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Patent # Description
US-8,933,569 Pressure contact arrangement and method for producing a pressure contact arrangement
A pressure contact arrangement includes a pressure contact device having an upper contact piece and a lower contact piece, one or more vertical first...
US-8,933,555 Semiconductor chip package
A semiconductor chip package is disclosed. One embodiment provides at least one semiconductor chip including contact elements on a first surface of the chip. An...
US-8,933,533 Solid-state bidirectional switch having a first and a second power-FET
According to an embodiment, a solid-state bidirectional switch includes a first and a second power field-effect transistor electrically connected anti-serial...
US-8,933,448 Wafers and chips comprising test structures
Wafers with chips thereon and corresponding chips are provided where test structures or parts thereof are provided in a peripheral chip area of the chip....
US-8,932,476 Porous metal etching
Apparatuses and methods are provided where porous metal is deposited on a substrate, a mask is provided on the porous metal and then an etching is performed.
US-8,930,657 Method and apparatus for realtime detection of heap memory corruption by buffer overruns
One embodiment of the present invention relates to a heap overflow detection system that includes an arithmetic logic unit, a datapath, and address violation...
US-8,928,297 uk based current source
Disclosed is a uk based current source, a control circuit for a uk based current source, and a method for providing a current.
US-8,928,140 Method of manufacturing an electronic system
A method of manufacturing an electronic system. One embodiment provides a semiconductor chip having a first main face and a second main face opposite to the...
US-8,928,066 Integrated circuit with power and sense transistors
An integrated circuit may include a semiconductor portion with a power transistor including first gate trenches that cross a first region and a sense transistor...
US-8,927,419 Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer...
A method can be used for locally rendering a carbonic isolating layer conductive. In one embodiment, a laser beam is directed onto the carbonic isolating layer...
US-8,924,672 Device with processing unit and information storage
Embodiments related to a processing unit and a first information storage are described and depicted. First information is provided from a first unit into a...
US-8,922,411 Configurable hardware-sharing multi-channel ADC
Representative implementations of devices and techniques provide configurable multi-channel analog-to-digital conversion. In a multi-channel analog-to-digital...
US-8,922,331 Communication including a request signal and reply signal
A controller unit is configured to transmit a request signal. A sensor is configured to transmit a reply signal in response to the request signal, the reply...
US-8,922,207 Electronic device comprising hall effect region with three contacts
An electronic device is disclosed as a part of a magnetic field sensor or a mechanical stress sensor. The electronic device includes a Hall effect region, a...
US-8,922,030 Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module
A semiconductor module is provided which is well protected against corrosion and/or other damage which can be caused by moisture and/or other harmful substances...
US-8,922,016 Method for producing a composite material, associated composite material and associated semiconductor circuit...
A method for producing a composite material, associated composite material and associated semiconductor circuit arrangements is disclosed. A plurality of first...
US-8,921,979 Method for producing a semiconductor layer
A method for producing a semiconductor layer is disclosed. One embodiment provides for a semiconductor layer on a semiconductor substrate containing oxygen....
US-8,921,974 Semiconductor manufacturing and semiconductor device with semiconductor structure
Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.
US-8,921,956 MEMS device having a back plate with elongated protrusions
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate...
US-8,921,954 Method of providing a semiconductor structure with forming a sacrificial structure
A method for providing a semiconductor structure includes forming a sacrificial structure by etching a plurality of trenches from a first main surface of a...
US-8,921,931 Semiconductor device with trench structures including a recombination structure and a fill structure
A semiconductor body of a semiconductor device includes a doped layer of a first conductivity type and one or more doped zones of a second conductivity type....
US-8,921,166 Structure and method for placement, sizing and shaping of dummy structures
A chip includes a number a plurality of functional areas of a layer and a number of dummy structures within the layer. The dummy structures are spaced from the...
US-8,918,702 Semiconductor memory having non-standard form factor
A semiconductor memory chip including error correction circuitry configured to receive data words from an external device, each data word comprising a binary...
US-8,918,679 Apparatus and method for checking an error detection functionality of a data processor
An apparatus for checking an error detection functionality of a data processing circuit, comprising an arithmetic logic unit, which provides an output datum...
US-8,918,610 Protection of chips against attacks
A chip including a processor for performing a predetermined operation, a provider for providing a clock signal, with which the processor is clocked, a counter...
US-8,918,597 Digital data inversion flag generator circuit
An integrated circuit includes an array of memory cells and a digital flag generator circuit configured to generate a data inversion flag based on whether a...
US-8,917,875 Method for driving loudspeakers
A circuit for operating loudspeakers includes a first, second, third and fourth loudspeaker circuit, having one input each for injecting a signal and one output...
US-8,917,195 System including feedback circuit with digital chopping circuit
A system including a first circuit, a second circuit, and a feedback circuit. The first circuit is configured to provide input signals. The second circuit is...
US-8,917,135 Circuit with a plurality of diodes and method for controlling such a circuit
A circuit includes a diode circuit and a deactivation circuit. The diode circuit includes a first terminal, a second terminal, and a plurality of diodes coupled...
US-8,917,120 Semiconductor device having a switchable element
A semiconductor device arrangement and a method. One embodiment includes at least one power transistor and at least one gate resistor located between a gate of...
US-8,916,968 Multichip power semiconductor device
An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted...
US-8,916,958 Semiconductor package with multiple chips and substrate in metal cap
A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are...
US-8,916,909 Semiconductor device and method for fabricating a semiconductor device
A semiconductor device is disclosed. In one embodiment, the semiconductor device includes two different semiconductor materials. The two semiconductor materials...
US-8,916,873 Photodetector with controllable spectral response
A photodetector includes a semiconductor substrate having an irradiation zone configured to generate charge carriers having opposite charge carrier types in...
US-8,916,474 Semiconductor modules and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor module includes a first semiconductor package having a first semiconductor die, which...
US-8,916,453 Method for manufacturing an electronic component
A semiconductor wafer includes a first main face and a second main face opposite to the first main face and a number of semiconductor chip regions. The wafer is...
US-8,915,153 Double die sensor
One embodiment of the present invention relates to a device, such as a sensor device. The device includes a sensor die and a circuit die. The sensor die...
US-8,914,682 Apparatus and method for the protection and for the non-destructive testing of safety-relevant registers
The present invention enables a safety management of safety measures as well as the non-destructive testing of safety-relevant registers which are required for...
US-8,914,621 Processing unit that detects manipulations thereof, device comprising two processing units, method for testing...
A processing unit having a control unit configured to execute after a reset phase a sequence of test instructions to detect a manipulation of the processing...
US-8,914,589 Multi-port DRAM architecture for accessing different memory partitions
Embodiments of the invention provide a memory device that may be accessed by a plurality of controllers or processor cores via respective ports of the memory...
US-8,913,704 Method and system for jitter reduction
Embodiments relate to systems and methods for reducing jitter caused by frequency modulation of a clock signal including modulating the frequency of the clock...
US-8,913,435 Method and device for programming data into non-volatile memories
A device includes a non-volatile memory and a control unit, wherein the control unit is configured to change over programming of data of the non-volatile memory...
US-8,912,833 Device and method for pulse width modulation
A device and a method for pulse width modulation is disclosed, wherein the temporal occurrence of both the respectively rising and the respectively falling...
US-8,912,775 Power factor correction circuit having multiple switched-mode converter circuits
A power factor correction circuit is provided which may include a first switched-mode converter circuit comprising a first inductor, at least one second...
US-8,912,638 Semiconductor device with hollow structure
A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.
US-8,912,635 Semiconductor device package and method of making a semiconductor device package
A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a...
US-8,912,450 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a...
A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second...
US-8,912,087 Method of fabricating a chip package
A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing...
US-8,912,047 Method for producing a metal layer on a substrate and device
A method produces a metal layer on a semiconductor substrate. A metal layer is produced on the semiconductor substrate by depositing metal particles. The metal...
US-8,910,006 Systems and methods for regulating delay between network interfaces
One embodiment relates to a method of processing data in a transmitter. In the method, a timestamp is generated for a data unit. The data unit is stored in a...
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