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Power transistor and power semiconductor device
In a power semiconductor device, the vertically conducting power transistor has at its front side (11) a source zone (14) and a control input (16). A...
Integrated circuit with multi-stage matching circuit
An integrated circuit with a multi-stage matching circuit with an inductive conductive structure with a first end and a second end in the integrated circuit and...
Power semiconductor having a lightly doped drift and buffer layer
A power semiconductor element having a lightly doped drift and buffer layer is disclosed. One embodiment has, underneath and between deep well regions of a...
Support with solder ball elements and a method for populating substrates
with solder balls
A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball...
Stress optimization in dual embedded epitaxially grown semiconductor
Embodiments of the present disclosure provide stress optimization during manufacturing of dual embedded epitaxially grown (EPI) semiconductor structures using...
Method of making an integrated circuit including simplifying metal shapes
A method for simplifying metal shapes in an integrated circuit including receiving an incoming wire layout for at least one metal layer of an integrated...
Potential converter circuit
Embodiments of a potential converter circuit include a converter for converting a bipolar input signal to a unipolar output signal that only consumes current at...
Power switch circuit for driving an airbag squib module
A power switch circuit for driving an airbag squib module has a power transistor, a pre-charge capacitance for storing a charge, a charging circuit and a...
Connection between a semiconductor housing and a base plate comprising a
passage opening for fastening to a...
A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor...
Singulated semiconductor package
A semiconductor device includes a singulated semiconductor package having a leadframe, a chip electrically coupled to the leadframe, encapsulating material...
Reduced free-charge carrier lifetime device
According to one embodiment, a semiconductor device comprises a body of a first conductivity type having a source region and a channel, the body being in...
Method of fabricating an integrated circuit with stress enhancement
A method of fabricating an integrated circuit including arranging a plurality of cells to form a desired floor plan of the integrated circuit, wherein each cell...
Manufacturing a semiconductor device via etching a semiconductor chip to a
A method of manufacturing a semiconductor device. The method includes providing a semiconductor chip including contact elements on a first face and a first...
Measurement structure in a standard cell for controlling process
parameters during manufacturing of an...
Implementations are presented herein that relate to a standard cell including a measuring structure for controlling process parameters during manufacture of an...
Receiver arrangement with AC coupling
A receiver arrangement with AC coupling is specified in which a filter arrangement (3) is provided in a baseband signal processing chain in a homodyne receiver...
Emulation of analog-to-digital converter characteristics
Described herein is a system and method of emulating characteristics of an output signal of a first analog-to-digital converter by a second analog-to-digital...
Analog to digital converter with digital filter
Disclosed herein are devices, methods, and techniques including analog to digital converters having at least one digital filter.
Programmable compensation network for operational amplifiers
Systems and methods for implementing a programmable network for a multimode conditionally stable operational amplifier are disclosed.
High-side switch arrangement
High-side switch arrangement having a switching transistor, the collector of which is connected to a battery connection of the high-side switch arrangement and...
Adaptive drive signal adjustment for bridge EMI control
An embodiment of the invention relates to a driver adapted to provide a drive signal with an adjustable waveform for an external bridge to control EMI. The...
Measuring bridge arrangement, method of testing a measuring bridge, test
arrangement for testing a measuring...
A measuring bridge arrangement has a measuring bridge with a first supply terminal and first and second measuring signal terminals. The measuring bridge...
Power electronic device
An electronic device and method is disclosed. In one embodiment, a method includes providing an electrically insulating substrate. A first electrically...
Method and layout of semiconductor device with reduced parasitics
An semiconductor device is disclosed. The device includes a semiconductor body, a layer of insulating material disposed over the semiconductor body, and a...
Integrated circuit device including a contactless integrated circuit inlay
Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit...
Pressure sensor including switchable sensor elements
A semiconductor device includes a first sensor element in a first branch of a Wheatstone bridge and a second sensor element in a second branch of the Wheatstone...
Method and apparatus for distributing random elements
Apparatus for distributing valid random elements, including at least a first module and a second module. The first module is connected to a provider of valid...
Diversity receiver with channel estimator
A diversity receiver includes a plurality of antennas to receive radio frequency signals. A plurality of receiver circuits are each coupled to a respective one...
Coil pair with carrier suppression
A coil pair having a transmission coil and a reception coil. The transmission coil is configured to transmit a transmission signal having a carrier. The...
On-chip test circuit for an embedded comparator
A semiconductor chip including an embedded comparator is provided with an on-chip test circuit for the comparator. The test circuit includes an analog input...
A sensor device has a sensor assembly with at least one sensor element, an additional sensor assembly having at least one additional sensor element, and a...
Magnetic sensor integrated circuit with test conductor
A magnetic sensor integrated circuit includes a plurality of magnetically sensitive elements, and at least one test conductor positioned adjacent to at least...
Semiconductor module for a switched-mode power supply and method for its
Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising...
Semiconductor device with parylene coating
A method for producing semiconductor chips has the following steps for this purpose: firstly, a semiconductor wafer having a multiplicity of semiconductor chip...
Semiconductor device with a semiconductor body and method for producing it
A semiconductor device with a semiconductor body and to a method for producing it. In one embodiment, the semiconductor body has first electrodes which contact...
Methods of forming field effect transistors having stress-inducing
sidewall insulating spacers thereon
Methods of forming integrated circuit devices include forming a field effect transistor having a gate electrode, a sacrificial spacer on a sidewall of the gate...
Method of manufacturing a semiconductor device including etching to etch
A method of manufacturing a semiconductor device. The method includes providing a wafer having a first face and a second face opposite the first face,...
Nonvolatile memory element and production method thereof and storage
A nonvolatile memory element and associated production methods and memory element arrangements are presented. The nonvolatile memory element has a changeover...
High-k dielectric film, method of forming the same and related
A high-k dielectric film, a method of forming the high-k dielectric film, and a method of forming a related semiconductor device are provided. The high-k...
Method for manufacturing a semiconductor device
A method for manufacturing a semiconductor device includes providing a semiconductor substrate including a first surface and a second surface which is arranged...
Semiconductor chips for TAG applications, devices for mounting the same,
and mounting method
A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or...
Standard cell for arithmetic logic unit and chip card controller
A cell for an arithmetic logic unit includes a first input; a second input; a carry-in input; a first control input and a second control input; and a circuit...
Method and arrangement for removing DC offset from data symbols
To remove DC offset from received data symbols having cyclic prefixes in a data communication system, means (5) are provided for determining the location of the...
Amplitude attenuation estimation and recovery systems for OFDM signal used
in communication systems
This disclosure relates to amplitude correction for orthogonal frequency division multiplexing signals received by a communication device. An amplitude...
The invention provides a radar system comprising a power amplifier and a mixer, wherein the power amplifier and the mixer are integrated in a common...
Carrier substrate and integrated circuit
A carrier substrate comprising a through contact connecting a first contact field on a top face of the carrier substrate to a second contact field on a bottom...
Plastic housing and semiconductor component with said plastic housing
A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are...
Semiconductor module with two cooling surfaces and method
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a...
Electrostatic discharge protection element
A gate controlled fin resistance element for use as an electrostatic discharge (ESD) protection element in an electrical circuit has a fin structure having a...
Integrated circuit with additional mini-pads connected by an under-bump
metallization and method for production...
A semiconductor device includes a semiconductor chip. External connection pads and further pads are disposed over a surface of the semiconductor chip. Selected...
Methods for treating wafers on assembly carriers
A method and a device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the...