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Electronic device including a component stack and connecting elements, and
connecting elements, and method for...
An electronic device includes a stack of electronic components and connecting elements. The component stack includes two components stacked one on top of another...
Semiconductor module with switching components and driver electronics
A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a...
Power semiconductor device connected in distinct layers of plastic
A power semiconductor device and a method for its production. The power semiconductor device has at least one power semiconductor chip, which has on its top side...
Power semiconductor circuit with busbar system
A power semiconductor circuit has a power semiconductor module (2) embodied as a flat assembly. A particularly compact and space-saving production of a power...
Device with a plurality of semiconductor chips
A device with a plurality of semiconductor chips is disclosed. One embodiment provides a substrate. A first semiconductor chip is mounted over the substrate. A...
Semiconductor devices having pFET with SiGe gate electrode and embedded
SiGe source/drain regions and methods...
In a method of making a semiconductor device, a first gate stack is formed on a substrate at a pFET region, which includes a first gate electrode material. The...
Electronic circuit for controlling a power field effect transistor
An electronic circuit and a method for controlling a power field effect transistor. The electronic circuit includes a power field effect transistor having a...
Integrated circuit including a semiconductor device
An integrated circuit including a semiconductor device is disclosed. One embodiment provides a load current component, having a multiplicity of trenches in a...
Semiconductor ESD device and method of making same
A semiconductor device includes an SCR ESD device region disposed within a semiconductor body, and a plurality of first device regions of the first conductivity...
System and method for anisotropically etching a recess in a silicon
A method and apparatus for anisotropically etching a recess in a silicon substrate is disclosed. Generally, a plasma is used for energetic excitation of a...
Singulating semiconductor wafers to form semiconductor chips
One aspect relates to a method for singulating semiconductor wafers to form semiconductor chips. A semiconductor wafer is provided with semiconductor chip...
Method of fabricating a power electronic device
An electronic device and method is disclosed. In one embodiment, a method includes providing an electrically insulating substrate. A first electrically...
Electronic device and method of manufacturing same
This application relates to a method of manufacturing an electronic device comprising placing a first chip on a carrier; applying an insulating layer over the...
System for separation of an electrically conductive connection
An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the...
Lithography masks and methods of manufacture thereof
Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method...
Apparatus and method for measuring local surface temperature of
An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a...
Sensor circuit for measuring a measuring quantity
A sensor circuit has a first input terminal, a second input terminal and an output terminal, a capacitive sensor connected between the first input terminal and...
Read-only memory having specially output circuits and word line connected
to a group of memory cells
A read-only memory having a multiplicity of memory cells whose contents can be read out with appropriate addressing by word, bit and source lines. The read-only...
Multiprocessor system having a shared tightly coupled memory and method
for communication between a plurality...
A multiprocessor system comprises a first processor (P1) and a second processor (P2) each having an input/output set up for the connection of a tightly coupled...
Allocating data between tones
A new protocol is proposed for transmission of data through lines such as telephone lines. The tones of a signal are associated into groups 10, 11, and tone...
Multiple mode sigma-delta modulator
Modulation circuits for operating in at least a first and second mode are described herein.
Processing signals of a capacitive feedforward filter
This disclosure relates to techniques and architecture for summing, sampling, and converting signals associated with a capacitive feedforward filter using a...
Clock control for data synchronization in varactor arrays
Implementations of varactor systems compare current data with immediately prior data to determine whether there has been a change in the data, and enable a clock...
A probe device for testing a semiconductor chip includes a substrate and a balun formed on the substrate. The balun includes first and second differential ports...
Semiconductor device having a semiconductor chip, and method for the
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the...
Semiconductor module having discrete components and method for producing
The invention relates to a semiconductor module comprising stacked discrete components and a method for producing the same. In one embodiment, the semiconductor...
Electronic component embedded within a plastic compound and including
copper columns within the plastic...
An electronic component has a first semiconductor chip and a second semiconductor chip that is arranged on a plastic compound in which the first semiconductor...
Lead frame with non-conductive connective bar
An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of...
Contact structure for FinFET device
In accordance with an embodiment, a FinFET device includes: one or more fins, a dummy fin, a gate line, a gate contact landing pad, and a gate contact element....
Capacitor structure in trench structures of semiconductor devices and
semiconductor devices comprising...
A capacitor structure includes: a number of conductive regions of metallic and/or semiconducting materials and/or conductive metal compounds thereof, the...
Capacitor integrated in a structure surrounding a die
An integrated circuit comprises a chip including a circuit area surrounded by a peripheral area, the peripheral area extending to an edge of the chip. The...
Method for producing a layer arrangement
The invention relates to a method for producing a layer arrangement. An electrically conductive layer is formed and patterned. A sacrificial layer formed on at...
Method for forming isolation structures
A trench is formed in the surface of a provided semiconductor body. An oxide is deposited in the trench and a cap is deposited on the oxide, wherein the...
Method for producing an integrated circuit assembly with an auxiliary
indentation, particularly with aligning...
A method is disclosed for producing an integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks, and an integrated circuit...
Metrology systems and methods for lithography processes
Metrology systems and methods for lithography processes are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a...
Apparatus and method for connecting a component with a substrate
An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the...
Sensor device including two sensors embedded in a mold material
A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable....
Set of integrated capacitor arrangements, especially integrated grid
A set of integrated capacitor arrangements is presented, each of which has a circuitry-effective main capacitor and a connectable correction capacitor. Each...
System and method for scheduling a multi-threaded processor
The invention relates to a device to be used with a scheduling method, and to a scheduling method, in particular a context scheduling method, comprising the...
Transmitter and transceiver, in particular for mobile radio, and
A receiver, in particular for mobile radio, includes a receiver branch with a mixer, downstream of an analog/digital converter. A reference generator generates a...
Method for transmitting data and data transmitter
A method is disclosed herein for transmitting data via a transmission path with at least two inductive transformers which respectively have a primary winding...
A mobile radio communication system, which has a communication network and at least one user terminal, which communication system has a memory apparatus which is...
Temperature compensated delta-sigma modulators with logarithmic dynamic
A delta sigma (.DELTA..SIGMA. or DS) modulator includes at least a first proportional to absolute temperature (PTAT) element that conditions an input signal, and...
Method for controlling an output voltage and voltage controller
A voltage controller for controlling an output voltage to a predetermined value. The voltage controller has a first terminal configured to connect a supply...
Voltage supply arrangement and method for production of electrical power
A voltage supply arrangement is proposed, which provides a voltage from a first power range in a first operating mode and from a second power range in a second...
Method and apparatus for providing a voltage to a circuit
One embodiment of the invention provides a circuit. The circuit includes a switching unit configured to connect or disconnect a voltage domain to a supply...
Power semiconductor arrangement
A power semiconductor arrangement is provided that includes a power semiconductor chip being electrically connected to a set of plug-like elements with at least...
Semiconductor component having maximized bonding areas of electrically
conductive members connected to...
A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and...
Embodiments provide an electronic device including a carrier defining a first major surface, a chip attached to the first major surface, an array of leads...
Integrated circuit including a semiconductor assembly in thin-SOI
An integrated circuit including a semiconductor assembly in thin-film SOI technology is disclosed. One embodiment provides a semiconductor assembly in thin-film...