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Alignment marks for polarized light lithography and method for use thereof
Mark and method for integrated circuit fabrication with polarized light lithography. A preferred embodiment comprises a first plurality of elements comprised of...
Semiconductor device and manufacturing method
A semiconductor device and manufacturing method is disclosed. One embodiment provides a common substrate of a first conductivity type and at least two wells of...
Method of making bipolar FinFET technology
One or more embodiments relate to a method, comprising forming an implant on a substrate surface; selectively etching the wafer surface to form an elongated fin...
Control of a pseudo random number generator and a consumer circuit coupled
A system having a pseudo random number generator, a control circuit being configured to increase a quality of a pseudo random number output signal of the pseudo...
Data processing apparatus and method for transmitting data in a data
A data processing apparatus and method for transmitting data in a data processing apparatus are provided. A data processing apparatus provided has a data input...
Overload protection for a circuit arrangement having a transistor
In an embodiment, a drive circuit for a transistor includes an output for providing a drive signal to the transistor. The drive circuit monitors the transistor...
Methods and apparatus for a power supply with sequentially-activated
segmented power switch
Methods and apparatus for a power supply according various aspects of the present invention operate in conjunction with a voltage converter for converting an...
Integrated coolant circuit arrangement, operating method and production
An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is provided. At least one integrated electronic component is...
Semiconductor module having deflecting conductive layer over a spacer
A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to...
On-chip RF shields with front side redistribution lines
A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution...
CMOS transistor with dual high-k gate dielectric and method of manufacture
A CMOS device with transistors having different gate dielectric materials and a method of manufacture thereof. A CMOS device is formed on a workpiece having a...
Semiconductor ESD device and method of making same
A semiconductor device includes an SCR ESD device region disposed within a semiconductor body, and a plurality of first device regions of the first conductivity...
Method for producing a stop zone in a semiconductor body and semiconductor
component having a stop zone
A method for producing a buried stop zone in a semiconductor body and a semiconductor component having a stop zone, the method including providing a...
Semiconductor component and production method
A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a...
Bonding material with exothermically reactive heterostructures
A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the...
Calculating unit for reducing an input number with respect to a modulus
A calculating unit for reducing an input number with respect to a modulus, wherein the input number has input number portions of different significances,...
Capacitive object recognition using adjustable electrode
A system for capacitive object recognition including a pair of electrodes, one of the electrodes having an adjustable parameter, and a controller modeling...
Dual-band antenna including a shorted loop slot antenna and a spiral antenna.
Method and system for converting time intervals
A method and a system for converting time intervals are provided. In one embodiment, the system comprises a first time-to-digital converter having a first...
Integrated circuit with magnetic material magnetically coupled to
magneto-resistive sensing element
An integrated circuit including a first magneto-resistive sensing element, magnetic material and a spacer. The magnetic material is situated laterally to the...
Methods and systems for magnetic field sensing
One embodiment relates to a sensor. The sensor includes a first magnet having a first surface and a second magnet having a second surface. A differential...
Method for producing a semiconductor wafer with rear side identification
A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a...
Formation of active area using semiconductor growth process without STI
A semiconductor device can be formed without use of an STI process. An insulating layer is formed over a semiconductor body. Portions of the insulating layer...
Cross-talk mitigation in global navigation satellite systems
Embodiments related to cross-talk mitigation are described and depicted.
Semiconductor device with integrated coils
A semiconductor device with a number of integrated coils is disclosed. In one embodiment, a first coil portion and a second coil portion are at least in part...
Power switch with an overcurrent protection device
A power circuit includes a power transistor for feeding a load current to a load, a measuring transistor for coupling out a measurement current dependent on the...
The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at...
Integrated semiconductor outline package
A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a...
Semiconductor component and method for producing the same
A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the...
Integrated circuit package assembly including wave guide
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a...
On-chip RF shields with through substrate conductors
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, the system on a chip includes an RF component disposed...
System and method for constructing shielded seebeck temperature difference
An embodiment of the invention relates to a Seebeck temperature difference sensor that may be formed in a trench on a semiconductor device. A portion of the...
Semiconductor devices and methods of manufacture thereof
Methods of forming transistors and structures thereof are disclosed. A preferred embodiment comprises a semiconductor device including a workpiece, a gate...
Semiconductor device having a semiconductor chip, and method for the
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the...
Method and device for producing a bondable area region on a carrier
A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by...
Security device, secure memory system and method using a security device
A security device including a first external interface; a second external interface; and a security controller connected to said first external interface and...
Rectifier circuit with a voltage sensor
A rectifier circuit with a synchronously controlled semiconductor element comprising at least one field effect transistor with a control electrode and two...
System and method for adapting clocking pulse widths for DC-to-DC
A system and method for adapting a width of a clocking pulse for clocking a DC-DC converter, wherein the width of the clocking pulse is selected based upon the...
Semiconductor module arrangement
A semiconductor arrangement has a silicon body with a first surface and a second surface and a thick metal layer arranged on at least one surface of the silicon...
Panel, semiconductor device and method for the production thereof
A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in...
Metallization for chip scale packages in wafer level packaging
In one embodiment, a method for forming the semiconductor device includes forming a first trench from a front side of a substrate. The substrate has a front...
Calibration and verification structures for use in optical proximity
A method of training an Optical Proximity Correction (OPC) model comprises symmetrizing a complex design to be a test pattern having orthogonal symmetry....
Method for determining the type of a mobile radio base station; radio
communication terminal and network...
In an embodiment, a method for determining the type of a mobile radio base station is provided. The method may include receiving a synchronization message...
Electronic device with a programmable resistive element and a method for
blocking a device
One or more embodiments relate to an electronic device comprising a circuitry and a programmable resistive element. The programmable resistive element comprises...
Power semiconductor module featuring resiliently supported substrates and
method for fabricating a power...
The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor...
Chip card having an adjustable demodulation unit
The present invention shows a contactless chip card comprising a controllable demodulation unit for demodulating an amplitude-modulated carrier signal, a...
Crack sensors for semiconductor devices
Crack sensors for semiconductor devices, semiconductor devices, methods of manufacturing semiconductor devices, and methods of testing semiconductor devices are...
Combining two or more DC to DC converters to limit external coils
This disclosure relates to a voltage converter including a control circuit, a converter sub-circuit, and a single coil, where when the voltage converter can...
Self aligned silicided contacts
Structures and methods of forming self aligned silicided contacts are disclosed. The structure includes a gate electrode disposed over an active area, a liner...
Robust semiconductor device with an emitter zone and a field stop zone
A power semiconductor component is described. One embodiment provides a semiconductor body having an inner zone and an edge zone. A base zone of a first...