At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Capacitive sensor and measurement system
A system includes a capacitive sensor including a first electrode and a second electrode. The system includes a measurement system configured to sense a...
Integrated circuit arrangement
An integrated circuit arrangement has a signal input 20 and a signal output 60, a signal processing unit 100 which is connected to the signal input 20 and to the...
Semiconductor chip comprising a metal coating structure and associated
A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8)...
Semiconductor module with semiconductor chips and method for producing it
A semiconductor module has at least two semiconductor chips (4, 5) with at least one first and one second electrode (12, 13) on their first sides. Each...
Semiconductor device comprising a semiconductor chip stack and method for
producing the same
A semiconductor device includes a semiconductor chip stack having at least one lower semiconductor chip as a base of the semiconductor chip stack, and at least...
Electronic component and method for manufacturing an electronic component
An electronic component has at least two semiconductor devices, a contact clip and a leadframe with a device carrier portion and a plurality of leads. The...
Method for connecting a die assembly to a substrate in an integrated
circuit and a semiconductor device...
A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly....
Semiconductor device with near-surface compensation doping area and method
Aspects of the present invention include a semiconductor device and method. In a transition region of a semiconductor material region, a near-surface...
Integrated circuit arrangement comprising isolating trenches and a field
A memory circuit arrangement and a fabrication method are disclosed. The memory circuit arrangement has a memory cell area. The memory cell area contains memory...
Semiconductor device with a semiconductor body and method for its
A semiconductor device includes an active region with a vertical drift path of a first conduction type and with a near-surface lateral well of a second,...
Integrated circuit device with a semiconductor body and method for the
production of an integrated circuit device
An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a...
Semiconductor component having discontinuous drift zone control dielectric
arranged between drift zone and...
Semiconductor component including a drift region and a drift control region. One embodiment provides a drift zone and a drift control zone. A drift control zone...
A semiconductor field effect transistor can be used with RF signals in an amplifier circuit. The transistor includes a source region and a drain region with a...
Semiconductor device including a free wheeling diode
A semiconductor device and production method is disclosed. In one embodiment, the semiconductor device includes a first electrode and a second electrode, located...
Method of fabricating a semiconductor device including a pattern of line
A method of fabricating a semiconductor device including depositing a hardmask layer on a layer of the semiconductor device, selectively etching a pattern of...
Methods of forming electrical interconnects using electroless plating
techniques that inhibit void formation
Methods of forming electrical interconnects include forming a copper pattern on a semiconductor substrate and then forming an electrically insulating capping...
Wafer and a method for manufacturing a wafer
A wafer includes a wafer frontside and a region adjacent to the device surface, wherein the region includes vacancy-oxygen complexes and the wafer frontside...
Semiconductor device and method for manufacturing
A semiconductor and method for manufacturing a semiconductor device. In one embodiment the method includes providing a semiconductor substrate with a first...
A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact...
Logic circuit and method for calculating an encrypted result operand
A logic circuit for calculating an encrypted dual-rail result operand from encrypted dual-rail input operands according to a combination rule includes inputs for...
Method for data transmission and communication system
In one embodiment, a method for data transmission is provided comprising determining a set of frequency bands available for data transmission from a plurality of...
Method and circuit for differential clock pulse compensation between two
A differential clock pulse compensation is performed between the clock-pulse system (23) of a digital line-connected data interface and the asynchronous...
Protection arrangement for protecting a power semiconductor component
against overcurrent and overtemperature
A protection arrangement for a power semiconductor component made of a plurality of cells, in which a current sensor made of a current sense transistor and...
Apparatus and method for secure sensing
An apparatus including a sensor configured to sense a physical quantity, an actuator configured to manipulate the physical quantity in a predefined manner, and a...
System and method for regulating a power supply
In an embodiment, a method for controlling an output voltage of a power supply system is disclosed. The method includes regulating the power supply to a first...
Barrier layers for conductive features
Barrier layers for conductive features and methods of formation thereof are disclosed. A first barrier material is deposited on top surfaces of an insulating...
Leadframe, semiconductor package and support lead for bonding with
Leadframe for a semiconductor package and manufacturing from such leadframe including a plurality of connection leads supported in a frame. Die mounting plate is...
Semiconductor with active component and method for manufacture
A semiconductor with active component and method for manufacture. One embodiment provides a semiconductor component arrangement having an active semiconductor...
Lateral bipolar transistor with additional ESD implant
A semiconductor device (10) includes a semiconductor body (12) of a first conductivity type (e.g., p-type). A first doped region (14) of a second conductivity...
Component arrangement having an evaluation circuit for detecting wear on
A component arrangement having an evaluation circuit for detecting wear on connections is disclosed. The component arrangement has the following features: a...
Semiconductor having optimized insulation structure and process for
producing the semiconductor
A semiconductor having an optimized insulation structure which is simple and inexpensive to produce and can be made smaller than LOCOS insulation structures is...
Method of producing a semiconductor interconnect architecture including
generation of metal holes by via mutation
A reduction in the intersection of vias on the last layer ("VL") and holes in the last thin metal layer ("MLHOLE") can be achieved without degrading product...
Carrier arrangement with overvoltage protection
A carrier arrangement having a carrier configured to fix a semiconductor chip, contacts located on the carrier and configured to make contact with the...
Method for the planar joining of components of semiconductor devices and a
diffusion joining structure
A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear...
Conference communication system and method with notification
A conference communication system including a conference server which provides a conference for a first and a second communication terminal, a notification...
Monitor structure for monitoring a change of a memory content
A monitor structure for monitoring a change of a memory content in a memory field of a non-volatile memory comprising a reference transistor in the memory field...
Fluidic based variable capacitor for use in a fluidic electrostatic energy
One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive...
One embodiment relates to a control system. In one embodiment, a control system is configured to drive a load based on a set-point of the load, a measured load...
Integrated lateral short circuit for a beneficial modification of current
distribution structure for xMR...
The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device...
Jumpless phase modulation in a polar modulation environment
The present disclosure relates to circuits and methods for improving the performance of a polar modulator by maintaining the input to a phase modulator.
Circuit and method for detecting, whether a voltage difference between two
voltages is below a desired voltage...
A circuit for detecting, whether a voltage difference is below a desired voltage difference comprises a voltage shift resistor, a current provider and a...
Bridge driver circuit with integrated charge pump
Bridge driver circuit with integrated charge pump is disclosed. One embodiment provides a driving circuit section of a charge pump capacitor being formed with...
Integrated coolant circuit arrangement, operating method and production
An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is provided. At least one integrated electronic component is...
Power semiconductor component with plate capacitor structure
A power semiconductor component (1) contains a weakly doped drift zone (9), a drain zone (10) and a MOS structure (12) situated at the front side (2) of the...
Crack stop trenches
Structures and methods of forming crack stop trenches are disclosed. The method includes forming active regions disposed in cell regions of a substrate, the cell...
Method for fabrication of a capacitor, and a monolithically integrated
circuit comprising such a capacitor
A method for fabrication of a monolithically integrated SOI substrate capacitor has the steps of: forming an insulating trench, which reaches down to the...
Error detection device for an address decoder, and device for error
detection for an address decoder
An error detection device for an address decoder converting an input address to an associated output address out of a plurality of valid output addresses using a...
System-on-chip with master/slave debug interface
A System-on-Chip (SOC) integrated circuit (IC) debugging system includes a plurality of SOC ICs connected to a shared debug bus. One of the plurality of SOC ICs...
Efficient software download to configurable communication device
An efficient software download to a configurable communication device is disclosed herein. The method of efficiently downloading software begins with a step of...
Random number generation including skewness control
Random numbers can be generated in a statistically independent manner and with identical probability if the bits generated by a controlled bit generator are...