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Patent # Description
US-7,923,823 Semiconductor device with parylene coating
A method for producing semiconductor chips has the following steps for this purpose: firstly, a semiconductor wafer having a multiplicity of semiconductor chip...
US-7,923,772 Semiconductor device with a semiconductor body and method for producing it
A semiconductor device with a semiconductor body and to a method for producing it. In one embodiment, the semiconductor body has first electrodes which contact...
US-7,923,365 Methods of forming field effect transistors having stress-inducing sidewall insulating spacers thereon
Methods of forming integrated circuit devices include forming a field effect transistor having a gate electrode, a sacrificial spacer on a sidewall of the gate...
US-7,923,350 Method of manufacturing a semiconductor device including etching to etch stop regions
A method of manufacturing a semiconductor device. The method includes providing a wafer having a first face and a second face opposite the first face,...
US-7,923,342 Nonvolatile memory element and production method thereof and storage memory arrangement
A nonvolatile memory element and associated production methods and memory element arrangements are presented. The nonvolatile memory element has a changeover...
US-7,923,336 High-k dielectric film, method of forming the same and related semiconductor device
A high-k dielectric film, a method of forming the high-k dielectric film, and a method of forming a related semiconductor device are provided. The high-k...
US-7,923,330 Method for manufacturing a semiconductor device
A method for manufacturing a semiconductor device includes providing a semiconductor substrate including a first surface and a second surface which is arranged...
US-7,922,093 Semiconductor chips for TAG applications, devices for mounting the same, and mounting method
A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or...
US-7,921,148 Standard cell for arithmetic logic unit and chip card controller
A cell for an arithmetic logic unit includes a first input; a second input; a carry-in input; a first control input and a second control input; and a circuit...
US-7,920,660 Method and arrangement for removing DC offset from data symbols
To remove DC offset from received data symbols having cyclic prefixes in a data communication system, means (5) are provided for determining the location of the...
US-7,920,462 Amplitude attenuation estimation and recovery systems for OFDM signal used in communication systems
This disclosure relates to amplitude correction for orthogonal frequency division multiplexing signals received by a communication device. An amplitude...
US-7,920,090 Radar system
The invention provides a radar system comprising a power amplifier and a mixer, wherein the power amplifier and the mixer are integrated in a common...
US-7,919,868 Carrier substrate and integrated circuit
A carrier substrate comprising a through contact connecting a first contact field on a top face of the carrier substrate to a second contact field on a bottom...
US-7,919,857 Plastic housing and semiconductor component with said plastic housing
A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are...
US-7,919,854 Semiconductor module with two cooling surfaces and method
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a...
US-7,919,816 Electrostatic discharge protection element
A gate controlled fin resistance element for use as an electrostatic discharge (ESD) protection element in an electrical circuit has a fin structure having a...
US-7,919,363 Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production...
A semiconductor device includes a semiconductor chip. External connection pads and further pads are disposed over a surface of the semiconductor chip. Selected...
US-7,918,714 Methods for treating wafers on assembly carriers
A method and a device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the...
US-7,918,135 Pressure sensor including thermal selftest
A semiconductor device includes a diaphragm, a sensing element, and a circuit. The sensing element is configured to sense deflection of the diaphragm. The...
US-7,916,517 Circuit arrangement and method for recognizing manipulation attempts
A circuit arrangement having complementary data lines of a dual rail data bus, wherein in a regular operating phase the complementary data lines carry...
US-7,916,493 Power semiconductor module
A power semiconductor module has a controllable semiconductor chip (50), a first printed circuit board (1), a second printed circuit board (2), and also has one...
US-7,915,885 Sensor system and method
A sensing system includes a conductor with a current flow path therethrough. A first location of the conductor defines a first cross-sectional area and a second...
US-7,915,879 Switching converter including a rectifier element with nonlinear capacitance
A switching converter including a rectifier element with nonlinear capacitance. One embodiment provides a switching element configured to be driven in the on...
US-7,915,681 Transistor with reduced charge carrier mobility
A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier...
US-7,915,676 Integrated circuit
The invention relates to an integrated circuit having a semiconductor component (10) comprising a first p-type region (12) and a first n-type region (11)...
US-7,915,675 IGBT having one or more stacked zones formed within a second layer of the IGBT
An IGBT includes a first region, a second region located within the first region, a first contact coupled to the first region, a first layer arranged below the...
US-7,915,662 Integrated memory device having columns having multiple bit lines
A memory device using tunneling field effect transistors (TFET) and buried bit lines is presented. The memory device includes a matrix containing rows and...
US-7,915,132 Corresponding capacitor arrangement and method for making the same
The invention relates to a method for producing a capacitor arrangement, and to a corresponding capacitor arrangement, wherein the first insulating layer is...
US-7,915,089 Encapsulation method
A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated...
US-7,915,082 Semiconductor device
A method of fabricating a semiconductor device includes depositing a mask of low melting point material on a surface of the semiconductor device; depositing a...
US-7,912,667 Electrical circuit and method for testing electronic component
An electrical test circuit is disclosed. In one embodiment, the electrical test circuit includes a first input for receiving a test signal of an integrated...
US-7,912,430 Circuit arrangement for wirelessly exchanging data and RFID chip card device
A circuit arrangement for wirelessly exchanging data with a reader device, including an antenna for converting electromagnetic radiation into an antenna voltage,...
US-7,912,236 Sound transducer structure and method for manufacturing a sound transducer structure
For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material...
US-7,912,165 Digital receiver synchronization
A method is disclosed, including identifying a preamble in a frame, where the preamble has a preamble length 1. M data items received in succession are stored....
US-7,911,355 Apparatus for storing and wirelessly transmitting data
A data storing apparatus that wirelessly transmits data, wherein the apparatus is deformable so as to block wireless transmission of data when the apparatus is...
US-7,911,275 Constant gain control for multistage amplifiers
This disclosure relates to maintaining constant gain within multi-stage amplifiers.
US-7,911,260 Current control circuits
Circuit, system and method of current control circuits are disclosed. In one embodiment, a control circuit includes a first MOS transistor and a second MOS...
US-7,911,195 Electronic circuits and methods for starting up a bandgap reference circuit
An electronic circuit includes a bandgap reference circuit and a start-up circuit for starting up the bandgap reference circuit. The bandgap reference circuit...
US-7,911,193 Discontinuous conduction mode control circuit and method for synchronous converter
In a circuit, a high side driver control circuit outputs gating signals to a high side driver of a synchronous converter responsive to a pulse width modulated...
US-7,911,191 Drop-out voltage monitoring method and apparatus
A voltage regulator has a device for regulating an output voltage, having an input to receive an input voltage and an output to deliver an output voltage of a...
US-7,911,181 Auto-averaging RC time constant calibration
This disclosure relates to auto-averaging RC time constant calibration are described. An auto-averaging calibration circuit includes two capacitor branches,...
US-7,911,068 Component and method for producing a component
A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the...
US-7,911,061 Semiconductor device
A semiconductor device includes a carrier, a chip including a first face having a contact area, where the chip is attached to the carrier such that the contact...
US-7,911,041 Semiconductor device with gold coatings, and process for producing it
A semiconductor device (7) has gold coatings (1 to 5) which are applied to metallic or ceramic components (6) of the semiconductor device (7). The gold coatings...
US-7,911,039 Component arrangement comprising a carrier
A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the...
US-7,911,036 Semiconductor wafer with rear side identification and method
A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a...
US-7,910,983 MOS transistor having an increased gate-drain capacitance
A MOS transistor having an increased gate-drain capacitance is described. One embodiment provides a drift zone of a first conduction type. At least one...
US-7,910,952 Power semiconductor arrangement
One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve...
US-7,910,404 Method of manufacturing a stacked die module
A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first...
US-7,910,265 Reticle for use in a semiconductor lithographic system and method for modifying the same
A reticle for use in a semiconductor lithographic system includes at least two separated reticle parts. Each part includes a pattern to be transferred...
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