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Patent # Description
US-9,549,494 Method for populating circuit carriers
A set of circuit carriers includes a number of N.gtoreq.1 circuit carriers, each of which has an upper side, an underside opposite from the upper side, a...
US-9,548,737 Method for manufacturing a digital circuit and digital circuit
A method for manufacturing a digital circuit is described including forming a plurality of field effect transistor pairs, connecting the field effect...
US-9,548,710 Methods and circuitry to provide common mode transient immunity
Embodiments herein include a replica communication path and monitor circuit to provide increased common mode transient immunity. As its name suggests, the...
US-9,548,647 Low EMI driver circuit
A driver circuit, in accordance with one example, includes a controllable current source operably coupled to the load and configured to sink or source a first...
US-9,548,400 Method of controlling breakdown voltage of a diode having a semiconductor body
A diode includes a semiconductor body, a first emitter region of a first conductivity type, a second emitter region of a second conductivity type, a base region...
US-9,548,399 Junction field effect transistor cell with lateral channel region
A semiconductor device includes a junction field effect transistor cell with a top gate region, a lateral channel region and a buried gate region. The lateral...
US-9,548,370 Transistor device with integrated gate-resistor
A transistor device includes an individual transistor cell arranged in a transistor cell field on a semiconductor body, the individual transistor cell having a...
US-9,548,295 System and method for an integrated circuit having transistor segments
In accordance with an embodiment, an integrated circuit has a first transistor made of a plurality of first transistor segments disposed in a well area, and a...
US-9,548,293 III-nitride based ESD protection device
An ESD (electrostatic discharge) protection device includes a first III-nitride p-i-n diode and a second III-nitride p-i-n diode connected to the first...
US-9,548,248 Method of processing a substrate and a method of processing a wafer
According to various embodiments, a method of processing a substrate may include: forming a plurality of trenches into a substrate between two chip structures...
US-9,548,247 Methods for producing semiconductor devices
A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first...
US-9,547,069 Automotive radar transmitter architecture
One embodiment of the present invention relates to a transmitter within a single integrated chip substrate, which is capable of continuous beam steering of a...
US-9,546,923 Sensor structures, systems and methods with improved integration and optimized footprint
Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and...
US-9,544,971 Single LED short detection in multichannel LED
A method and circuit are described in which a maximum voltage is determined from among a plurality of series load voltages, where each series load voltage of...
US-9,543,997 System and method for a mixer
In accordance with an embodiment, a circuit includes a mixer having a signal input port, a local oscillator input port and an output port, a lowpass filter...
US-9,543,844 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes synchronously rectifying a current in a secondary side of the...
US-9,543,838 Phase fault detection in switching power converters
A switching power converter includes a phase operable to deliver a phase current to a load through an inductor. The phase current has an expected sawtooth or...
US-9,543,414 Method of forming a silicon-carbide device with a shielded gate
A silicon-carbide semiconductor substrate having a plurality of first doped regions being laterally spaced apart from one another and beneath a main surface,...
US-9,543,405 Method of manufacturing a reduced free-charge carrier lifetime semiconductor structure
A method of manufacturing a reduced free-charge carrier lifetime semiconductor structure includes forming a plurality of transistor gate structures in trenches...
US-9,543,398 Semiconductor switching device including charge storage structure
A semiconductor switching device includes a first load terminal electrically connected to source zones of transistor cells. The source zones form first pn...
US-9,543,389 Semiconductor device with recombination region
A semiconductor device includes a drift zone in a semiconductor body. A charge-carrier transfer region forms a pn junction with the drift zone in the...
US-9,543,386 Semiconductor device with field electrode structures, gate structures and auxiliary diode structures
A semiconductor device includes field electrode structures extending in a direction vertical to a first surface in a semiconductor body. Cell mesas are formed...
US-9,543,260 Segmented bond pads and methods of fabrication thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a first bond pad disposed at a first side of a substrate. The first...
US-9,543,208 Method of singulating semiconductor devices using isolation trenches
In accordance with an embodiment of the present invention, a method for forming a semiconductor device includes forming a device region in a substrate. The...
US-9,543,199 Long-term heat treated integrated circuit arrangements and methods for producing the same
An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment....
US-9,543,157 Method for processing a carrier, a method for operating a plasma processing chamber, and a method for...
According to various embodiments, a method for processing a carrier may include: performing a dry etch process in a processing chamber to remove a first...
US-9,541,932 Monitoring current in power switch devices
In one example, a method includes generating, by a main switching element of a device, a load current; generating, by a regulation loop of the device, a sense...
US-9,540,539 Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a...
A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including...
US-9,540,226 System and method for a MEMS transducer
According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter...
US-D776,071 Power semiconductor module
US-9,537,447 System and method for a voltage controlled oscillator
In accordance with an embodiment, a voltage controlled oscillator (VCO) includes a VCO core having a plurality of transistors, a bias resistor coupled between...
US-9,537,400 Switching converter with dead time between switching of switches
A device and method for operating a switching power converter are disclosed. In an embodiment a circuit includes a switching power converter having a half...
US-9,537,386 Driver controller with internally calculated average output current
Methods, devices, and integrated circuits are disclosed for a driver controller that internally calculates average output current. In one example, a method...
US-9,537,003 Semiconductor device with charge compensation
A semiconductor device includes a semiconductor body and a source metallization arranged on a first surface of the body. The body includes: a first...
US-9,536,999 Semiconductor device with control structure including buried portions and method of manufacturing
A semiconductor device includes transistor cells with source zones of a first conductivity type and body zones of a second conductivity type. The source and...
US-9,536,960 Semiconductor device comprising a field electrode
A semiconductor device includes a gate electrode adjacent to a body region in a semiconductor substrate. The semiconductor device further includes a field...
US-9,536,958 Semiconductor substrate and a method of manufacturing the same
The semiconductor substrate includes a high-ohmic semiconductor material with a conduction band edge and a valence band edge, separated by a bandgap, wherein...
US-9,536,953 Method for making a sensor device using a graphene layer
A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The...
US-9,536,918 Integrated circuit with cavity-based electrical insulation of a photodiode
An integrated circuit includes a semiconductor substrate, at least one photodiode, which is formed on a surface of the semiconductor substrate, at least one...
US-9,536,872 Shallow trench isolation area having buried capacitor
A semiconductor chip includes a substrate including a surface, an active transistor region and a substrate contact region formed on the substrate, a shallow...
US-9,536,851 Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for...
A preform structure for soldering a semiconductor chip arrangement includes a carbon fiber composite sheet and a solder layer formed over the carbon fiber...
US-9,536,838 Single crystal ingot, semiconductor wafer and method of manufacturing semiconductor wafers
An embodiment of a method of manufacturing semiconductor wafers comprises forming a notch or a flat in a semiconductor ingot extending along an axial direction....
US-9,536,816 Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric...
US-9,536,740 Increasing the doping efficiency during proton irradiation
A description is given of a method for doping a semiconductor body, and a semiconductor body produced by such a method. The method comprises irradiating the...
US-9,536,086 Circuit arrangement, a method for forming a circuit arrangement, and method for integrity checking
A circuit arrangement is provided, the circuit arrangement including a processor; a memory circuit connected to the processor, wherein the processor is...
US-9,536,075 Dynamic resource sharing
Representative implementations of devices and techniques provide dynamic secure sharing of resources. A resource module can be partitioned into a plurality of...
US-9,535,140 System and method for a transformer and a phase-shift network
In accordance with an embodiment, a circuit includes a magnetic transformer having a first winding coupled between a first signal node and a second signal node,...
US-9,534,932 XMR angle sensor arrangement with safety mechanism and method for monitoring the same
An XMR angle sensor arrangement with a safety mechanism comprises an XMR angle sensor having a sensing area for sensing an in-plane magnetic field and for...
US-9,533,874 Sensor module and semiconductor chip
A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface...
US-9,533,473 Chip card substrate and method of forming a chip card substrate
A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an...
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