...
Asynchronous SAR ADC with binary scaled redundancy
Representative implementations of devices and techniques provide analog to digital conversion of time-discrete analog inputs. A redundant binary scaled...
Method for manufacturing a digital circuit and digital circuit
A method for manufacturing a digital circuit is described including forming a plurality of field effect transistor pairs, connecting the field effect...
Integrated hall-controlled switch devices
Embodiments relate to Hall-controlled switch devices. In an embodiment, a Hall switch and a load switch are integrated in a single integrated circuit device....
Circuit arrangement with a first semiconductor device and with a plurality
of second semiconductor devices
A circuit arrangement includes a first semiconductor device having a load path and a number of second semiconductor devices. Each second semiconductor device...
The disclosure provides an oscillator circuit for a voltage controlled oscillator. The oscillator circuit includes first and second coupled transmission lines,...
Multiphase buck converter with dynamic phase firing
Methods, devices, and circuits are disclosed for a multiphase buck converter with dynamic phase firing that moderates phase output current. In one example, a...
IGBT with buried emitter electrode
There are disclosed herein various implementations of an insulated gate bipolar transistor (IGBT) with buried emitter electrodes. Such an IGBT may include a...
Field effect semiconductor component and methods for operating and
In accordance with one component, a power field effect transistor is proposed, including a substrate, a channel, a gate electrode, and a gate insulator. The...
Semiconductor chip arrangement
A method for processing a semiconductor carrier is provided, the method including: providing a semiconductor carrier including a doped substrate region and a...
Silicon carbide device and a method for forming a silicon carbide device
A silicon carbide device includes a silicon carbide substrate, an inorganic passivation layer structure and a molding material layer. The inorganic passivation...
Semiconductor device comprising trench structures
A semiconductor device includes a central portion and an edge termination portion outside the central portion. The central portion includes a transistor cell...
Method for producing a semiconductor device having a beveled edge
A method for producing a semiconductor device includes forming a trench that defines a closed loop in a semiconductor body and extends from a first surface into...
Semiconductor package with integrated semiconductor devices and passive
According to one exemplary embodiment, a semiconductor package includes a substrate having lower and upper surfaces. The semiconductor package further includes...
Semiconductor device having solderable and bondable electrical contact
A semiconductor device includes a semiconductor chip and a plurality of electrical contact pads disposed on a main face of the semiconductor chip, wherein the...
Integrated circuit and method of manufacturing an integrated circuit
In various embodiments, an integrated circuit is provided. The integrated circuit may include a semiconductor chip and an electrically conductive composite...
Power semiconductor package
A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body,...
Semiconductor chip with structured sidewalls
A semiconductor chip includes a body having a frontside, a backside opposite the frontside, and sidewalls extending between the backside and frontside, at least...
Semiconductor package with via-coupled power transistors
In one implementation, a semiconductor package includes a carrier including first and second conductive segments, and first and second transistors attached...
Bus driver circuit with improved transition speed
A bus driver circuit may include a first and a second circuit node, wherein the first circuit node is operably coupled to a bus line, which causes a bus...