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Patent # Description
US-9,997,459 Semiconductor device having a barrier layer made of amorphous molybdenum nitride and method for producing such...
A semiconductor device includes a semiconductor body having a front face, a back face and an active zone at the front face. A front surface metallization layer...
US-9,997,443 Through vias and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor chip includes a device region disposed in or over a substrate, a doped region...
US-9,997,359 Semiconductor device with rear-side insert structure
A semiconductor device includes a semiconductor body and a rear side insertion structure. The semiconductor body has a first surface at a front side and a...
US-9,995,793 System and method for a built-in-self-test of a battery
According to an embodiment, a system includes a switching regulator and an electrochemical storage test circuit. The switching regulator is coupled to a power...
US-9,994,179 Circuit arrangements and a method for receiving information
A circuit arrangement is provided, the circuit arrangement including a receiver configured to receive signal information from a sensor circuit; a discharge...
US-9,991,832 Detecting brushfire in power systems
In some examples, a detection circuit is configured to detect a brushfire in a power system based on an electrical signal from the power system. The detection...
US-9,991,806 Voltage converter circuitry and methods implementing modulated feedback signal
Disclosed is a voltage converter and a method. The voltage converter includes: an input, an output, and a transformer including a primary winding and a...
US-9,991,791 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power converter includes measuring an input voltage of the switched-mode power...
US-9,991,609 Electrical connection module, semiconductor module and method for producing a semiconductor module
An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and...
US-9,991,377 Trench FET with ruggedness enhancement regions
According to an exemplary implementation, a field-effect transistor (FET) includes first and second gate trenches extending to a drift region of a first...
US-9,991,373 Semiconductor device
In an embodiment, a semiconductor device includes a substrate, a Group III nitride based transistor arranged on a front surface of the substrate, and a...
US-9,991,347 Semiconductor device having a cavity
A power semiconductor device includes a semiconductor substrate having a drift region, a gate electrode trench in the semiconductor substrate and a field...
US-9,991,340 Mechanical stress-decoupling in semiconductor device
According to a method in semiconductor device fabrication, a first trench and a second trench are concurrently etched in a semi-finished semiconductor device....
US-9,991,252 Semiconductor device comprising electrostatic discharge protection structure
A semiconductor device includes a semiconductor body having first and second opposing surfaces, a first isolation layer on the first surface of the...
US-9,991,183 Semiconductor component having inner and outer semiconductor component housings
A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component...
US-9,989,630 Structured-light based multipath cancellation in ToF imaging
Representative implementations of devices and techniques provide multipath interference cancelling for imaging devices and systems. In various implementations,...
US-9,989,574 System and method for short-circuit detection in load chains
An embodiment method for short-circuit detection includes determining a set of local reference voltages each associated with a respective load chain in a...
US-9,988,262 Temporary mechanical stabilization of semiconductor cavities
A method for fabricating an electronic device is disclosed. In one example, the method comprises providing a semiconductor wafer, forming a plurality of...
US-9,987,830 Method for processing a carrier and method for transferring a graphene layer
According to various embodiments, a method for processing a carrier may include: forming a layer structure over the carrier, the layer structure including a...
US-9,986,354 Pre-mold for a microphone assembly and method of producing the same
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially...
US-9,986,344 MEMS microphone with low pressure region between diaphragm and counter electrode
A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter...
US-9,985,639 Detection and mitigation of non-linearity of phase interpolator
Representative implementations of devices and techniques provide non-linearity detection and mitigation for a phase interpolator of a controlled oscillator...
US-9,985,126 Semiconductor device comprising a first gate electrode and a second gate electrode
A semiconductor device includes a transistor. The transistor includes a source region and a drain region disposed adjacent to a first main surface of a...
US-9,985,017 Semiconductor device comprising a clamping structure
Semiconductor device with a semiconductor body that includes a clamping structure including a pn junction diode and a Schottky junction diode serially connected...
US-9,984,930 Method for processing a carrier
A method for processing a carrier may include: forming a plurality of structure elements at least one of over and in a carrier, wherein at least two adjacent...
US-9,984,928 Method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Method for producing chip assemblies that include semiconductor chip arrangements, each semiconductor chip arrangement including a semiconductor chip having a...
US-9,984,927 Method and apparatus for separating semiconductor devices from a wafer
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor...
US-9,984,917 Semiconductor device with an interconnect and a method for manufacturing thereof
A method for manufacturing a semiconductor device in accordance with various embodiments may include: forming an opening in a first region of a semiconductor...
US-9,984,915 Semiconductor wafer and method for processing a semiconductor wafer
According to various embodiments, a semiconductor wafer may include: a semiconductor body including an integrated circuit structure; and at least one...
US-9,984,900 Semiconductor device including at least one element
A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element,...
US-9,984,897 Method for manufacturing a chip arrangement including a ceramic layer
A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the...
US-9,984,691 System for a transducer system with wakeup detection
According to embodiments described herein, a circuit includes an interface circuit configured to be coupled to a transducer and a detection circuit. The...
US-9,982,989 Angle sensors, systems and methods
Embodiments relate to magnetic field angle sensors, including off-axis and on-axis sensors. In an embodiment, a magnetic field angle sensor comprises two sensor...
US-9,981,844 Method of manufacturing semiconductor device with glass pieces
A source material, which is based on a glass, is arranged on a working surface of a mold substrate. The mold substrate is made of a single-crystalline material....
US-9,981,843 Chip package and a method of producing the same
A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of...
US-9,979,187 Power device with overvoltage arrester
An example power device includes a semiconductor chip and an arrester element configurable to, in response to a voltage across the arrester element being...
US-9,978,672 Transistor package with terminals coupled via chip carrier
A package comprising an at least partially electrically conductive chip carrier, a first transistor chip comprising a first connection terminal, a second...
US-9,978,406 Magnetic sensor device having a magneto-resistive structure that generates a vortex magnetization pattern
An embodiment relates to a magnetic sensor device, comprising a magneto-resistive structure. The magneto-resistive structure comprises a magnetic free layer...
US-9,974,190 System and method of providing a semiconductor carrier and redistribution structure
In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the...
US-9,974,187 Power in lead
Representative implementations of devices and techniques provide off-board power conversion. A power cable is arranged to distribute power from a power supply...
US-9,974,130 Driving several light sources
A device for driving several light sources is suggested comprising a shift register comprising at least two cells, wherein an output of each cell controls one...
US-9,973,860 System and method for an optical MEMS transducer
According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in...
US-9,973,835 Signal generator, a decoder, a method for generating a transmit signal and a method for determining speed data
A signal generator comprises a signal provider and a signal processing unit. The signal provider is configured to provide a sensor signal indicating a...
US-9,973,195 Local phase detection in realigned oscillator
Representative implementations of devices and techniques provide reduced jitter and local phase detection for a controlled oscillator. An edge of a reference...
US-9,973,094 Power converter and power conversion method
In accordance with an embodiment, a method includes disabling a first electronic switch connected in series with a primary winding of a transformer in a power...
US-9,973,093 Controller device for resonant mode power converter circuit
In some examples, a controller device for a resonant mode power converter circuit comprises a feed-forward pin configured to receive an input voltage signal of...
US-9,973,084 Switching voltage regulator input power estimation
An estimate of voltage regulator input power is provide by estimating output power of the voltage regulator based on output voltage and output current of the...
US-9,972,714 Semiconductor device with a termination mesa between a termination structure and a cell field of field...
A semiconductor device includes a cell field with a plurality of field electrode structures and cell mesas. The field electrode structures are arranged in...
US-9,972,704 Method for forming a semiconductor device and a semiconductor device
A method for forming a semiconductor device comprises implanting a defined dose of protons into a semiconductor substrate and tempering the semiconductor...
US-9,972,689 Semiconductor device having a surface with ripples
According to one embodiment of a semiconductor device, the semiconductor device includes a semiconductor substrate having a first surface, an insulation layer...
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