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Calibration of optical line shortening measurements
A system and method of calibrating optical line shortening measurements, and lithography mask for same. The lithography mask comprises a plurality of gratings,...
Integrated circuit arrangement for current regulation
An integrated circuit arrangement for current regulation of an electromagnetic load, especially an electric motor, generator, solenoid valve, or the like, with a...
A multifunction RF circuit on a single semiconductor chip. The multifunction RF circuit includes a power amplifier circuit, a mixer circuit forming an integral...
Adjusting transmit power spectra of transceiver devices in a
A UPBO is performed based on an attenuation of a first VDSL-cable connecting a first VDSL-CPE and a first VDSL-CO, and also based on an attenuation or electrical...
Method and device for estimating a frequency in the acquisition of a
spread-spectrum code signal
In a method for estimating a frequency deviation between a received spread-spectrum code signal and a local frequency signal, the received spread-spectrum code...
Data link layer protocol unit
Each transport format contains control parameters according to which data are mapped from at least one logical channel onto at least one transport channel by a...
Integrated circuit and method for operating
An integrated circuit and a method for operating an integrated circuit is disclosed. One embodiment provides a semi-conductor component, an electronic system,...
Method and circuit arrangement configured for driving a
A method and circuit arrangement including driving a field effect controlled transistor. One embodiment provides a first load terminal, a second load terminal...
Method of biasing a magneto resistive sensor element
A method of biasing a magneto resistive sensor element includes providing at least one magneto resistive sensor element having a magnetic sensitivity along a...
Semiconductor component and apparatus for production of a semiconductor
A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment,...
A semiconductor device and method is disclosed. One embodiment provides a substrate and a first semiconductor chip applied over the substrate. A first...
Semiconductor component with high concentration doped zone embedded in
A semiconductor component has a first and a second contact-making region, and a semiconductor volume arranged between the first and the second contact-making...
A diode is disclosed. One embodiment provides a semiconductor body having a front and a back, opposite the front in a vertical direction of the semiconductor...
Radio frequency (RF) circuit placement in semiconductor devices
Semiconductor devices, methods of manufacturing thereof, and methods of arranging circuit components of an integrated circuit are disclosed. In one embodiment, a...
Fin interconnects for multigate FET circuit blocks
In an embodiment, an apparatus includes a first field effect transistor including a first source contact region, a first drain contact region and a first...
Drain-extended field effect transistor
A drain-extended field effect transistor includes a drain contact region and a drain extension region. The drain-extended field effect transistor further...
ESD protection element
According to one embodiment of the present invention, an ESD protection element for use in an electrical circuit is provided, including a plurality of diodes...
Methods of manufacturing semiconductor devices and structures thereof
Methods of manufacturing semiconductor devices and structures thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes...
Method of manufacturing a semiconductor package with a bump using a
A method of manufacturing a semiconductor package with a bump using a carrier. One embodiment provides forming a bump on a carrier. A gap is formed in the...
Electrical device with covering
The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated...
Communication in accordance with a master-slave communication protocol
A communication apparatus for communication according to a master-slave communication protocol is formed as a slave instance communicating with a master instance...
Demodulating a signal having multiple frequency bands
A method and an arrangement for processing a received signal which comprises phase-shift modulated or amplitude-quadrature modulated part-signals which are...
Circuit arrangement for overtemperature detection
The invention relates to a circuit arrangement for detecting the overtemperature of a semiconductor body. The arrangement comprises at least one field effect...
Semiconductor device with ESD protection
Semiconductor device having an amplifier. In one embodiment, the amplifier includes a first amplifier path including a first input and a second amplifier path...
Sampling error reduction in PWM-MASH converters
Techniques for reducing sampling error in electronic components are described herein.
Common mode control circuitry for multi-stage operational amplifiers
This disclosure relates to a common mode regulation in multi stage differential amplifiers.
Semiconductor device with compensation current
A semiconductor device is disclosed. In one embodiment, the semiconductor device includes a first resistor, a second resistor, and a transistor. The second...
Controlling a lamp ballast
A method and apparatus for providing electrical current to a lamp, detecting a power supply voltage outage, detecting a return of the power supply voltage,...
Layer between interfaces of different components in semiconductor devices
A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit...
Semiconductor chip package, semiconductor chip assembly, and method for
fabricating a device
A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one...
Method for manufacturing an electronic component and corresponding
The invention pertains to a method for manufacturing an electronic component with a semiconductor element (1) that is contacted and fixed on a substrate surface...
Integrated circuit having a semiconductor arrangement
An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment...
Bipolar transistor FINFET technology
This document discusses, among other things, apparatus having at least one CMOS transistor overlying a substrate; and at least one finned bipolar transistor...
Method of producing a semiconductor element in a substrate
A method of producing a semiconductor element in a substrate includes forming a plurality of micro-cavities in a substrate, creating an amorphization of the...
Semiconductor device and method for forming same
A semiconductor device and method. One embodiments provides a semiconductor substrate having a trench with a sidewall isolation comprising a first isolating...
Semiconductor device including a pressure sensor
A semiconductor device includes a first cavity within a semiconductor substrate and a second cavity within the semiconductor substrate. The second cavity is open...
Method for modular multiplication
In a method for modular multiplication using a multiplication look-ahead process for computing a multiplication shift value and a reduction look-ahead process...
Mixer arrangement, use of the mixer arrangement and method for frequency
A mixer arrangement includes a mixer cell coupled by a signal input to a mixer input, and is embodied for frequency conversion of a signal present on the input...
Radio-frequency IC for a mobile radio transmitter
A radio-frequency IC (3) for a mobile radio transmitter (1) has an analogue/digital converter unit (5) for digitizing baseband signals (AB), a recovery unit (6,...
A matching network for matching an antenna to a transmitter or receiver comprises an input port for receiving high-frequency power, an output port and a...
Router and method for transmitting packets
The router of the invention comprises a routing table and an NAT table, which comprises an internet routing field for recording an address where a routing path...
Data transmission system, frame structure, and method for radio
transmission of data
A data transmission system transmits first data bursts from a base station to mobile stations. The first data bursts at least in some cases contain two or more...
Power dependent memory access
An apparatus and method of accessing a memory by determining available power, and accessing a number of bits of the memory in parallel, wherein the number of...
Modulator arrangement and method for signal modulation
A modulator arrangement includes a power amplifier which receives a carrier signal and has a current control input and a voltage supply input. The modulator...
A logic gate comprises a first switch, a second switch, a data network and a keeping circuitry. The first switch is adapted to connect a logic node to a first...
Output ripple control circuit and method for a PWM system
An output ripple control circuit and method for a PWM system uses a hysteresis threshold to clamp the output ripple of the PWM system such that the output ripple...
Semiconductor device with a plastic housing composition that includes
filler particles and that at least...
A semiconductor device with plastic housing composition includes an internal wiring that is electrically insulated from the plastic housing composition by an...
A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back...
Edge termination structure for semiconductor components
A semiconductor component has a drift path (4) in a semiconductor body (5) of a semiconductor chip (6). The semiconductor component has an edge area (7) and a...
Semiconductor component arrangement having a component with a drift zone
and a drift control zone
Disclosed is a semiconductor including a component having a drift zone and a drift control zone. A first connection zone is adjacent to the drift zone and is...