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Patent # Description
US-8,017,438 Semiconductor module with at least two substrates
A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second...
US-8,016,941 Method and apparatus for manufacturing a semiconductor
A method and apparatus for crystallizing a semiconductor that includes a first layer having a first crystal lattice orientation and a second layer having a...
US-8,015,323 Acquisition of data and autonomous transfer of data through communication interface in automotive system
In an interface, a host device or controller configures a peripheral or remote device to send data back to the host device. The remote device is operatively...
US-8,014,786 Distributed micro instruction set processor architecture for high-efficiency signal processing
A wireless communication system hosts a plurality of processes in accordance with a communication protocol. The system includes application specific instruction...
US-8,014,748 Communication system having a communication device
A communication system is enclosed. In one embodiment, the communication system includes a communication device configured to puts itself into an activated...
US-8,014,738 Method and apparatus for optimizing output power levels in power amplifiers
Some embodiments discussed relate to an apparatus comprising a power amplifier module. The power amplifier module includes a plurality of sensors, and a first...
US-8,013,475 Reverse voltage protected integrated circuit arrangement for multiple supply lines
An integrated circuit arrangement includes a semiconductor body having a substrate and at least one substrate terminal. At least one semiconductor component is...
US-8,013,441 Power semiconductor device in lead frame employing connecting element with conductive film
One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device...
US-8,013,429 Air cavity package with copper heat sink and ceramic window frame
An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink...
US-8,013,364 Semiconductor devices and structures thereof
A structure having air gaps between interconnects is disclosed. A first insulating material is deposited over a workpiece, and a second insulating material...
US-8,013,340 Semiconductor device with semiconductor body and method for the production of a semiconductor device
A semiconductor device includes a semiconductor body with a front-sided surface. An active cell region with a semiconductor device structure and an edge region...
US-8,012,807 Method for producing chip packages, and chip package produced in this way
A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads...
US-8,011,319 Method for oxidizing a layer, and associated holding devices for a substrate
A holding device is presented in which a layer which is to be oxidized is processed, in a single-substrate process. The process temperature during the...
US-8,010,847 Memory repair
A memory chip having a memory with a plurality of non-redundant memory lines and a plurality of redundant memory lines, and a controller configured to allocate...
US-8,010,144 Computer-aided conference session having priority indication
A priority indication, which is used to prescribe at least one priority with which a conference session to which the at least one participant communication...
US-8,010,093 Communication network unit and method for exchanging capability information
A communication network unit having a memory for storing, for each communication terminal of a plurality of first communication terminals which are each...
US-8,009,481 System and method for bit-line control
In one embodiment, a bit-line driver has a first driver having a source terminal coupled to a high-voltage supply bus and a drain terminal coupled to the...
US-8,009,027 Contactless sensor systems and methods
A tire monitoring system and associated method is disclosed. The tire monitoring system includes a plurality of tire sensor modules, employing contactless...
US-8,008,907 Delay line calibration circuit comprising asynchronous arbiter element
A delay line calibration circuit is disclosed herein. The calibration circuit has an arbiter circuit having a unit for determining which of two signals that...
US-8,008,901 Regulated power supply with multiple regulators sharing the total current supplied to a load
Disclosed is a digital current sharing structure and method in which a plurality of regulators are configured to share the load current. Current share circuits...
US-8,008,750 Crack stops for semiconductor devices
Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier...
US-8,008,712 Metallization and its use in, in particular, an IGBT or a diode
The invention relates to a metallization for an IGBT or a diode. In the case of this metallization, a copper layer (10, 12) having a layer thickness of...
US-8,008,161 Capacitor assemblies
A method for fabricating a capacitor arrangement which includes at least three electrodes is described. The capacitor arrangement is fabricated using a number...
US-8,007,985 Semiconductor devices and methods of manufacturing thereof
Semiconductor devices and methods of manufacturing thereof are disclosed. A plurality of features is formed on a workpiece, the plurality of features being...
US-8,005,653 Modeller for a high-security system
A modeller for a system for determining a residual error probability. The modeller includes a component modeller, which is adapted to receive an error...
US-8,005,642 Predictive angular sensor readout
A sensor readout includes a selector circuit, a predictor circuit, and a select controller. The selector circuit receives a plurality of actual sensor inputs....
US-8,005,212 Device and method for performing a cryptoalgorithm
A device for executing a cryptoalgorithm including a central processing unit for a first sub-group of operations and for a flow control of the cryptoalgorithm...
US-8,004,918 Memory cell heating elements
The present disclosure relates to the heating of memory cells.
US-8,004,869 Memory circuit arrangement and method for the production thereof
A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different...
US-8,004,682 Methods and systems for analyzing a volume of gas
One embodiment relates to a method for determining a concentration of a molecular species of interest. In this method, electromagnetic radiation is transmitted...
US-8,004,442 Analog to digital converter (ADC) with comparator function for analog signals
This disclosure relates to analog to digital converter (ADC) component with a comparator function for analog signals.
US-8,004,372 MEMS resonator devices with a plurality of mass elements formed thereon
The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference,...
US-8,004,350 Impedance transformation with transistor circuits
An impedance transformation circuit utilizes two transistor circuits.
US-8,004,278 Techniques for electrically characterizing tunnel junction film stacks with little or no processing
Probes are electrically connected to a surface of a tunnel junction film stack comprising a free layer, a tunnel barrier, and a pinned layer. Resistances are...
US-8,004,258 Regulation of a current through an inductive load
A current regulator and a method for regulating current are described.
US-8,004,066 Crack stop and moisture barrier
A design for a crack stop and moisture barrier for a semiconductor device includes a plurality of discrete conductive features formed at the edge of an...
US-8,004,047 Semiconductor devices and methods of manufacture thereof
A first gate dielectric of a first transistor is disposed over a workpiece in a first region, and a second gate dielectric of a second transistor is disposed...
US-8,003,515 Device and manufacturing method
A description is given of a device, including a semiconductor chip, a first metal layer laterally extending over the semiconductor chip, the first metal layer...
US-8,003,502 Semiconductor device and fabrication method
A semiconductor device in one embodiment has a first connection region, a second connection region and a semiconductor volume arranged between the first and...
US-8,003,475 Method for fabricating a transistor structure
A method for fabricating a transistor structure with a first and a second bipolar transistor having different collector widths is presented. The method includes...
US-8,003,470 Strained semiconductor device and method of making the same
In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate...
US-8,003,458 Methods of manufacturing a semiconductor device with active regions of different heights
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a first transistor having a first...
US-8,003,456 Method for producing a semiconductor component
A method for producing a semiconductor component is proposed. The method includes providing a semiconductor body having a first surface; forming a mask on the...
US-8,003,448 Semiconductor package and method for producing the same
A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including...
US-8,003,305 Method for patterning a semiconductor wafer
A method for etching a pattern on a surface is disclosed. A mask layer is disposed over a surface and a resist is disposed over the mask layer. The resist is...
US-8,003,292 Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer
A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive...
US-7,999,629 IQ-modulation
The present disclosure relates to I/Q modulation circuits, devices, and methods.
US-7,999,619 Class AB output stage
The present disclosure relates to a class AB amplifier output stage.
US-7,999,559 Digital fault detection circuit and method
Digital fault detection circuit with an input circuit having input and output, wherein a first signal state at the input causes a predetermined signal state at...
US-7,999,362 Method and apparatus for making semiconductor devices including a foil
A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one...
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