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One or more embodiments relate to a semiconductor device, comprising: a Si-containing layer; a barrier layer disposed over the Si-containing layer, the barrier...
Electronic component and method for its production
An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of...
Substrate with feedthrough and method for producing the same
A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one...
Bipolar transistor and method for making same
One or more embodiments of the invention relate to a method of making a heterojunction bipolar transistor, including: forming a collector layer; forming a stack...
Process and method for erase strategy in solid state disks
An embodiment of the invention relates to a nonvolatile mass storage device such as a flash memory device formed with erase blocks partitioned into memory...
Method for routing of data packets and routing apparatus
In order to be able to use a smaller routing table (4) and, thus, to reduce the costs and power consumption and to improve the performance of an IP router, it...
Digital phase feedback for determining phase distortion
A feedback loop is used to determine phase distortion created in a signal by directly extracting the phase distortion information from a feedback signal using...
Semiconductor device with overcurrent protection
A semiconductor device with an over-current detection feature is disclosed. According to an example of the invention the device includes: a semiconductor chip...
Embodiments of the invention relate to device-embedded IDDQ testing in the field to detect defects, aging, and other reliability reducing problems. Methods of...
Semiconductor device with thermal fault detection
A semiconductor device with a thermal fault detection is disclosed. According to one example of the invention such a semiconductor device includes a...
Failure detection for series of electrical loads
An apparatus for detecting failures in an illumination device includes at least two light emitting diodes connected in series. The apparatus includes a first, a...
Methods and apparatus for current sensing in mutually coupled inductors
Methods and apparatus for current sensing in mutually coupled inductors according to various aspects of the present invention may operate in conjunction with a...
The invention relates to a semiconductor device with a semiconductor chip, on which a terminal contact formed in one piece, a patterned metallization layer,...
Electronic device with connecting structure
A connecting structure for an electronic device includes an edge region of the device, a first trench and a second trench running toward the edge region, a...
Semiconductor device with trench field plate including first and second
In one embodiment, a field effect transistor has a semiconductor body, a drift region of a first conductivity type and a gate electrode. At least one trench...
Semiconductor device including a vertical gate zone, and method for
producing the same
A semiconductor device includes a semiconductor body defining a trench structure having walls. A plurality of vertical gate zones each have a gate electrode and...
Semiconductor wafer with electrically connected contact and test areas
The invention relates to an arrangement of contact areas and test areas on patterned semiconductor chips. The contact areas and the test areas are electrically...
Methods of use and formation of a lateral bipolar transistor with
counter-doped implant regions under collector...
A method for protecting a semiconductor circuit from electrostatic discharge is disclosed. An electrostatic discharge is received at a node. Current created by...
Generating a phase value for a complex signal
A method of generating a phase value representative of a phase of a complex signal that includes an in-phase component and a quadrature-phase component includes...
The present invention relates to a tracking system comprised in a receiver, which tracking system is operable to track rapid changes in frequency and phase...
Communication methods and apparatuses
Communication methods and apparatuses are provided.
Method for the transmission of data
A method, system and computer program product for the transmission of data from a transmitter to a receiver according to the standard universal mobile...
Relay controller for controlling an excitation current of a relay
The invention relates to a relay controller (500) for controlling an excitation current of a relay (300), wherein the relay controller (500) is designed, upon...
Method and circuit for protecting a MOSFET
A method and a corresponding circuit protect a power MOSFET from overload when switching the MOSFET off. The current through the MOSFET is compared to a...
System and method for protection against loss of battery in reverse
battery protected devices
A system and method for protecting a reverse battery protected device during loss of battery are disclosed. An embodiment method includes biasing a substrate of...
MEMS resonator devices with a plurality of mass elements formed thereon
The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference,...
Electronic circuit arrangement
Electronic circuit arrangement, includes a chip and a chip carrier having a substrate and a chip contact location. At least the chip contact location is...
Power semiconductor component having a topmost metallization layer
A power semiconductor component and a method for the production of a power semiconductor component are disclosed. According to one embodiment of the invention,...
Apparatus of memory array using finfets
A memory cell includes a FinFET select device and a memory element. In some embodiments a memory cell has a contact element coupled between a surface of the fin...
Trench transistor and method for fabricating a trench transistor with
A method is disclosed for fabricating a trench transistor, in which there are formed, within an epitaxial layer deposited above a substrate of a first...
Semiconductor device and a method for manufacturing a semiconductor device
A semiconductor device is disclosed. In one embodiment, the semiconductor device includes a channel formation region formed on a side wall, having a mixture of...
Method for producing a semiconductor device including connecting a
functional wafer to a carrier substrate and...
A semiconductor device and method for producing such a device is disclosed. One embodiment provides a semiconductor functional wafer having a first and second...
Integrated circuits and methods of design and manufacture thereof
Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes depositing a gate material over...
Radio communications system
A base station is operable in a local area communication radio network within the coverage of a wide area communication radio network. The base station...
Noise parameter determination method
According to an aspect of the present description a method for determining selected parameters of a noise characterization equation which describes a noise...
Communication system and method for operating a communication system
Communication system including a host and a device. The host has an oscillator and the device has a USB-function core. The oscillator in the host is coupled to...
System for supplying current to a load
A system for supplying current to a load is disclosed. One embodiment provides a switching converter for providing a load current to the load. The switching...
A semiconductor package includes a semiconductor chip having an integrated circuit, a functional element electrically coupled with the integrated circuit, and...
A semiconductor element includes a semiconductor layer having a first doping density, a metallization, and a contact area located between the semiconductor...
Method and layout of semiconductor device with reduced parasitics
An semiconductor device is disclosed. The device includes a semiconductor body, a layer of insulating material disposed over the semiconductor body, and a...
Method of fabricating a diode
A method of fabricating a diode is disclosed. One embodiment provides a semiconductor body having a front and a back, opposite the front in a vertical direction...
Channel estimation for OFDM systems
In a method for channel estimation of an OFDM signal transmitted via a channel, an initial channel transfer function is calculated by channel estimation. A...
Methods of operating embedded flash memory devices
Flash memory device structures and methods of manufacture thereof are disclosed. The flash memory devices are manufactured on silicon-on-insulator (SOI)...
An active diode is disclosed. One embodiment provides a method for operating a device. The electronic device includes a transistor connected between a first and...
Signal conversion using finite impulse response feedback
Disclosed are techniques for reducing noise and providing conversion signals in electronic components, including pulse width modulation (PWM) oversampling...
Arrangement comprising a shunt resistor and method for producing an
arrangement comprising a shunt resistor
The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive...
Integrated circuit package
An integrated circuit package includes a substrate and a first semiconductor chip. The first semiconductor chip is provided in a cavity on a first side of the...
Arrangement for electrically connecting semiconductor circuit arrangements
to an external contact device and...
An electrical connection arrangement between a semiconductor circuit arrangement and an external contact device, and to a method for producing the connection...
Electronic device having profiled elements extending from planar surfaces
Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the...
One embodiment provides a semiconductor assembly including a printed circuit board and a semiconductor package. The semiconductor package includes a lead frame...