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Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device or a substrate is described. The method includes providing a chip attached to a carrier or providing a...
Virtual machine interface for hardware reconfigurable and software
A virtual machine interface for a separate reconfigurable wireless network communication apparatus comprising a plurality of software objects, wherein each...
Apparatus, method and system for permanent storage of data
A plurality of first storage elements store data. A plurality of second storage elements store an error correcting code based on a data sub-string of the data....
Circuit arrangement and method of operating a circuit arrangement
A circuit arrangement is provided comprising a first partial circuit to receive a supply voltage, a second partial circuit to receive an output signal of the...
Data converter having a passive filter
Exemplary implementations of electrical circuits and systems are disclosed, and methods for signal processing including sampling and quantizing of amplitude and...
Measuring the current through a load transistor
The measurement of a current through a load transistor is described.
Arrangement including a semiconductor device and a connecting element
An integrated circuit and an arrangement including a semiconductor device and a connecting element and method for producing such an arrangement is disclosed....
Power semiconductor module including a multilayer substrate
A semiconductor module includes a multilayer substrate. The multilayer substrate includes a first metal layer and a first ceramic layer over the first metal...
Semiconductor device and method
A semiconductor device and method. One embodiment provides a semiconductor substrate having a plurality of cut regions. A metal layer is located within a cut...
A detector includes a first semiconductor substrate and a second substrate, wherein the first semiconductor substrate includes a detector element for detecting...
Transistor device and methods of manufacture thereof
Methods of forming transistor devices and structures thereof are disclosed. A first dielectric material is formed over a workpiece, and a second dielectric...
CMOS devices having stress-altering material lining the isolation trenches
and methods of manufacturing thereof
Semiconductor devices and methods of manufacturing thereof are disclosed. Isolation regions are formed that include a stress-altering material at least...
Semiconductor module with at least two substrates
A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second...
Method and apparatus for manufacturing a semiconductor
A method and apparatus for crystallizing a semiconductor that includes a first layer having a first crystal lattice orientation and a second layer having a...
Acquisition of data and autonomous transfer of data through communication
interface in automotive system
In an interface, a host device or controller configures a peripheral or remote device to send data back to the host device. The remote device is operatively...
Distributed micro instruction set processor architecture for
high-efficiency signal processing
A wireless communication system hosts a plurality of processes in accordance with a communication protocol. The system includes application specific instruction...
Communication system having a communication device
A communication system is enclosed. In one embodiment, the communication system includes a communication device configured to puts itself into an activated...
Method and apparatus for optimizing output power levels in power
Some embodiments discussed relate to an apparatus comprising a power amplifier module. The power amplifier module includes a plurality of sensors, and a first...
Reverse voltage protected integrated circuit arrangement for multiple
An integrated circuit arrangement includes a semiconductor body having a substrate and at least one substrate terminal. At least one semiconductor component is...
Power semiconductor device in lead frame employing connecting element with
One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device...
Air cavity package with copper heat sink and ceramic window frame
An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink...
Semiconductor devices and structures thereof
A structure having air gaps between interconnects is disclosed. A first insulating material is deposited over a workpiece, and a second insulating material...
Semiconductor device with semiconductor body and method for the production
of a semiconductor device
A semiconductor device includes a semiconductor body with a front-sided surface. An active cell region with a semiconductor device structure and an edge region...
Method for producing chip packages, and chip package produced in this way
A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads...
Method for oxidizing a layer, and associated holding devices for a
A holding device is presented in which a layer which is to be oxidized is processed, in a single-substrate process. The process temperature during the...
A memory chip having a memory with a plurality of non-redundant memory lines and a plurality of redundant memory lines, and a controller configured to allocate...
Computer-aided conference session having priority indication
A priority indication, which is used to prescribe at least one priority with which a conference session to which the at least one participant communication...
Communication network unit and method for exchanging capability
A communication network unit having a memory for storing, for each communication terminal of a plurality of first communication terminals which are each...
System and method for bit-line control
In one embodiment, a bit-line driver has a first driver having a source terminal coupled to a high-voltage supply bus and a drain terminal coupled to the...
Contactless sensor systems and methods
A tire monitoring system and associated method is disclosed. The tire monitoring system includes a plurality of tire sensor modules, employing contactless...
Delay line calibration circuit comprising asynchronous arbiter element
A delay line calibration circuit is disclosed herein. The calibration circuit has an arbiter circuit having a unit for determining which of two signals that...
Regulated power supply with multiple regulators sharing the total current
supplied to a load
Disclosed is a digital current sharing structure and method in which a plurality of regulators are configured to share the load current. Current share circuits...
Crack stops for semiconductor devices
Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier...
Metallization and its use in, in particular, an IGBT or a diode
The invention relates to a metallization for an IGBT or a diode. In the case of this metallization, a copper layer (10, 12) having a layer thickness of...
A method for fabricating a capacitor arrangement which includes at least three electrodes is described. The capacitor arrangement is fabricated using a number...
Semiconductor devices and methods of manufacturing thereof
Semiconductor devices and methods of manufacturing thereof are disclosed. A plurality of features is formed on a workpiece, the plurality of features being...
Modeller for a high-security system
A modeller for a system for determining a residual error probability. The modeller includes a component modeller, which is adapted to receive an error...
Predictive angular sensor readout
A sensor readout includes a selector circuit, a predictor circuit, and a select controller. The selector circuit receives a plurality of actual sensor inputs....
Device and method for performing a cryptoalgorithm
A device for executing a cryptoalgorithm including a central processing unit for a first sub-group of operations and for a flow control of the cryptoalgorithm...
Memory cell heating elements
The present disclosure relates to the heating of memory cells.
Memory circuit arrangement and method for the production thereof
A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different...
Methods and systems for analyzing a volume of gas
One embodiment relates to a method for determining a concentration of a molecular species of interest. In this method, electromagnetic radiation is transmitted...
Analog to digital converter (ADC) with comparator function for analog
This disclosure relates to analog to digital converter (ADC) component with a comparator function for analog signals.
MEMS resonator devices with a plurality of mass elements formed thereon
The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference,...
Impedance transformation with transistor circuits
An impedance transformation circuit utilizes two transistor circuits.
Techniques for electrically characterizing tunnel junction film stacks
with little or no processing
Probes are electrically connected to a surface of a tunnel junction film stack comprising a free layer, a tunnel barrier, and a pinned layer. Resistances are...
Regulation of a current through an inductive load
A current regulator and a method for regulating current are described.
Crack stop and moisture barrier
A design for a crack stop and moisture barrier for a semiconductor device includes a plurality of discrete conductive features formed at the edge of an...
Semiconductor devices and methods of manufacture thereof
A first gate dielectric of a first transistor is disposed over a workpiece in a first region, and a second gate dielectric of a second transistor is disposed...
Device and manufacturing method
A description is given of a device, including a semiconductor chip, a first metal layer laterally extending over the semiconductor chip, the first metal layer...