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Patent # Description
US-9,627,196 Method for processing a carrier
According to various embodiments, a method for processing a carrier may include: co-depositing at least one metal from a first source and carbon from a second...
US-9,626,909 Organic light emitting diode driver
Disclosed are controllable drive circuits for powering an organic light emitting diode (OLED) or other electronic load. According to one implementation, a...
US-9,621,069 Rectifier with voltage detection and controllable output path
The rectifier includes two input paths configured to receive an alternating input voltage and two output paths configured to provide a direct output voltage. A...
US-9,621,058 Reducing switching losses associated with a synchronous rectification MOSFET
A synchronous rectifier is described that includes a transistor device that has a gate terminal, a source terminal, a drain terminal, and a field-plate...
US-9,621,045 Multiphase regulator with self-test
A multiphase regulator includes a plurality of output phases, each operable to deliver a phase current through a separate inductor to a load connected to the...
US-9,618,365 Angle sensor system having a magnetic sensor
An angle sensor device includes first and second magnet tracks, a sensor component, and a control unit. The first and second magnet tracks are fixed to a...
US-9,614,626 Millimeter-wave transmitter on a chip, method of calibration thereof and millimeter-wave power sensor on a chip
The present invention relates to a millimeter-wave transmitter on a chip comprising at least one transmit path coupleable to an oscillator, and an on-chip power...
US-9,614,473 Flux weakening AC motor control by voltage vector angle deflection
A method for controlling a three phase AC motor includes generating an operating point error signal based upon a difference between a reference operating point...
US-9,614,444 Dynamic voltage transition control in switched mode power converters
A switched mode power converter includes a power stage, a main compensator, and a voltage ramp circuit. The power stage is operable to output a voltage to a...
US-9,614,256 Lithium ion battery, integrated circuit and method of manufacturing a lithium ion battery
A lithium ion battery includes a first substrate having a first main surface, and a lid including a conductive cover element, the lid being attached to the...
US-9,614,065 Inhomogeneous power semiconductor devices
A power semiconductor device includes a power transistor including a plurality of transistor cells on a semiconductor die. At least some of the transistor cells...
US-9,614,064 Semiconductor device and integrated circuit
A semiconductor device includes a transistor in a semiconductor substrate having a main surface. The transistor includes a source region, a drain region, a body...
US-9,614,045 Method of processing a semiconductor device and chip package
In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer;...
US-9,614,044 Semiconductor device with current sensor
A semiconductor device includes a semiconductor body. The semiconductor body includes a load transistor part and a sensor transistor part. A first source region...
US-9,614,033 Semiconductor device including an isolation structure and method of manufacturing a semiconductor device
An embodiment of a semiconductor device comprises a first load terminal contact area at a first side of a semiconductor body. A second load terminal contact...
US-9,614,032 Semiconductor device, integrated circuit and method for manufacturing the semiconductor device
A semiconductor device comprises a transistor in a semiconductor body having a first main surface and a second main surface, the first main surface being...
US-9,613,930 Semiconductor device and method for manufacturing a semiconductor device
A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a...
US-9,613,885 Plastic cooler for semiconductor modules
A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a...
US-9,613,878 Carrier and a method for processing a carrier
According to various embodiments, a carrier may be provided, the carrier including: a hollow chamber spaced apart from a surface of the carrier; a trench...
US-9,613,848 Dielectric structures with negative taper and methods of formation thereof
A method for forming a dielectric structure includes forming an auxiliary layer over a substrate, and forming a hole within the auxiliary layer. A fill material...
US-9,613,812 Method for processing a carrier, a carrier, an electronic device and a lithographic mask
Various embodiments provide a method for processing a carrier, the method including changing the three-dimensional structure of a mask layer arranged over the...
US-9,613,805 Method for forming a semiconductor device
A method for forming a semiconductor device comprises forming an amorphous or polycrystalline semiconductor layer adjacently to at least one semiconductor...
US-9,613,804 Method of manufacturing semiconductor devices which allows reproducible thinning of a semiconductor body of the...
One embodiment describes a method of manufacturing a semiconductor device. Here, impurities are implanted into a semiconductor body via a first side of the...
US-9,612,608 Maximum power point tracker bypass
A circuit arrangement, includes output terminals that provide an output current and input terminals that receive a source current and a source voltage from a DC...
US-9,612,298 Magnetic field sensor having XMR elements in a full bridge circuit having diagonal elements sharing a same...
Embodiments of the present invention provide a magnetic field sensor. The magnetic field sensor includes at least four XMR elements connected in a full bridge...
US-9,612,279 System and method for determining operational robustness of a system on a chip
A system and method for determining operational robustness of a system on a chip (SoC) includes modifying one or more internal states of the SoC, during...
US-9,611,135 System and method for a differential comb drive MEMS
According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure...
US-9,610,543 Method for simultaneous structuring and chip singulation
A method for structuring a substrate and a structured substrate are disclosed. In an embodiment a method includes providing a substrate with a first main...
US-9,609,748 Semiconductor module comprising printed circuit board and method for producing a semiconductor module...
A semiconductor module includes a printed circuit board, a ceramic substrate and a semiconductor chip. The printed circuit board includes an insulating...
US-9,608,693 Signal transmission arrangement with a transformer and signal transmission method
A signal reception arrangement includes a receiver circuit having a receiver input configured to be coupled to a secondary winding of a transformer of a first...
US-9,608,645 Phase-lock loop
In one implementation an output signal of an oscillator is varied to be within a desired frequency band with respect to a reference signal, the output signal...
US-9,608,607 Speed booster for comparator
Representative implementations of devices and techniques provide a speed increase to a comparator circuit. An active clamp device may be positioned between an...
US-9,608,558 Calculation of MOSFET switch temperature in motor control
Systems and techniques are described for monitoring the operating temperature of one or more circuit elements, such as a metal oxide field effect transistor...
US-9,608,542 III-nitride power conversion circuit
According to an exemplary embodiment, a III-nitride power conversion circuit includes a gate driver having a plurality of cascaded inverters, each of the...
US-9,608,428 Distinguishing between overload and open load in off conditions
Techniques are described for determining whether a switch circuit experienced one of a latched overload condition and an open load with no input voltage...
US-9,608,305 System and method for a directional coupler with a combining circuit
A circuit includes a current sensing circuit comprising a current input terminal coupled to an input port, a current output terminal coupled to a transmitted...
US-9,608,201 Semiconductor devices having insulating substrates and methods of formation thereof
In one embodiment, a method of forming a current sensor device includes forming a device region comprising a magnetic sensor within and/or over a semiconductor...
US-9,608,128 Body of doped semiconductor material having scattering centers of non-doping atoms of foreign matter disposed...
A method for producing a body (1) consisting of doped semiconductor material having a defined mean free path length (lambda n) for free charge carriers (CP),...
US-9,608,102 Gallium nitride material devices and associated methods
Gallium nitride material devices and methods associated with the same. In some embodiments, the devices may be transistors which include a conductive structure...
US-9,608,092 Method of manufacturing a semiconductor device having a rectifying junction at the side wall of a trench
A method for forming a field-effect semiconductor device includes: providing a wafer having a main surface and a first semiconductor layer of a first...
US-9,608,082 Electro-mechanical switching devices
A switching device includes an opening disposed in a substrate. A source is disposed adjacent the opening and has a contact surface parallel to sidewalls of the...
US-9,608,075 III-nitride semiconductor device with doped epi structures
A compound semiconductor device includes a first III-nitride buffer layer doped with carbon and/or iron, a second III-nitride buffer layer above the first...
US-9,608,070 Semiconductor device comprising a field effect transistor and method of manufacturing the semiconductor device
A semiconductor device comprises a field effect transistor in a semiconductor substrate having a first main surface. The field effect transistor comprises a...
US-9,607,986 Mixed orientation semiconductor device and method
A method of making a semiconductor device begins with a semiconductor wafer that includes a first semiconductor layer overlying a second semiconductor layer. A...
US-9,607,966 Chip arrangement
A chip arrangement is provided. The chip arrangement includes: a first chip electrically connected to the first chip carrier top side; a second chip...
US-9,606,603 Digital sensor system
A digital sensor system includes a sensor element, an analog-to-digital converter coupled to the sensor element, and a wake-up circuit configured to activate...
US-9,606,568 Dynamically adapting device operations to handle changes in power quality
A system is described that includes a power bus, a power source configured to supply power to the power bus, and a device receiving at least some of the power...
US-9,606,197 XMR sensors with high shape anisotropy
Embodiments relate to xMR sensors having very high shape anisotropy. Embodiments also relate to novel structuring processes of xMR stacks to achieve very high...
US-9,606,196 Intelligent field shaping for magnetic speed sensors
The present disclosure provides for techniques to improve the sensitivity of magnetic sensor systems. One embodiment of a magnetic sensor system includes a...
US-9,606,194 Off-center angle measurement system
A method for measuring an angular position of a rotating shaft, the method including providing a magnetic field which rotates with the shaft about an axis of...
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