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Semiconductor device with field electrode structures, gate structures and
auxiliary diode structures
A semiconductor device includes field electrode structures extending in a direction vertical to a first surface in a semiconductor body. Cell mesas are formed...
Segmented bond pads and methods of fabrication thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a first bond pad disposed at a first side of a substrate. The first...
Method of singulating semiconductor devices using isolation trenches
In accordance with an embodiment of the present invention, a method for forming a semiconductor device includes forming a device region in a substrate. The...
Long-term heat treated integrated circuit arrangements and methods for
producing the same
An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment....
Method for processing a carrier, a method for operating a plasma
processing chamber, and a method for...
According to various embodiments, a method for processing a carrier may include: performing a dry etch process in a processing chamber to remove a first...
Monitoring current in power switch devices
In one example, a method includes generating, by a main switching element of a device, a load current; generating, by a regulation loop of the device, a sense...
Primer composition, method of forming a primer layer on a semiconductor
device, and method of encapsulating a...
A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including...
System and method for a MEMS transducer
According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter...
Power semiconductor module
System and method for a voltage controlled oscillator
In accordance with an embodiment, a voltage controlled oscillator (VCO) includes a VCO core having a plurality of transistors, a bias resistor coupled between...
Switching converter with dead time between switching of switches
A device and method for operating a switching power converter are disclosed. In an embodiment a circuit includes a switching power converter having a half...
Driver controller with internally calculated average output current
Methods, devices, and integrated circuits are disclosed for a driver controller that internally calculates average output current. In one example, a method...
Semiconductor device with charge compensation
A semiconductor device includes a semiconductor body and a source metallization arranged on a first surface of the body. The body includes: a first...
Semiconductor device with control structure including buried portions and
method of manufacturing
A semiconductor device includes transistor cells with source zones of a first conductivity type and body zones of a second conductivity type. The source and...
Semiconductor device comprising a field electrode
A semiconductor device includes a gate electrode adjacent to a body region in a semiconductor substrate. The semiconductor device further includes a field...
Semiconductor substrate and a method of manufacturing the same
The semiconductor substrate includes a high-ohmic semiconductor material with a conduction band edge and a valence band edge, separated by a bandgap, wherein...
Method for making a sensor device using a graphene layer
A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The...
Integrated circuit with cavity-based electrical insulation of a photodiode
An integrated circuit includes a semiconductor substrate, at least one photodiode, which is formed on a surface of the semiconductor substrate, at least one...
Shallow trench isolation area having buried capacitor
A semiconductor chip includes a substrate including a surface, an active transistor region and a substrate contact region formed on the substrate, a shallow...
Preform structure for soldering a semiconductor chip arrangement, a method
for forming a preform structure for...
A preform structure for soldering a semiconductor chip arrangement includes a carbon fiber composite sheet and a solder layer formed over the carbon fiber...
Single crystal ingot, semiconductor wafer and method of manufacturing
An embodiment of a method of manufacturing semiconductor wafers comprises forming a notch or a flat in a semiconductor ingot extending along an axial direction....
Encapsulated electronic chip device with mounting provision and externally
accessible electric connection structure
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric...
Increasing the doping efficiency during proton irradiation
A description is given of a method for doping a semiconductor body, and a semiconductor body produced by such a method. The method comprises irradiating the...
Circuit arrangement, a method for forming a circuit arrangement, and
method for integrity checking
A circuit arrangement is provided, the circuit arrangement including a processor; a memory circuit connected to the processor, wherein the processor is...
Dynamic resource sharing
Representative implementations of devices and techniques provide dynamic secure sharing of resources. A resource module can be partitioned into a plurality of...
System and method for a transformer and a phase-shift network
In accordance with an embodiment, a circuit includes a magnetic transformer having a first winding coupled between a first signal node and a second signal node,...
XMR angle sensor arrangement with safety mechanism and method for
monitoring the same
An XMR angle sensor arrangement with a safety mechanism comprises an XMR angle sensor having a sensing area for sensing an in-plane magnetic field and for...
Sensor module and semiconductor chip
A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface...
Chip card substrate and method of forming a chip card substrate
A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an...
Power semiconductor module
Electronic module and method of manufacturing the same
According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic...
System and method for high-speed analog beamforming
In accordance with an embodiment, a Radio Frequency (RF) front end system includes a first chip that includes a frequency multiplier coupled to a first input...
Circuit arrangement and method for generating a drive signal for a
Disclosed is a circuit arrangement for generating a drive signal for a transistor. In one embodiment, the circuit arrangement includes a control circuit that...
A limiting amplifier includes a multiplicity of cascaded amplifier stages for amplifying an input signal for the amplifier. A further amplifier stage is...
Power supply circuitry and adaptive transient control
A control circuitry can be configured to receive an error signal indicating a difference between an output voltage of the power supply and a desired setpoint...
Charge pumps with improved latchup characteristics
Some embodiments of the present disclosure relate to improved regulators for charge pumps. Such regulators selectively activate a charge pump based not only on...
Lithium battery, method for manufacturing a lithium battery, integrated
circuit and method of manufacturing an...
A lithium battery includes a cathode, an anode integrally formed within a silicon substrate, wherein a surface portion of the silicon substrate is patterned to...
Method of manufacturing a semiconductor device and semiconductor device
A method of manufacturing a semiconductor device including a transistor comprises forming field plate trenches in a main surface of a semiconductor substrate, a...
Enhancement mode III-nitride transistor
According to one embodiment, a III-nitride transistor includes a conduction channel formed between first and second III-nitride bodies, the conduction channel...
Semiconductor device with stripe-shaped trench gate structures and gate
A semiconductor device includes a transistor cell with a stripe-shaped trench gate structure that extends from a first surface into a semiconductor body. A gate...
Semiconductor device with field electrode and field dielectric
A semiconductor device includes a field electrode structure that includes a field electrode and a field dielectric surrounding the field electrode. The field...
Semiconductor package for III-nitride transistor stacked with diode
One exemplary disclosed embodiment comprises a two-terminal stacked-die package including a diode, such as a silicon diode, stacked atop a III-nitride...
Systems and methods for integrating bootstrap circuit elements in power
transistors and other devices
Embodiments relate to bootstrap circuits integrated with at least one other device, such as a power transistor or other semiconductor device. In embodiments,...
Semiconductor arrangement with active drift zone
A semiconductor device arrangement includes a first semiconductor device having a load path and a plurality of second semiconductor devices, each having a load...
Chip package and chip assembly
A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side...
Method for forming electronic components
A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of...
Compact power quad flat no-lead (PQFN) package
Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical ...
Monitor structures and methods of formation thereof
In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a...
Substrate carrier system for moving substrates in a vertical oven and
method for processing substrates
A substrate carrier system for moving substrates in a vertical oven and a method for processing substrates are disclosed. In some embodiments, a method for...
Plasma system, chuck and method of making a semiconductor device
A chuck, a system including a chuck and a method for making a semiconductor device are disclosed. In one embodiment the chuck includes a first conductive region...