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Semiconductor device with integrated coils
A semiconductor device with a number of integrated coils is disclosed. In one embodiment, a first coil portion and a second coil portion are at least in part...
Power switch with an overcurrent protection device
A power circuit includes a power transistor for feeding a load current to a load, a measuring transistor for coupling out a measurement current dependent on the...
The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at...
Integrated semiconductor outline package
A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a...
Semiconductor component and method for producing the same
A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the...
Integrated circuit package assembly including wave guide
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a...
On-chip RF shields with through substrate conductors
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, the system on a chip includes an RF component disposed...
System and method for constructing shielded seebeck temperature difference
An embodiment of the invention relates to a Seebeck temperature difference sensor that may be formed in a trench on a semiconductor device. A portion of the...
Semiconductor devices and methods of manufacture thereof
Methods of forming transistors and structures thereof are disclosed. A preferred embodiment comprises a semiconductor device including a workpiece, a gate...
Semiconductor device having a semiconductor chip, and method for the
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the...
Method and device for producing a bondable area region on a carrier
A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by...
Security device, secure memory system and method using a security device
A security device including a first external interface; a second external interface; and a security controller connected to said first external interface and...
Rectifier circuit with a voltage sensor
A rectifier circuit with a synchronously controlled semiconductor element comprising at least one field effect transistor with a control electrode and two...
System and method for adapting clocking pulse widths for DC-to-DC
A system and method for adapting a width of a clocking pulse for clocking a DC-DC converter, wherein the width of the clocking pulse is selected based upon the...
Semiconductor module arrangement
A semiconductor arrangement has a silicon body with a first surface and a second surface and a thick metal layer arranged on at least one surface of the silicon...
Panel, semiconductor device and method for the production thereof
A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in...
Metallization for chip scale packages in wafer level packaging
In one embodiment, a method for forming the semiconductor device includes forming a first trench from a front side of a substrate. The substrate has a front...
Calibration and verification structures for use in optical proximity
A method of training an Optical Proximity Correction (OPC) model comprises symmetrizing a complex design to be a test pattern having orthogonal symmetry....
Method for determining the type of a mobile radio base station; radio
communication terminal and network...
In an embodiment, a method for determining the type of a mobile radio base station is provided. The method may include receiving a synchronization message...
Electronic device with a programmable resistive element and a method for
blocking a device
One or more embodiments relate to an electronic device comprising a circuitry and a programmable resistive element. The programmable resistive element comprises...
Power semiconductor module featuring resiliently supported substrates and
method for fabricating a power...
The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor...
Chip card having an adjustable demodulation unit
The present invention shows a contactless chip card comprising a controllable demodulation unit for demodulating an amplitude-modulated carrier signal, a...
Crack sensors for semiconductor devices
Crack sensors for semiconductor devices, semiconductor devices, methods of manufacturing semiconductor devices, and methods of testing semiconductor devices are...
Combining two or more DC to DC converters to limit external coils
This disclosure relates to a voltage converter including a control circuit, a converter sub-circuit, and a single coil, where when the voltage converter can...
Self aligned silicided contacts
Structures and methods of forming self aligned silicided contacts are disclosed. The structure includes a gate electrode disposed over an active area, a liner...
Robust semiconductor device with an emitter zone and a field stop zone
A power semiconductor component is described. One embodiment provides a semiconductor body having an inner zone and an edge zone. A base zone of a first...
Non-volatile two transistor semiconductor memory cell and method for
producing the same
The invention relates to a nonvolatile two-transistor semiconductor memory cell and an associated fabrication method, source and drain regions (2 ) for a...
Strained semiconductor device and method of making same
In a method of making a semiconductor device, a gate dielectric is formed over the semiconductor body. A floating gate is formed over the gate dielectric, an...
Mold apparatus and method
An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and...
A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip...
Semiconductor component and method of determining temperature
One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor...
Radio communication device and method for processing measurement control
information in a communication device
In various embodiments, a communication device and a method for processing measurement control information in a communication device are provided. In an...
Oscillator with capacitance array
An oscillator is provided which comprises an array of capacitances. At least some capacitances in the array have different capacitance values.
Sensor system wherein spinning phases of the spinning current hall sensor
are lengthened in residual offset...
A system including a spinning current Hall sensor and a chopping circuit. The spinning current Hall sensor is configured to provide input signals and the...
Power semiconductor module
A power semiconductor module is disclosed. One embodiment includes a multilayer substrate having a plurality of metal layers and a plurality of ceramic layers,...
Non-volatile two-transistor semiconductor memory cell and method for
producing the same
The invention relates to a nonvolatile semiconductor memory cell and to an associated fabrication method, a source region (7), a drain region (8) and a channel...
ESD protection apparatus and electrical circuit including same
An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a...
Lithography masks, systems, and manufacturing methods
Lithography masks, lithography systems, methods of manufacturing lithography masks, methods of altering material layers of semiconductor devices, and methods of...
Method and apparatus for time-sliced and multi-threaded data processing in
a communication system
A method for designing a time-sliced and multi-threaded architecture comprises the steps of conducting a thorough analysis of a range of applications and...
Adaptive slope compensation method for stabilizing a continuous conduction
An embodiment of the invention relates to a power converter operable in a continuous conduction mode and a discontinuous conduction mode that includes a...
System and method for ringing suppression in a switched mode power supply
In one embodiment, a method of operating a switched-mode power supply having a switch coupled to a drive signal is disclosed. The method includes shutting off...
Integrated circuit including inductive device and ferromagnetic material
An integrated circuit includes a substrate and an inductive device on a first side of the substrate. The integrated circuit includes a first ferromagnetic...
System and method for transmitting current sharing information among
paralleled power trains
An embodiment of the invention relates to a power control device configured to provide current-sharing control in a power converter including a plurality of...
Circuit assembly including a power semiconductor module and a controller
A circuit assembly includes a power semiconductor module and, arranged externally thereto, a controller wherein the power semiconductor module comprises at...
Dense seed layer and method of formation
Methods of forming dense seed layers and structures thereof are provided. Seed layers including a monolayer of molecules having a density of about 0.5 or...
Semiconductor structure and method for making same
One or more embodiments relate to a method of forming an electronic device, comprising: providing a workpiece; forming a first barrier layer over the workpiece;...
Methods of manufacturing semiconductor devices
Methods of forming air gaps between interconnects of integrated circuits and structures thereof are disclosed. A first insulating material is deposited over a...
Method for providing a self-aligned conductive structure
An embodiment according to the present invention comprises a method for providing a self-aligned conductive structure comprising providing a first structure on...
Method for fabricating a semiconductor chip panel
The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus...
Method for reducing variations in the bending of rolled base plates and
semiconductor module having such a base...
A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled...