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Pressure sensor including thermal selftest
A semiconductor device includes a diaphragm, a sensing element, and a circuit. The sensing element is configured to sense deflection of the diaphragm. The...
Circuit arrangement and method for recognizing manipulation attempts
A circuit arrangement having complementary data lines of a dual rail data bus, wherein in a regular operating phase the complementary data lines carry...
Power semiconductor module
A power semiconductor module has a controllable semiconductor chip (50), a first printed circuit board (1), a second printed circuit board (2), and also has one...
Sensor system and method
A sensing system includes a conductor with a current flow path therethrough. A first location of the conductor defines a first cross-sectional area and a second...
Switching converter including a rectifier element with nonlinear
A switching converter including a rectifier element with nonlinear capacitance. One embodiment provides a switching element configured to be driven in the on...
Transistor with reduced charge carrier mobility
A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier...
The invention relates to an integrated circuit having a semiconductor component (10) comprising a first p-type region (12) and a first n-type region (11)...
IGBT having one or more stacked zones formed within a second layer of the
An IGBT includes a first region, a second region located within the first region, a first contact coupled to the first region, a first layer arranged below the...
Integrated memory device having columns having multiple bit lines
A memory device using tunneling field effect transistors (TFET) and buried bit lines is presented. The memory device includes a matrix containing rows and...
Corresponding capacitor arrangement and method for making the same
The invention relates to a method for producing a capacitor arrangement, and to a corresponding capacitor arrangement, wherein the first insulating layer is...
A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated...
A method of fabricating a semiconductor device includes depositing a mask of low melting point material on a surface of the semiconductor device; depositing a...
Electrical circuit and method for testing electronic component
An electrical test circuit is disclosed. In one embodiment, the electrical test circuit includes a first input for receiving a test signal of an integrated...
Circuit arrangement for wirelessly exchanging data and RFID chip card
A circuit arrangement for wirelessly exchanging data with a reader device, including an antenna for converting electromagnetic radiation into an antenna voltage,...
Sound transducer structure and method for manufacturing a sound transducer
For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material...
Digital receiver synchronization
A method is disclosed, including identifying a preamble in a frame, where the preamble has a preamble length 1. M data items received in succession are stored....
Apparatus for storing and wirelessly transmitting data
A data storing apparatus that wirelessly transmits data, wherein the apparatus is deformable so as to block wireless transmission of data when the apparatus is...
Constant gain control for multistage amplifiers
This disclosure relates to maintaining constant gain within multi-stage amplifiers.
Current control circuits
Circuit, system and method of current control circuits are disclosed. In one embodiment, a control circuit includes a first MOS transistor and a second MOS...
Electronic circuits and methods for starting up a bandgap reference
An electronic circuit includes a bandgap reference circuit and a start-up circuit for starting up the bandgap reference circuit. The bandgap reference circuit...
Discontinuous conduction mode control circuit and method for synchronous
In a circuit, a high side driver control circuit outputs gating signals to a high side driver of a synchronous converter responsive to a pulse width modulated...
Drop-out voltage monitoring method and apparatus
A voltage regulator has a device for regulating an output voltage, having an input to receive an input voltage and an output to deliver an output voltage of a...
Auto-averaging RC time constant calibration
This disclosure relates to auto-averaging RC time constant calibration are described. An auto-averaging calibration circuit includes two capacitor branches,...
Component and method for producing a component
A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the...
A semiconductor device includes a carrier, a chip including a first face having a contact area, where the chip is attached to the carrier such that the contact...
Semiconductor device with gold coatings, and process for producing it
A semiconductor device (7) has gold coatings (1 to 5) which are applied to metallic or ceramic components (6) of the semiconductor device (7). The gold coatings...
Component arrangement comprising a carrier
A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the...
Semiconductor wafer with rear side identification and method
A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a...
MOS transistor having an increased gate-drain capacitance
A MOS transistor having an increased gate-drain capacitance is described. One embodiment provides a drift zone of a first conduction type. At least one...
Power semiconductor arrangement
One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve...
Method of manufacturing a stacked die module
A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first...
Reticle for use in a semiconductor lithographic system and method for
modifying the same
A reticle for use in a semiconductor lithographic system includes at least two separated reticle parts. Each part includes a pattern to be transferred...
Method of making an integrated circuit including electrodeposition of
A method of making an integrated circuit including a composition of matter for electrodepositing of chromium is disclosed. One embodiment provides a bath having...
Modular exponentiation with randomized exponent
For the determination of a result of a modular exponentiation, a randomization auxiliary number is employed for the randomization of the exponent on the basis of...
Radio frequency module
A description is given of a radio frequency module comprising an interface unit configured to receive macros having a first format from an input of the radio...
Apparatus and method for controlling the power consumption of a combined
UMTS/GSM/EDGE radio station
A mobile station has an apparatus by means of which the power consumption of the mobile station is controlled. The apparatus has a monitoring unit which is...
Method and apparatus for protecting an RSA calculation on an output by
means of the chinese remainder theorem
An apparatus for protecting an RSA calculation of an output based on input values by means of the Chinese remainder theorem, the apparatus comprising for a first...
Devices and methods for converting or buffering a voltage
Embodiments of the invention relate to devices and methods for converting or buffering a voltage including an inductor configured to perform at least a primary...
Overload protection for a circuit arrangement having a transistor
A drive circuit for a transistor and a method for driving a transistor are described.
Circuit and method for integrating a voltage signal
A circuit arrangement having a signal input configured to be supplied with a voltage signal; a first operational transconductance amplifier (OTA) having a...
A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart...
Semiconductor device with capacitor arrangement electrically coupled to
One or more embodiments relate to a semiconductor device, comprising: a inductor coil including a winding; and a capacitor arrangement including at least one...
Semiconductor element and a method for producing the same
Some embodiments comprise a plurality of fins, wherein at least a first fin of the plurality of fins comprises a different fin width compared to a fin width of...
Method of controlled low-k via etch for Cu interconnections
An interconnect stack and a method of manufacturing the same wherein the interconnect has vertical sidewall vias. The interconnect stack includes a substrate, a...
Embedded software testing using a single output
An integrated circuit includes a processor and a circuit. The processor is configured to execute software. The software includes a plurality of software events....
Channel qualification and selection in a multichannel radio system by
packet error rate measurement
In a method for channel qualification and selection, an actual data packet length and a data packet error rate in a received data packet are determined, and are...
Starting circuit and method for the stable starting of a circuit
arrangement with plural feedback control circuits
In a method for starting a circuit arrangement an output signal of a circuit arrangement with interlinked feedback control circuits is utilized as a control...
According to one embodiment, a balun includes one or more transformers configured to block DC power between a line and a device at microwave frequencies. The one...
Semiconductor arrangement and method for producing a semiconductor
A semiconductor arrangement having at least one semiconductor chip, which has, on one surface, an integrated circuit and at least one contact element which is...
Electrodepositing a metal in integrated circuit applications
A method is described in which a contact hole (18) to an interconnect (14) in an insulating layer (16) is fabricated. A barrier layer (20) is subsequently...