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Patent # Description
US-8,169,285 Semiconductor device with integrated coils
A semiconductor device with a number of integrated coils is disclosed. In one embodiment, a first coil portion and a second coil portion are at least in part...
US-8,169,224 Power switch with an overcurrent protection device
A power circuit includes a power transistor for feeding a load current to a load, a measuring transistor for coupling out a measurement current dependent on the...
US-8,169,070 Semiconductor device
The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at...
US-8,169,069 Integrated semiconductor outline package
A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a...
US-8,169,063 Semiconductor component and method for producing the same
A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the...
US-8,169,060 Integrated circuit package assembly including wave guide
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a...
US-8,169,059 On-chip RF shields with through substrate conductors
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, the system on a chip includes an RF component disposed...
US-8,169,045 System and method for constructing shielded seebeck temperature difference sensor
An embodiment of the invention relates to a Seebeck temperature difference sensor that may be formed in a trench on a semiconductor device. A portion of the...
US-8,169,033 Semiconductor devices and methods of manufacture thereof
Methods of forming transistors and structures thereof are disclosed. A preferred embodiment comprises a semiconductor device including a workpiece, a gate...
US-8,168,472 Semiconductor device having a semiconductor chip, and method for the production thereof
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the...
US-8,167,187 Method and device for producing a bondable area region on a carrier
A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by...
US-8,166,561 Security device, secure memory system and method using a security device
A security device including a first external interface; a second external interface; and a security controller connected to said first external interface and...
US-8,164,931 Rectifier circuit with a voltage sensor
A rectifier circuit with a synchronously controlled semiconductor element comprising at least one field effect transistor with a control electrode and two...
US-8,164,319 System and method for adapting clocking pulse widths for DC-to-DC converters
A system and method for adapting a width of a clocking pulse for clocking a DC-DC converter, wherein the width of the clocking pulse is selected based upon the...
US-8,164,176 Semiconductor module arrangement
A semiconductor arrangement has a silicon body with a first surface and a second surface and a thick metal layer arranged on at least one surface of the silicon...
US-8,164,173 Panel, semiconductor device and method for the production thereof
A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in...
US-8,163,629 Metallization for chip scale packages in wafer level packaging
In one embodiment, a method for forming the semiconductor device includes forming a first trench from a front side of a substrate. The substrate has a front...
US-8,161,421 Calibration and verification structures for use in optical proximity correction
A method of training an Optical Proximity Correction (OPC) model comprises symmetrizing a complex design to be a test pattern having orthogonal symmetry....
US-8,160,590 Method for determining the type of a mobile radio base station; radio communication terminal and network...
In an embodiment, a method for determining the type of a mobile radio base station is provided. The method may include receiving a synchronization message...
US-8,159,857 Electronic device with a programmable resistive element and a method for blocking a device
One or more embodiments relate to an electronic device comprising a circuitry and a programmable resistive element. The programmable resistive element comprises...
US-8,159,822 Power semiconductor module featuring resiliently supported substrates and method for fabricating a power...
The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor...
US-8,159,289 Chip card having an adjustable demodulation unit
The present invention shows a contactless chip card comprising a controllable demodulation unit for demodulating an amplitude-modulated carrier signal, a...
US-8,159,254 Crack sensors for semiconductor devices
Crack sensors for semiconductor devices, semiconductor devices, methods of manufacturing semiconductor devices, and methods of testing semiconductor devices are...
US-8,159,181 Combining two or more DC to DC converters to limit external coils
This disclosure relates to a voltage converter including a control circuit, a converter sub-circuit, and a single coil, where when the voltage converter can...
US-8,159,038 Self aligned silicided contacts
Structures and methods of forming self aligned silicided contacts are disclosed. The structure includes a gate electrode disposed over an active area, a liner...
US-8,159,022 Robust semiconductor device with an emitter zone and a field stop zone
A power semiconductor component is described. One embodiment provides a semiconductor body having an inner zone and an edge zone. A base zone of a first...
US-8,159,020 Non-volatile two transistor semiconductor memory cell and method for producing the same
The invention relates to a nonvolatile two-transistor semiconductor memory cell and an associated fabrication method, source and drain regions (2 ) for a...
US-8,158,478 Strained semiconductor device and method of making same
In a method of making a semiconductor device, a gate dielectric is formed over the semiconductor body. A floating gate is formed over the gate dielectric, an...
US-8,158,046 Mold apparatus and method
An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and...
US-8,156,643 Semiconductor device
A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip...
US-8,155,916 Semiconductor component and method of determining temperature
One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor...
US-8,155,596 Radio communication device and method for processing measurement control information in a communication device
In various embodiments, a communication device and a method for processing measurement control information in a communication device are provided. In an...
US-8,154,356 Oscillator with capacitance array
An oscillator is provided which comprises an array of capacitances. At least some capacitances in the array have different capacitance values.
US-8,154,281 Sensor system wherein spinning phases of the spinning current hall sensor are lengthened in residual offset...
A system including a spinning current Hall sensor and a chopping circuit. The spinning current Hall sensor is configured to provide input signals and the...
US-8,154,114 Power semiconductor module
A power semiconductor module is disclosed. One embodiment includes a multilayer substrate having a plurality of metal layers and a plurality of ceramic layers,...
US-8,154,090 Non-volatile two-transistor semiconductor memory cell and method for producing the same
The invention relates to a nonvolatile semiconductor memory cell and to an associated fabrication method, a source region (7), a drain region (8) and a channel...
US-8,154,049 ESD protection apparatus and electrical circuit including same
An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a...
US-8,153,335 Lithography masks, systems, and manufacturing methods
Lithography masks, lithography systems, methods of manufacturing lithography masks, methods of altering material layers of semiconductor devices, and methods of...
US-8,151,270 Method and apparatus for time-sliced and multi-threaded data processing in a communication system
A method for designing a time-sliced and multi-threaded architecture comprises the steps of conducting a thorough analysis of a range of applications and...
US-8,149,601 Adaptive slope compensation method for stabilizing a continuous conduction mode converter
An embodiment of the invention relates to a power converter operable in a continuous conduction mode and a discontinuous conduction mode that includes a...
US-8,149,600 System and method for ringing suppression in a switched mode power supply
In one embodiment, a method of operating a switched-mode power supply having a switch coupled to a drive signal is disclosed. The method includes shutting off...
US-8,149,080 Integrated circuit including inductive device and ferromagnetic material
An integrated circuit includes a substrate and an inductive device on a first side of the substrate. The integrated circuit includes a first ferromagnetic...
US-8,148,958 System and method for transmitting current sharing information among paralleled power trains
An embodiment of the invention relates to a power control device configured to provide current-sharing control in a power converter including a plurality of...
US-8,148,845 Circuit assembly including a power semiconductor module and a controller
A circuit assembly includes a power semiconductor module and, arranged externally thereto, a controller wherein the power semiconductor module comprises at...
US-8,148,821 Dense seed layer and method of formation
Methods of forming dense seed layers and structures thereof are provided. Seed layers including a monolayer of molecules having a density of about 0.5 or...
US-8,148,257 Semiconductor structure and method for making same
One or more embodiments relate to a method of forming an electronic device, comprising: providing a workpiece; forming a first barrier layer over the workpiece;...
US-8,148,235 Methods of manufacturing semiconductor devices
Methods of forming air gaps between interconnects of integrated circuits and structures thereof are disclosed. A first insulating material is deposited over a...
US-8,148,227 Method for providing a self-aligned conductive structure
An embodiment according to the present invention comprises a method for providing a self-aligned conductive structure comprising providing a first structure on...
US-8,148,210 Method for fabricating a semiconductor chip panel
The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus...
US-8,148,198 Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base...
A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled...
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