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Patent # Description
US-7,800,237 Electronic device including a component stack and connecting elements, and connecting elements, and method for...
An electronic device includes a stack of electronic components and connecting elements. The component stack includes two components stacked one on top of another...
US-7,800,222 Semiconductor module with switching components and driver electronics
A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a...
US-7,800,217 Power semiconductor device connected in distinct layers of plastic
A power semiconductor device and a method for its production. The power semiconductor device has at least one power semiconductor chip, which has on its top side...
US-7,800,213 Power semiconductor circuit with busbar system
A power semiconductor circuit has a power semiconductor module (2) embodied as a flat assembly. A particularly compact and space-saving production of a power...
US-7,800,208 Device with a plurality of semiconductor chips
A device with a plurality of semiconductor chips is disclosed. One embodiment provides a substrate. A first semiconductor chip is mounted over the substrate. A...
US-7,800,182 Semiconductor devices having pFET with SiGe gate electrode and embedded SiGe source/drain regions and methods...
In a method of making a semiconductor device, a first gate stack is formed on a substrate at a pFET region, which includes a first gate electrode material. The...
US-7,800,176 Electronic circuit for controlling a power field effect transistor
An electronic circuit and a method for controlling a power field effect transistor. The electronic circuit includes a power field effect transistor having a...
US-7,800,171 Integrated circuit including a semiconductor device
An integrated circuit including a semiconductor device is disclosed. One embodiment provides a load current component, having a multiplicity of trenches in a...
US-7,800,128 Semiconductor ESD device and method of making same
A semiconductor device includes an SCR ESD device region disposed within a semiconductor body, and a plurality of first device regions of the first conductivity...
US-7,799,691 System and method for anisotropically etching a recess in a silicon substrate
A method and apparatus for anisotropically etching a recess in a silicon substrate is disclosed. Generally, a plasma is used for energetic excitation of a...
US-7,799,659 Singulating semiconductor wafers to form semiconductor chips
One aspect relates to a method for singulating semiconductor wafers to form semiconductor chips. A semiconductor wafer is provided with semiconductor chip...
US-7,799,614 Method of fabricating a power electronic device
An electronic device and method is disclosed. In one embodiment, a method includes providing an electrically insulating substrate. A first electrically...
US-7,799,601 Electronic device and method of manufacturing same
This application relates to a method of manufacturing an electronic device comprising placing a first chip on a carrier; applying an insulating layer over the...
US-7,799,583 System for separation of an electrically conductive connection
An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the...
US-7,799,486 Lithography masks and methods of manufacture thereof
Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method...
US-7,798,703 Apparatus and method for measuring local surface temperature of semiconductor device
An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a...
US-7,798,025 Sensor circuit for measuring a measuring quantity
A sensor circuit has a first input terminal, a second input terminal and an output terminal, a capacitive sensor connected between the first input terminal and...
US-RE41,734 Read-only memory having specially output circuits and word line connected to a group of memory cells
A read-only memory having a multiplicity of memory cells whose contents can be read out with appropriate addressing by word, bit and source lines. The read-only...
US-7,797,496 Multiprocessor system having a shared tightly coupled memory and method for communication between a plurality...
A multiprocessor system comprises a first processor (P1) and a second processor (P2) each having an input/output set up for the connection of a tightly coupled...
US-7,796,699 Allocating data between tones
A new protocol is proposed for transmission of data through lines such as telephone lines. The tones of a signal are associated into groups 10, 11, and tone...
US-7,796,072 Multiple mode sigma-delta modulator
Modulation circuits for operating in at least a first and second mode are described herein.
US-7,796,071 Processing signals of a capacitive feedforward filter
This disclosure relates to techniques and architecture for summing, sampling, and converting signals associated with a capacitive feedforward filter using a...
US-7,795,985 Clock control for data synchronization in varactor arrays
Implementations of varactor systems compare current data with immediately prior data to determine whether there has been a change in the data, and enable a clock...
US-7,795,889 Probe device
A probe device for testing a semiconductor chip includes a substrate and a balun formed on the substrate. The balun includes first and second differential ports...
US-7,795,742 Semiconductor device having a semiconductor chip, and method for the production thereof
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the...
US-7,795,727 Semiconductor module having discrete components and method for producing the same
The invention relates to a semiconductor module comprising stacked discrete components and a method for producing the same. In one embodiment, the semiconductor...
US-7,795,717 Electronic component embedded within a plastic compound and including copper columns within the plastic...
An electronic component has a first semiconductor chip and a second semiconductor chip that is arranged on a plastic compound in which the first semiconductor...
US-7,795,712 Lead frame with non-conductive connective bar
An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of...
US-7,795,669 Contact structure for FinFET device
In accordance with an embodiment, a FinFET device includes: one or more fins, a dummy fin, a gate line, a gate contact landing pad, and a gate contact element....
US-7,795,660 Capacitor structure in trench structures of semiconductor devices and semiconductor devices comprising...
A capacitor structure includes: a number of conductive regions of metallic and/or semiconducting materials and/or conductive metal compounds thereof, the...
US-7,795,615 Capacitor integrated in a structure surrounding a die
An integrated circuit comprises a chip including a circuit area surrounded by a peripheral area, the peripheral area extending to an edge of the chip. The...
US-7,795,135 Method for producing a layer arrangement
The invention relates to a method for producing a layer arrangement. An electrically conductive layer is formed and patterned. A sacrificial layer formed on at...
US-7,795,107 Method for forming isolation structures
A trench is formed in the surface of a provided semiconductor body. An oxide is deposited in the trench and a cap is deposited on the oxide, wherein the...
US-7,795,105 Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning...
A method is disclosed for producing an integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks, and an integrated circuit...
US-7,794,903 Metrology systems and methods for lithography processes
Metrology systems and methods for lithography processes are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a...
US-7,793,819 Apparatus and method for connecting a component with a substrate
An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the...
US-7,793,550 Sensor device including two sensors embedded in a mold material
A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable....
US-RE41,684 Set of integrated capacitor arrangements, especially integrated grid capacitors
A set of integrated capacitor arrangements is presented, each of which has a circuitry-effective main capacitor and a connectable correction capacitor. Each...
US-7,793,296 System and method for scheduling a multi-threaded processor
The invention relates to a device to be used with a scheduling method, and to a scheduling method, in particular a context scheduling method, comprising the...
US-7,792,504 Transmitter and transceiver, in particular for mobile radio, and transmission method
A receiver, in particular for mobile radio, includes a receiver branch with a mixer, downstream of an analog/digital converter. A reference generator generates a...
US-7,792,197 Method for transmitting data and data transmitter
A method is disclosed herein for transmitting data via a transmission path with at least two inductive transformers which respectively have a primary winding...
US-7,792,079 Communication system
A mobile radio communication system, which has a communication network and at least one user terminal, which communication system has a memory apparatus which is...
US-7,791,516 Temperature compensated delta-sigma modulators with logarithmic dynamic range
A delta sigma (.DELTA..SIGMA. or DS) modulator includes at least a first proportional to absolute temperature (PTAT) element that conditions an input signal, and...
US-7,791,405 Method for controlling an output voltage and voltage controller
A voltage controller for controlling an output voltage to a predetermined value. The voltage controller has a first terminal configured to connect a supply...
US-7,791,325 Voltage supply arrangement and method for production of electrical power
A voltage supply arrangement is proposed, which provides a voltage from a first power range in a first operating mode and from a second power range in a second...
US-7,791,224 Method and apparatus for providing a voltage to a circuit
One embodiment of the invention provides a circuit. The circuit includes a switching unit configured to connect or disconnect a voltage domain to a supply...
US-7,791,208 Power semiconductor arrangement
A power semiconductor arrangement is provided that includes a power semiconductor chip being electrically connected to a set of plug-like elements with at least...
US-7,791,182 Semiconductor component having maximized bonding areas of electrically conductive members connected to...
A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and...
US-7,791,177 Electronic device
Embodiments provide an electronic device including a carrier defining a first major surface, a chip attached to the first major surface, an array of leads...
US-7,791,139 Integrated circuit including a semiconductor assembly in thin-SOI technology
An integrated circuit including a semiconductor assembly in thin-film SOI technology is disclosed. One embodiment provides a semiconductor assembly in thin-film...
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