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Patent # Description
US-1,003,7972 Electronic module comprising fluid cooling channel and method of manufacturing the same
Various embodiments provide an electronic module comprising a interposer comprising a fluid channel formed in an electrically isolating material and an...
US-1,003,7934 Semiconductor chip package having contact pins at short side edges
A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact...
US-1,003,7887 Method for implanting ions into a semiconductor substrate and an implantation system
A method for implanting ions into a semiconductor substrate includes performing a test implantation of ions into a semiconductor substrate. The ions of the test...
US-1,003,7068 Configurable digital interface for switching voltage regulators
A high-speed, low-latency configurable digital interface for a voltage regulator includes a first hardwired unit, a second hardwired unit and a programmable...
US-1,003,6771 Circuit arrangement
According to various embodiments, a circuit arrangement is provided which includes a bridge circuit having at least two field effect transistors and a...
US-1,003,4258 Signal detector device and method
A signal detector device and method includes a quadrature demodulator configured to receive an input signal, a first reference signal, and a second reference...
US-1,003,4100 Sound transducer structure and method for manufacturing a sound transducer structure
A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a...
US-1,003,4089 Sensor arrangement having an optimized group delay and signal processing method
In various embodiments, a circuit arrangement is provided. The circuit arrangement includes a sensor set up to provide an analogue signal, an analogue/digital...
US-1,003,3370 Circuit and method for driving a power semiconductor switch
A drive circuit for driving a semiconductor switch includes an overload detector circuit connected to the semiconductor switch and designed to detect an...
US-1,003,3297 Rectifier device
A rectifier is described herein. According to one example, the rectifier includes a semiconductor substrate and further includes an anode terminal and a cathode...
US-1,003,3283 Knee point detection for power converter control
A power converter includes a controller. The controller is configured to charge a capacitor of the controller based on a peak voltage applied to a primary-side...
US-1,003,3282 Method and apparatus for estimating load current for semi-resonant and resonant converters
A voltage converter includes a variable switching frequency power stage, a passive circuit and a control circuit. The power stage includes a high-side switch...
US-1,003,3269 Voltage doubler with capacitor module for increasing capacitance
In one example, a circuit includes an alternating current (AC) voltage source, a voltage rail, a reference rail, a first capacitor, a second capacitor, and a...
US-1,003,3264 Bulk capacitor switching for power converters
In one example, a circuit includes a voltage rail, a reference node, a first capacitor, and a capacitor module. The first capacitor is coupled to the voltage...
US-1,003,2893 Bipolar transistor
A bipolar transistor comprises a semiconductor body including a collector region and a base region arranged on top of the collector region. The base region has...
US-1,003,2878 Semiconductor device with a semiconductor via and laterally connected electrode
A semiconductor device includes a semiconductor body having a first surface and a second surface, at least one electrode arranged in at least one trench...
US-1,003,2767 Field-effect semiconductor device
According to an embodiment of a semiconductor device, the semiconductor device includes a semiconductor body having a main surface, the semiconductor body...
US-1,003,2755 Power semiconductor arrangement having a plurality of power semiconductor switching elements and reduced...
A multiplicity of power semiconductor switching elements of the same type parallel have a load current terminal for a load current input and a load current...
US-1,003,2743 Method for producing a semiconductor module
A semiconductor module is produced by providing a circuit carrier having a metallization, an electrically conductive wire and a bonding device. With the aid of...
US-1,003,2688 Electronic component and method for dissipating heat from a semiconductor die
In an embodiment, an electronic component includes a dielectric core layer having a thickness, at least one semiconductor die embedded in the dielectric core...
US-1,003,2670 Plasma dicing of silicon carbide
A method of forming a semiconductor device includes forming an active region in a first side of a silicon carbide substrate, the silicon carbide substrate...
US-1,003,2591 Fuse arrangement
A fuse arrangement, including: at least a first terminal, a second terminal, and a fuse, wherein the first terminal and the second terminal may be electrically...
US-1,003,1541 Current sensing for linear voltage regulator
In one example, a circuit includes a pass module, a first sensing module, a second sensing module, a decision module, and a control module. The pass module is...
US-1,003,1540 Voltage regulator
Various embodiments provide a voltage regulator. The voltage regulator includes a supply voltage input to apply an input supply voltage, a supply voltage output...
US-1,003,1062 Particle sensor and method for sensing particles in a fluid
Various embodiments provide a particle sensor including: a first carrier, the first carrier including at least one heating structure and a light detecting...
US-1,002,9913 Removal of a reinforcement ring from a wafer
A method of removing a reinforcement ring from a wafer is described. The method includes forming a ring-shaped recess in a first surface of the wafer and...
US-1,002,8052 System and method for an acoustic transducer and environmental sensor package
According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over...
US-1,002,7298 System and method for adjusting the sensitivity of a capacitive signal source
In accordance with an embodiment, a system for amplifying a signal provided by a capacitive signal source includes an impedance converter having an input node...
US-1,002,7110 Communicating with power switching devices
In one example, a method includes receiving, by a power switching device and via a connector of the power switching device, a signal that causes the power...
US-1,002,6816 Semiconductor wafer and manufacturing method
A semiconductor wafer includes first and second main surfaces opposite to each other along a vertical direction, and a side surface encircling the semiconductor...
US-1,002,6806 Semiconductor device including an LDMOS transistor and a RESURF structure
In an embodiment, a high frequency amplifying circuit includes a semiconductor device. The semiconductor device includes a semiconductor substrate having a bulk...
US-1,002,6574 Multi-load drive circuit
A circuit arrangement includes a first number of loads connected in series. Each of a second number of drive units is coupled to at least one of the first...
US-1,002,6306 Signal generator, decoder, method for generating a transmit signal and method for determining speed data
A signal generator includes a signal provider and a signal processing unit. The signal provider is configured to provide a sensor signal indicating a repeatedly...
US-1,002,4891 Metal shunt resistor
In one embodiment, a shunt resistor is provided, comprising two terminals, a semiconductor substrate embodying at least one temperature sensor comprising at...
US-1,002,4831 Graphene gas sensor for measuring the concentration of carbon dioxide in gas environments
A gas sensor for measuring a concentration of carbon dioxide in a gas environment (GE) is provided. The gas sensor includes a graphene layer having a side...
US-1,002,0730 Current distribution in DC-DC converters
A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active...
US-1,002,0388 Insulated gate bipolar transistor including charge injection regions
A semiconductor device is disclosed. One embodiment provides a cell area and a junction termination area at a first side of a semiconductor zone of a first...
US-1,002,0387 Method for manufacturing a bipolar junction transistor
Embodiments provide a method for manufacturing a bipolar junction transistor, comprising: providing a semiconductor substrate comprising a buried layer of a...
US-1,002,0285 Method of producing a semiconductor device and a semiconductor device
A method of producing a semiconductor device is provided. The method includes: providing a semiconductor wafer, the wafer including an upper layer of a...
US-1,002,0278 Method for positioning a semiconductor chip on a carrier and method for material-fit bonding of a semiconductor...
A semiconductor chip includes a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side. The...
US-1,002,0270 Semiconductor device including a LDMOS transistor, monolithic microwave integrated circuit and method
In an embodiment, a semiconductor device includes a semiconductor substrate including a front surface, an LDMOS transistor structure in the front surface, a...
US-1,002,0264 Integrated circuit substrate and method for manufacturing the same
The description discloses a method for use in manufacturing integrated circuit chips. The method comprises providing a wafer having a plurality of integrated...
US-1,002,0245 Laminate electronic device
A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second...
US-1,002,0237 Power semiconductor module and method for producing a power semiconductor module
A power semiconductor module includes a module housing and a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied...
US-1,002,0226 Method for forming a semiconductor device and a semiconductor device
In certain embodiments, a semiconductor device includes a plurality of semiconductor chips. Each semiconductor chip comprises a semiconductor body having a...
US-1,002,0215 Frame cassette
According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a...
US-1,001,9664 Chip card sleeve
A chip card sleeve including a cavity for holding a chip card, and a first contact and a second contact that extend into the cavity, wherein the first contact...
US-1,001,8667 Method for testing semiconductor dies
A method for testing semiconductor dies includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate...
US-1,001,7870 Method for fabricating a heat sink, and heat sink
A method for fabricating a heat sink including providing a carbon metal composite having a plurality of metal-coated carbon fibers and a plurality of openings,...
US-1,001,7379 System and method for a MEMS transducer
According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a substrate with a first cavity that passes through the substrate from a...
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