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Patent # Description
US-7,880,481 Capacitive sensor and measurement system
A system includes a capacitive sensor including a first electrode and a second electrode. The system includes a measurement system configured to sense a...
US-7,880,477 Integrated circuit arrangement
An integrated circuit arrangement has a signal input 20 and a signal output 60, a signal processing unit 100 which is connected to the signal input 20 and to the...
US-7,880,300 Semiconductor chip comprising a metal coating structure and associated production method
A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8)...
US-7,880,288 Semiconductor module with semiconductor chips and method for producing it
A semiconductor module has at least two semiconductor chips (4, 5) with at least one first and one second electrode (12, 13) on their first sides. Each...
US-7,880,285 Semiconductor device comprising a semiconductor chip stack and method for producing the same
A semiconductor device includes a semiconductor chip stack having at least one lower semiconductor chip as a base of the semiconductor chip stack, and at least...
US-7,880,280 Electronic component and method for manufacturing an electronic component
An electronic component has at least two semiconductor devices, a contact clip and a leadframe with a device carrier portion and a plurality of leads. The...
US-7,880,277 Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device...
A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly....
US-7,880,272 Semiconductor device with near-surface compensation doping area and method of fabricating
Aspects of the present invention include a semiconductor device and method. In a transition region of a semiconductor material region, a near-surface...
US-7,880,264 Integrated circuit arrangement comprising isolating trenches and a field effect transistor
A memory circuit arrangement and a fabrication method are disclosed. The memory circuit arrangement has a memory cell area. The memory cell area contains memory...
US-7,880,260 Semiconductor device with a semiconductor body and method for its production
A semiconductor device includes an active region with a vertical drift path of a first conduction type and with a near-surface lateral well of a second,...
US-7,880,226 Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a...
US-7,880,224 Semiconductor component having discontinuous drift zone control dielectric arranged between drift zone and...
Semiconductor component including a drift region and a drift control region. One embodiment provides a drift zone and a drift control zone. A drift control zone...
US-7,880,202 Modulated-Vt transistor
A semiconductor field effect transistor can be used with RF signals in an amplifier circuit. The transistor includes a source region and a drain region with a...
US-7,880,200 Semiconductor device including a free wheeling diode
A semiconductor device and production method is disclosed. In one embodiment, the semiconductor device includes a first electrode and a second electrode, located...
US-7,879,727 Method of fabricating a semiconductor device including a pattern of line segments
A method of fabricating a semiconductor device including depositing a hardmask layer on a layer of the semiconductor device, selectively etching a pattern of...
US-7,879,720 Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation
Methods of forming electrical interconnects include forming a copper pattern on a semiconductor substrate and then forming an electrically insulating capping...
US-7,879,699 Wafer and a method for manufacturing a wafer
A wafer includes a wafer frontside and a region adjacent to the device surface, wherein the region includes vacancy-oxygen complexes and the wafer frontside...
US-7,879,686 Semiconductor device and method for manufacturing
A semiconductor and method for manufacturing a semiconductor device. In one embodiment the method includes providing a semiconductor substrate with a first...
US-7,879,652 Semiconductor module
A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact...
US-7,876,893 Logic circuit and method for calculating an encrypted result operand
A logic circuit for calculating an encrypted dual-rail result operand from encrypted dual-rail input operands according to a combination rule includes inputs for...
US-7,876,843 Method for data transmission and communication system
In one embodiment, a method for data transmission is provided comprising determining a set of frequency bands available for data transmission from a plurality of...
US-7,876,720 Method and circuit for differential clock pulse compensation between two clock-pulse systems
A differential clock pulse compensation is performed between the clock-pulse system (23) of a digital line-connected data interface and the asynchronous...
US-7,876,545 Protection arrangement for protecting a power semiconductor component against overcurrent and overtemperature
A protection arrangement for a power semiconductor component made of a plurality of cells, in which a current sensor made of a current sense transistor and...
US-7,876,217 Apparatus and method for secure sensing
An apparatus including a sensor configured to sense a physical quantity, an actuator configured to manipulate the physical quantity in a predefined manner, and a...
US-7,876,079 System and method for regulating a power supply
In an embodiment, a method for controlling an output voltage of a power supply system is disclosed. The method includes regulating the power supply to a first...
US-7,875,977 Barrier layers for conductive features
Barrier layers for conductive features and methods of formation thereof are disclosed. A first barrier material is deposited on top surfaces of an insulating...
US-7,875,968 Leadframe, semiconductor package and support lead for bonding with groundwires
Leadframe for a semiconductor package and manufacturing from such leadframe including a plurality of connection leads supported in a frame. Die mounting plate is...
US-7,875,951 Semiconductor with active component and method for manufacture
A semiconductor with active component and method for manufacture. One embodiment provides a semiconductor component arrangement having an active semiconductor...
US-7,875,933 Lateral bipolar transistor with additional ESD implant
A semiconductor device (10) includes a semiconductor body (12) of a first conductivity type (e.g., p-type). A first doped region (14) of a second conductivity...
US-7,875,928 Component arrangement having an evaluation circuit for detecting wear on connections
A component arrangement having an evaluation circuit for detecting wear on connections is disclosed. The component arrangement has the following features: a...
US-7,875,560 Semiconductor having optimized insulation structure and process for producing the semiconductor
A semiconductor having an optimized insulation structure which is simple and inexpensive to produce and can be made smaller than LOCOS insulation structures is...
US-7,875,544 Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation
A reduction in the intersection of vias on the last layer ("VL") and holes in the last thin metal layer ("MLHOLE") can be achieved without degrading product...
US-7,874,491 Carrier arrangement with overvoltage protection
A carrier arrangement having a carrier configured to fix a semiconductor chip, contacts located on the carrier and configured to make contact with the...
US-7,874,475 Method for the planar joining of components of semiconductor devices and a diffusion joining structure
A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear...
US-7,873,379 Conference communication system and method with notification
A conference communication system including a conference server which provides a conference for a first and a second communication terminal, a notification...
US-7,872,914 Monitor structure for monitoring a change of a memory content
A monitor structure for monitoring a change of a memory content in a memory field of a non-volatile memory comprising a reference transistor in the memory field...
US-7,872,851 Fluidic based variable capacitor for use in a fluidic electrostatic energy harvester
One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive...
US-7,872,845 Control system
One embodiment relates to a control system. In one embodiment, a control system is configured to drive a load based on a set-point of the load, a measured load...
US-7,872,564 Integrated lateral short circuit for a beneficial modification of current distribution structure for xMR...
The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device...
US-7,872,545 Jumpless phase modulation in a polar modulation environment
The present disclosure relates to circuits and methods for improving the performance of a polar modulator by maintaining the input to a phase modulator.
US-7,872,518 Circuit and method for detecting, whether a voltage difference between two voltages is below a desired voltage...
A circuit for detecting, whether a voltage difference is below a desired voltage difference comprises a voltage shift resistor, a current provider and a...
US-7,872,433 Bridge driver circuit with integrated charge pump
Bridge driver circuit with integrated charge pump is disclosed. One embodiment provides a driving circuit section of a charge pump capacitor being formed with...
US-7,872,349 Integrated coolant circuit arrangement, operating method and production method
An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is provided. At least one integrated electronic component is...
US-7,872,300 Power semiconductor component with plate capacitor structure
A power semiconductor component (1) contains a weakly doped drift zone (9), a drain zone (10) and a MOS structure (12) situated at the front side (2) of the...
US-7,871,902 Crack stop trenches
Structures and methods of forming crack stop trenches are disclosed. The method includes forming active regions disposed in cell regions of a substrate, the cell...
US-7,871,881 Method for fabrication of a capacitor, and a monolithically integrated circuit comprising such a capacitor
A method for fabrication of a monolithically integrated SOI substrate capacitor has the steps of: forming an insulating trench, which reaches down to the...
US-7,870,473 Error detection device for an address decoder, and device for error detection for an address decoder
An error detection device for an address decoder converting an input address to an associated output address out of a plurality of valid output addresses using a...
US-7,870,455 System-on-chip with master/slave debug interface
A System-on-Chip (SOC) integrated circuit (IC) debugging system includes a plurality of SOC ICs connected to a shared debug bus. One of the plurality of SOC ICs...
US-7,870,233 Efficient software download to configurable communication device
An efficient software download to a configurable communication device is disclosed herein. The method of efficiently downloading software begins with a step of...
US-7,870,175 Random number generation including skewness control
Random numbers can be generated in a statistically independent manner and with identical probability if the bits generated by a controlled bit generator are...
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