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Patent # Description
US-9,564,449 Semiconductor device and method of forming a semiconductor device
A semiconductor device is provided, which may include: a well of a first conductivity type located within a substrate of a second conductivity type; a well...
US-9,564,425 Integrated transistor structure having a power transistor and a bipolar transistor
An integrated transistor structure includes an epitaxial layer on a semiconductor substrate, a power transistor formed in a first region of the epitaxial layer...
US-9,564,423 Power package with integrated magnetic field sensor
A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a...
US-9,564,403 Magnetic shielding of perpendicular STT-MRAM
A memory having an array of perpendicular spin-transfer torque (STT) magnetic random access memory (MRAM) cells, wherein each cell has a magnetic layer stack. A...
US-9,564,389 Semiconductor package with integrated die paddles for power stage
In one implementation, a semiconductor package includes a first conductive carrier including a first die paddle of the semiconductor package, and a control...
US-9,564,384 Plastic cooler for semiconductor modules
A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a...
US-9,563,766 Device and accessory pairing
A device authenticates accessories by detecting that an accessory is attached to the device, determining a unique identification (ID) for the accessory,...
US-9,562,954 Maximization of target signal and elimination of backbias component for a differential upright position sensor
Embodiments relate to sensor device configurations. In one embodiment, a sensor device comprises a bias magnet, a field sensor die, a first set of one or more...
US-9,561,953 Method of forming a protective coating for a packaged semiconductor device
A first semiconductor substrate having at least one integrated semiconductor device is provided. A lift-off layer is formed on a main surface of the first...
US-9,560,765 Electronic device, a method for manufacturing an electronic device, and a method for operating an electronic device
According to various embodiments, an electronic device may include a carrier including at least a first region and a second region being laterally adjacent to...
US-9,559,683 System and method for a switch having a normally-on transistor and a normally-off transistor
In accordance with an embodiment, a circuit includes a first driver having a first output configured to be coupled to a control node of a normally-off...
US-9,559,682 Protected switching element
A circuit is suggested comprising an electronic switching element, a logic unit coupled to control the electronic switching element, and a counter unit coupled...
US-9,559,613 System and method for a switch driver
In accordance with an embodiment, switch driver includes a first switch driver configured to be coupled to a control node of a first switch, a second driver...
US-9,559,602 Magnetizing current based control of resonant converters
A resonant converter is described that includes at least one power switch. The at least one power switch is characterized by a non-linearity coefficient that is...
US-9,559,590 Methods and apparatus for a power supply
Methods and apparatus for a power supply according various aspects of the present invention operate in conjunction with a voltage converter for converting an...
US-9,559,293 Integrated circuit including sensor having injection molded magnetic material
An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
US-9,559,238 Arrangement and method for determining the spatial direction of radiation incidence
The present disclosure relates to an optical receiver. The optical receiver has a first photosensor and a second photosensor disposed within a substrate. The...
US-9,559,204 Strained semiconductor device and method of making the same
In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate...
US-9,559,167 Semiconductor component with dynamic behavior
One embodiment provides a semiconductor component including a semiconductor body having a first side and a second side and a drift zone; a first semiconductor...
US-9,559,161 Patterned back-barrier for III-nitride semiconductor devices
A compound semiconductor device includes a III-nitride buffer and a III-nitride barrier on the III-nitride buffer. The III-nitride barrier has a different band...
US-9,559,108 Chip and an electronic device
A method for processing a carrier accordance with various embodiments may include: forming a structure over the carrier, the structure including at least two...
US-9,559,089 Semiconductor arrangement with active drift zone
A semiconductor device arrangement includes a semiconductor layer and at least one series circuit with a first semiconductor device and a plurality of n second...
US-9,559,078 Electronic component
An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip...
US-9,559,068 Wafer scale package for high power devices
A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper...
US-9,559,065 Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor...
A semiconductor arrangement includes upper and lower contact plates and basic chip assemblies. Each chip assembly has a semiconductor chip having a...
US-9,559,056 Electronic component
In an embodiment, an electronic component includes a dielectric core layer having a first major surface, a semiconductor die embedded in the dielectric core...
US-9,559,047 Passive component as thermal capacitance and heat sink
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board...
US-9,559,026 Semiconductor package having a multi-layered base
A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic case, a conductive base coupled to the...
US-9,559,020 Method for postdoping a semiconductor wafer
A method for treating a semiconductor wafer having a basic doping is disclosed. The method includes determining a doping concentration of the basic doping, and...
US-9,558,948 Laser thermal annealing of deep doped region using structured antireflective coating
A semiconductor body having a first surface is provided. A deep doped region of the semiconductor body is formed using masked ion implantation to implant dopant...
US-9,558,933 Method for forming a semiconductor device
A method for forming a semiconductor device includes carrying out an anodic oxidation of a surface region of a semiconductor substrate to form an oxide layer at...
US-9,558,797 Method and apparatus for controlling current in an array cell
A method and an apparatus for controlling current in an array cell is disclosed. The method includes applying a supply voltage to a first access point of a...
US-9,558,607 Relay attack prevention using RSSIPPLX
The disclosed invention relates to a passive keyless entry receiver system having an application controller that is activated upon receipt of an entire payload...
US-9,558,114 System and method to store data in an adjustably partitionable memory array
The disclosure relates to an electronic memory system, and more specifically, to a system for storing data in an adjustably partitionable memory array, and a...
US-9,557,799 Sensor interface systems and methods
A sensor interface system includes a system bus, a bus master and a sensor. The bus master is coupled to the system bus. The bus master is configured to provide...
US-9,557,763 Electronic circuit and method for providing a clock signal
According to an embodiment, an electronic circuit is described comprising a processing circuit, a power supply configured to supply power to the processing...
US-9,557,756 Bias drift compensation
Representative implementations of devices and techniques provide detection of a voltage drift of an electrical component or system. A detection circuit detects...
US-9,557,417 Sonic sensors and packages
Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one...
US-9,553,208 Current sensor device
A current sensor device for sensing a measuring current includes a semiconductor chip having a magnetic field sensitive element. The current sensor device...
US-9,553,183 Gate stack for normally-off compound semiconductor transistor
A normally-off compound semiconductor transistor includes a heterostructure body and a gate stack on the heterostructure body. The heterostructure body includes...
US-9,553,179 Semiconductor device and insulated gate bipolar transistor with barrier structure
A semiconductor device includes a semiconductor mesa which is formed between cell trench structures extending from a first surface into a semiconductor body....
US-9,553,178 Semiconductor component with an emitter control electrode
A semiconductor component includes a first emitter zone of a first conductivity type, a second emitter zone of a second conductivity type, a first base zone...
US-9,553,155 Semiconductor device and method
In an embodiment, a semiconductor device includes a High Electron Mobility Transistor (HEMT) including a floating gate. The floating gate includes two or more...
US-9,553,051 Electronic component
In an embodiment, an electronic component includes a dielectric layer having a first surface and a second surface, one or more semiconductor dies embedded in...
US-9,553,022 Method for use in manufacturing a semiconductor device die
In one embodiment, a wafer includes a number of die areas each including a semiconductor device and dedicated to become a separate die. The die areas are...
US-9,553,021 Method for processing a wafer and method for dicing a wafer
In various embodiments, a method for processing a wafer may include: providing a wafer having at least one die region and at least one metallization disposed...
US-9,553,016 Contacts for semiconductor devices and methods of forming thereof
A method for a method of forming a semiconductor device includes providing a semiconductor substrate having a bottom surface opposite a top surface with...
US-9,552,499 Circuit arrangement and method for safeguarding a circuit arrangement with respect to repeated light attacks
In various embodiments, a circuit arrangement is provided. The circuit arrangement may include a detection circuit, which is designed to detect light attacks on...
US-9,551,837 Silicon optical line multiplexer devices
Embodiments relate to silicon optical line multiplexers. In an embodiment, an optical line multiplexer includes at least one microprism etched from a silicon...
US-9,550,669 Vertical pressure sensitive structure
Embodiments related to pressure sensitive structures are described and depicted.
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