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Patent # Description
US-8,564,098 Controlling the recombination rate in a bipolar semiconductor component
Disclosed is a method for controlling the recombination rate in the base region of a bipolar semiconductor component, and a bipolar semiconductor component.
US-8,564,088 Semiconductor device having variably laterally doped zone with decreasing concentration formed in an edge region
In a semiconductor body, a semiconductor device has an active region with a vertical drift section of a first conduction type and a near-surface lateral well of...
US-8,564,061 Semiconductor device
A semiconductor device has elongate plug structures extending in the lateral direction. The plug structures serve as electrical lines in order to enable locally...
US-8,564,026 Chip, method for producing a chip and device for laser ablation
In various embodiments, a chip may include a substrate; a coating, the coating covering the substrate at least partially and the coating being designed for...
US-8,563,387 Transistor and method of manufacturing a transistor
In accordance with an embodiment of the present invention a transistor is disclosed. The transistor comprises a collector, a base and an emitter, wherein a...
US-8,563,364 Method for producing a power semiconductor arrangement
In a method for producing a power semiconductor arrangement, a dielectric insulation carrier with a top side and a top metallization layer arranged on the top...
US-8,563,357 Method of packaging a die
A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment...
US-8,300,628 Method and system for transmitting supplementary data, and communication terminal
Method for transmitting supplementary data whose content relates to a communication session which has been set up or terminated to a communication terminal, in...
US-8,299,910 Intelligent tire systems and methods
Embodiments relate to intelligent tire systems and methods. In an embodiment, a sensor module mounted in a tire includes a sensor configured to generate sensor...
US-8,299,856 Power transistor output match network with high Q RF path and low Q low frequency path
A power circuit includes a power device, an output match network and a bypass network. The output match network is coupled to an output of the power device and...
US-8,299,824 System providing a switched output signal and a high resolution output signal
A system including a sensing system, a first chopped circuit, a second chopped circuit, and a clock generator. The sensing system is configured to provide...
US-8,299,820 Circuit including a resistor arrangement for actuation of a transistor
A circuit for actuation of a transistor. One embodiment provides an actuation output for connection to the actuation connection of the transistor. A measurement...
US-8,299,771 Methods and systems for driving a load
In one embodiment, a circuit can selectively adjust a current for driving a load. The circuit includes a sensor configured to measure a magnetic field...
US-8,299,729 System and method for non-linear dimming of a light source
In one embodiment, a light dimming module is disclosed. The light dimming module has a dimming engine coupled to a digital input interface and an output...
US-8,299,585 Power semiconductor device
A power semiconductor device having a first active semiconductor component and a second active semiconductor component, the electrical connections of which are...
US-8,298,953 Method for defining a separating structure within a semiconductor device
A method includes depositing a material layer over a semiconductor substrate and using a first mask in a first exposure/patterning process to pattern the...
US-8,298,932 Vertical interconnect structure, memory device and associated production method
The present invention relates to a method for producing a vertical interconnect structure, a memory device and an associated production method, in which case,...
US-8,298,867 Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring...
A power semiconductor module is fabricated by providing a circuit substrate with a metal surface and an insulating substrate comprising an insulation carrier...
US-8,298,730 Semiconductor devices and methods of manufacturing thereof
Semiconductor devices, methods of manufacturing thereof, lithography masks, and methods of designing lithography masks are disclosed. In one embodiment, a...
US-8,296,581 Secure processor arrangement having shared memory
Processor arrangement having a first processor, a second processor, and at least one memory configured to be shared by the first processor and the second...
US-8,296,093 Semiconductor device with thermal fault detection
A semiconductor device includes a semiconductor chip including an active area. A temperature sensor arrangement provides a measurement signal dependent on the...
US-8,294,206 Integrated circuit device and method for its production
An integrated circuit device includes a semiconductor body fitted with a first electrode and a second electrode on opposite surfaces. A control electrode on an...
US-8,293,586 Method of manufacturing an electronic system
A method of manufacturing an electronic system. One embodiment provides a semiconductor chip having a first main face and a second main face opposite to the...
US-8,290,151 Device and method for determining an inverse of a value related to a modulus
A device for determining an inverse of an initial value related to a modulus, comprising a unit configured to process an iterative algorithm in a plurality of...
US-8,290,094 Methods and systems for measuring data pulses
Some embodiments disclosed herein relate to a method. In the method, a duration of a first synchronization pulse is measured. A fixed, predetermined number of...
US-8,289,733 Adaptive frequency jitter for controller
In order to convert an input power to one or more DC power levels that are provided to an output load, some aspects of the present disclosure relate to...
US-8,289,019 Sensor
A sensor including a substrate and magnetic material. The substrate has a main major surface and includes at least two spaced apart ferromagnetic layers. The...
US-8,288,813 Integrated memory device having columns having multiple bit lines
A memory device using tunneling field effect transistors (TFET) and buried bit lines is presented. The memory device includes a matrix containing rows and...
US-8,288,258 Method for producing a semiconductor
A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the...
US-8,288,230 Method for producing a gate electrode structure
A transistor with a gate electrode structure is produced by providing a semiconductor body with a first surface, and with a first sacrificial layer extending in...
US-8,288,207 Method of manufacturing semiconductor devices
A method of manufacturing a semiconductor device. The method includes providing a metal carrier, attaching chips to the carrier, and applying a metal layer over...
US-8,283,756 Electronic component with buffer layer
An electronic component includes a metal substrate, a semiconductor chip configured to be attached to the metal substrate, and a buffer layer positioned between...
US-8,283,742 Thin-wafer current sensors
Embodiments relate to IC current sensors fabricated using thin-wafer manufacturing technologies. Such technologies can include processing in which dicing before...
US-8,278,893 System including an offset voltage adjusted to compensate for variations in a transistor
A system including a first transistor, a first capacitor and a circuit. The first transistor has a first control input and is configured to regulate an output...
US-8,278,840 Sigma delta current source and LED driver
A circuit arrangement includes a first light emitting diode and a second light emitting diode emitting light of different colors arranged adjacent to each other...
US-8,278,749 Integrated antennas in wafer level package
A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding...
US-8,278,730 High voltage resistance coupling structure
The disclosed invention provides a structure and method for providing a high lateral voltage resistance between the electrical networks, sharing a lateral...
US-8,278,727 Pressure sensor and method
A method for providing a pressure sensor substrate comprises creating a first cavity that extends inside the substrate in a first direction perpendicular to a...
US-8,278,707 Field effect transistors having a double gate structure
A field effect transistor includes two channel connection regions, a control region with at least two control sections, an active region that is formed as a...
US-8,275,123 Integrated data transceiver and sensor for the generation of a symmetrical cryptographic key
Systems for exchanging encrypted data communications between devices. A system can comprise a first device and a second device. The first device can comprise a...
US-8,274,132 Electrical device and fabrication method
An electrical device with a fin structure, a first section of the fin structure having a first width and a first height, a second section of the fin structure...
US-8,274,109 Semiconductor device with dynamical avalanche breakdown characteristics and method for manufacturing a...
A semiconductor device includes a semiconductor substrate having at least a pn-junction arranged in the semiconductor substrate. At least a field electrode is...
US-8,273,658 Integrated circuit arrangement including vias having two sections, and method for producing the same
An integrated circuit arrangement containing a via is disclosed. The via has an upper section having greatly inclined sidewalls. A lower section of the via has...
US-8,273,622 Semiconductor with a dynamic gate-drain capacitance
A semiconductor device with a dynamic gate drain capacitance. One embodiment provides a semiconductor device. The device includes a semiconductor substrate, a...
US-8,273,584 Light emitting diode
A semiconductor device including a wafer-level LED includes a semiconductor structure coupled to first and second electrodes. The semiconductor includes a...
US-8,272,574 Document for personal identification having protection against external manipulations and a method for producing
A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the...
US-8,271,841 Circuitry and method for an at-speed scan test
A method for testing an integrated circuit to detect delay faults resulting from a signal path from a first block of the integrated circuit to a second block of...
US-8,271,816 System and method for statistics recording of power devices
A system and method for statistics recording of power devices is disclosed. A power circuit includes a power device to provide a specified electrical power to a...
US-8,271,568 Digital filter
Methods and apparatuses in which a first stage of a digital filter receives input data to be filtered, the first stage of a digital filter operating at a first...
US-8,270,231 Configurable embedded processor
A configurable processor architecture uses a common simulation database for multiple processor configurations to reduce the cost of producing customized...
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