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Semiconductor component with surface mountable devices and method for
producing the same
A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on...
Integrated semiconductor diode arrangement and integrated semiconductor
An integrated semiconductor diode arrangement is provided. The arrangement includes an anode region and a cathode region that are formed in a semiconductor...
Field effect transistor with a heterostructure
A field effect transistor with a heterostructure includes a strained monocrystalline semiconductor layer formed on a carrier material, which has a relaxed...
Methods and apparatuses for timing analysis of electronics circuits
Methods and apparatuses for performing timing analyses of an electronic circuit are provided. Waveforms of signals in the circuit are determined, and timing...
Hardware control for changing the operating mode of a memory
Circuit arrangement having a memory unit which can be operated either in a low-power operating mode or in a normal-power operating mode. A setting unit sets the...
Apparatus and method for detecting a potential attack on a cryptographic
An apparatus for detecting a potential attack on a crypto-graphic calculation performing a calculation with at least one parameter includes first means for...
at least one self oscillating loop circuit which oscillates with a switching frequency (f.sub.s), wherein the self oscillating loop circuit (18, 19, 20)...
Allocation of signal-to-noise ratio margin in multi-carrier systems
Allocation of different signal-to-noise margins to different carriers in a multi-carrier system is described. A preferred embodiment comprises assigning...
Symmetric differential current sense amplifier
A reference current integrator and a sensed current integrator are coupled to form a differential sense amplifier. The differential sense amplifier is coupled to...
Semiconductor device and method for controlling a semiconductor device
Semiconductor devices and methods are disclosed wherein a switching element or a current path is coupled to a substrate, and wherein a further element is coupled...
Test structures, systems, and methods for semiconductor devices
Test structures, systems, and methods for semiconductor devices are disclosed. In one embodiment, a test structure for a semiconductor device includes a winding...
Semiconductor device with semiconductor device components embedded in a
A semiconductor device with semiconductor device components embedded in a plastics composition is disclosed. In one embodiment, organosilicon and organometallic...
Electronic device including a component stack and connecting elements, and
connecting elements, and method for...
An electronic device includes a stack of electronic components and connecting elements. The component stack includes two components stacked one on top of another...
Semiconductor module with switching components and driver electronics
A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a...
Power semiconductor device connected in distinct layers of plastic
A power semiconductor device and a method for its production. The power semiconductor device has at least one power semiconductor chip, which has on its top side...
Power semiconductor circuit with busbar system
A power semiconductor circuit has a power semiconductor module (2) embodied as a flat assembly. A particularly compact and space-saving production of a power...
Device with a plurality of semiconductor chips
A device with a plurality of semiconductor chips is disclosed. One embodiment provides a substrate. A first semiconductor chip is mounted over the substrate. A...
Semiconductor devices having pFET with SiGe gate electrode and embedded
SiGe source/drain regions and methods...
In a method of making a semiconductor device, a first gate stack is formed on a substrate at a pFET region, which includes a first gate electrode material. The...
Electronic circuit for controlling a power field effect transistor
An electronic circuit and a method for controlling a power field effect transistor. The electronic circuit includes a power field effect transistor having a...
Integrated circuit including a semiconductor device
An integrated circuit including a semiconductor device is disclosed. One embodiment provides a load current component, having a multiplicity of trenches in a...
Semiconductor ESD device and method of making same
A semiconductor device includes an SCR ESD device region disposed within a semiconductor body, and a plurality of first device regions of the first conductivity...
System and method for anisotropically etching a recess in a silicon
A method and apparatus for anisotropically etching a recess in a silicon substrate is disclosed. Generally, a plasma is used for energetic excitation of a...
Singulating semiconductor wafers to form semiconductor chips
One aspect relates to a method for singulating semiconductor wafers to form semiconductor chips. A semiconductor wafer is provided with semiconductor chip...
Method of fabricating a power electronic device
An electronic device and method is disclosed. In one embodiment, a method includes providing an electrically insulating substrate. A first electrically...
Electronic device and method of manufacturing same
This application relates to a method of manufacturing an electronic device comprising placing a first chip on a carrier; applying an insulating layer over the...
System for separation of an electrically conductive connection
An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the...
Lithography masks and methods of manufacture thereof
Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method...
Apparatus and method for measuring local surface temperature of
An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a...
Sensor circuit for measuring a measuring quantity
A sensor circuit has a first input terminal, a second input terminal and an output terminal, a capacitive sensor connected between the first input terminal and...
Read-only memory having specially output circuits and word line connected
to a group of memory cells
A read-only memory having a multiplicity of memory cells whose contents can be read out with appropriate addressing by word, bit and source lines. The read-only...
Multiprocessor system having a shared tightly coupled memory and method
for communication between a plurality...
A multiprocessor system comprises a first processor (P1) and a second processor (P2) each having an input/output set up for the connection of a tightly coupled...
Allocating data between tones
A new protocol is proposed for transmission of data through lines such as telephone lines. The tones of a signal are associated into groups 10, 11, and tone...
Multiple mode sigma-delta modulator
Modulation circuits for operating in at least a first and second mode are described herein.
Processing signals of a capacitive feedforward filter
This disclosure relates to techniques and architecture for summing, sampling, and converting signals associated with a capacitive feedforward filter using a...
Clock control for data synchronization in varactor arrays
Implementations of varactor systems compare current data with immediately prior data to determine whether there has been a change in the data, and enable a clock...
A probe device for testing a semiconductor chip includes a substrate and a balun formed on the substrate. The balun includes first and second differential ports...
Semiconductor device having a semiconductor chip, and method for the
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the...
Semiconductor module having discrete components and method for producing
The invention relates to a semiconductor module comprising stacked discrete components and a method for producing the same. In one embodiment, the semiconductor...
Electronic component embedded within a plastic compound and including
copper columns within the plastic...
An electronic component has a first semiconductor chip and a second semiconductor chip that is arranged on a plastic compound in which the first semiconductor...
Lead frame with non-conductive connective bar
An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of...
Contact structure for FinFET device
In accordance with an embodiment, a FinFET device includes: one or more fins, a dummy fin, a gate line, a gate contact landing pad, and a gate contact element....
Capacitor structure in trench structures of semiconductor devices and
semiconductor devices comprising...
A capacitor structure includes: a number of conductive regions of metallic and/or semiconducting materials and/or conductive metal compounds thereof, the...
Capacitor integrated in a structure surrounding a die
An integrated circuit comprises a chip including a circuit area surrounded by a peripheral area, the peripheral area extending to an edge of the chip. The...
Method for producing a layer arrangement
The invention relates to a method for producing a layer arrangement. An electrically conductive layer is formed and patterned. A sacrificial layer formed on at...
Method for forming isolation structures
A trench is formed in the surface of a provided semiconductor body. An oxide is deposited in the trench and a cap is deposited on the oxide, wherein the...
Method for producing an integrated circuit assembly with an auxiliary
indentation, particularly with aligning...
A method is disclosed for producing an integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks, and an integrated circuit...
Metrology systems and methods for lithography processes
Metrology systems and methods for lithography processes are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a...
Apparatus and method for connecting a component with a substrate
An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the...
Sensor device including two sensors embedded in a mold material
A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable....
Set of integrated capacitor arrangements, especially integrated grid
A set of integrated capacitor arrangements is presented, each of which has a circuitry-effective main capacitor and a connectable correction capacitor. Each...