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Patent # Description
US-8,126,407 Transmitter circuit
A transmitter circuit. One embodiment provides for emitting electromagnetic waves. The circuit has a transmitting device for outputting a transmission signal,...
US-8,125,821 Method of operating phase-change memory
One or more embodiments are related to a method of operating a phase-change memory array, including: providing the phase-change memory array, the phase-change...
US-8,125,202 Protection circuit for protecting a half-bridge circuit
The present invention relates to a protection circuit for protecting a half-bridge circuit. The protection circuit detects an incorrect response of the...
US-8,125,072 Device including a ring-shaped metal structure and method
A device includes a semiconductor chip with a ring-shaped metal structure extending along the contour of a first main surface of the semiconductor chip. An...
US-8,125,060 Electronic component with layered frame
An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including...
US-8,125,046 Micro-electromechanical system devices
Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer...
US-8,125,036 Integrated circuit having an edge passivation and oxidation resistant layer and method
The Examiner objected to the abstract of the disclosure because it contains the phrase "comprising." The Abstract does not include the phrase "comprising,"...
US-8,124,983 Power transistor
A power transistor includes a first terminal, a second terminal and a control terminal. A support layer is formed of a first material having a first bandgap. An...
US-8,124,953 Sensor device having a porous structure element
A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first...
US-8,124,483 Semiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a method of manufacturing a semiconductor device includes...
US-8,124,475 Integrated circuit arrangement with capacitor and fabrication method
An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far...
US-8,124,469 High-efficiency filler cell with switchable, integrated buffer capacitance for high frequency applications
A cell based integrated circuit chip includes a top voltage supply rail and a bottom voltage supply rail and a plurality of metal layers defining at least one...
US-8,124,449 Device including a semiconductor chip and metal foils
A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first...
US-8,120,427 Circuit arrangement and method for power regulation and amplifier arrangement
A circuit arrangement and method for power regulation and an amplifier arrangement for power regulation are described.
US-8,120,391 Circuit arrangement including a voltage supply circuit and semiconductor switching element
A circuit arrangement comprising a first semiconductor switching element, which has a load path and a drive terminal. A voltage supply circuit, is provided...
US-8,120,346 Methods and apparatus for current sensing
Methods and apparatus for current sensing according to various aspects of the present invention sense the current in a circuit, such as an inductor circuit. The...
US-8,120,161 Semiconductor module including semiconductor chips coupled to external contact elements
A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a...
US-8,120,158 Laminate electronic device
A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to...
US-8,120,135 Transistor
A transistor has a cell array with two or more transistor cells, a temperature sensor, which is integrated in the cell array or is adjacent to the cell array,...
US-8,120,078 Photodiode structure
A photodiode structure including a semiconductor of a first conductivity type, the semiconductor having a main surface, a first well formed in the semiconductor...
US-8,120,074 Bipolar semiconductor device and manufacturing method
A bipolar semiconductor device with a hole current redistributing structure and an n-channel IGBT are provided. The n-channel IGBT has a p-doped body region...
US-8,119,452 Method of fabricating a semiconductor device
One method includes fabricating a semiconductor device including providing a dielectric layer. At least one semiconductor chip is provided defining a first...
US-8,116,701 Circuit arrangement and method for setting an analog output signal
A circuit arrangement includes a signal processing unit and a regulation unit. The signal processing unit processes an input signal to form an analog output...
US-8,116,142 Method and circuit for erasing a non-volatile memory cell
The present invention is a method, circuit and system for erasing a non-volatile memory cell. A shunting element (e.g. transistor) may be introduced and/or...
US-8,116,102 Integrated circuit device and method of producing
An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being...
US-8,115,573 Resonance frequency tunable MEMS device
System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure...
US-8,115,534 Analog switch controller
Methods and systems for implementing an analog switch controller to improve linearity of analog switches are described.
US-8,115,294 Multichip module with improved system carrier
A power semiconductor device has a first chip carrier part (11) and a second chip carrier part (12), the first chip carrier part (11) and the second chip...
US-8,115,279 Semiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a semiconductor device includes a workpiece having a buried...
US-8,115,274 Fuse structure and method for manufacturing same
A fuse structure includes a substrate, a fuse conductive trace disposed closer to a first chip surface than to a second chip surface facing away from the first...
US-8,114,743 Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a...
US-8,112,563 Arrangement comprising a first semiconductor chip and a second semiconductor chip connected thereto
An arrangement including a first semiconductor chip and a second semiconductor chip connected thereto, where the second semiconductor chip is additionally...
US-8,112,077 Method and apparatus for transmitting media data
Media data from a first communication session and media data from a second communication session are received by a unit in the communication network and are...
US-8,112,043 Radio frequency communication devices and methods
One embodiment relates to a radio frequency (RF) communication device. The RF communication device includes an antenna interface coupled to an antenna that...
US-8,111,845 System having a pulse width modulation device
A system, a device and a method for pulse width modulation is disclosed. One embodiment includes a pulse width modulation device, a first pulse width modulation...
US-8,111,182 Digital to analog converter comprising mixer
In some embodiments, digital to analog converters are provided which comprise a plurality of cells. Each cell comprises a mixer and coupling circuitry to...
US-8,111,180 Analog to digital conversion using irregular sampling
This disclosure relates to analog to digital conversion using irregular sampling.
US-8,110,932 Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire
In one embodiment of the present invention, a semiconductor circuit including an amplifier disposed on a semiconductor substrate is disclosed. A first bond wire...
US-8,110,915 Open cavity leadless surface mountable package for high power RF applications
An RF semiconductor package includes a substrate having generally planar top and bottom surfaces. The substrate includes a metallic base region and one or more...
US-8,110,912 Semiconductor device
A method of manufacturing a semiconductor device includes providing a foil formed of an insulating material, where the foil includes at least one electrically...
US-8,110,906 Semiconductor device including isolation layer
A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second...
US-8,110,868 Power semiconductor component with a low on-state resistance
A semiconductor component having a semiconductor body is disclosed. In one embodiment, the semiconductor component includes a drift zone of a first conductivity...
US-8,110,445 High power ceramic on copper package
According to an embodiment of a high power package, the package includes a copper heat sink, a ceramic lead frame and a semiconductor chip. The copper heat sink...
US-8,108,862 Out-of-order thread scheduling based on processor idle time thresholds
The invention relates to a device to be used with a thread scheduling method, and to a thread scheduling method comprising the steps of performing a scheduling...
US-8,107,564 Device for detecting a frequency offset
A device detects a frequency offset by a frequency converter arranged to convert a received signal into a sideband and comprises a calculator arranged to...
US-8,106,758 Tire localization system
A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system...
US-8,106,654 Magnetic sensor integrated circuit device and method
An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic...
US-8,106,497 Semiconductor module having a semiconductor chip stack and method
A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with...
US-8,106,462 Balancing NFET and PFET performance using straining layers
An integrated circuit structure includes a substrate and at least one pair of complementary transistors on or in the substrate. The pair of complementary...
US-8,106,424 Field effect transistor with a heterostructure
A field effect transistor with a heterostructure includes a strained monocrystalline semiconductor layer formed on a carrier material, which has a relaxed...
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