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Patent # Description
US-8,952,545 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
One aspect is a device including a carrier comprising a first conducting layer, a first insulating layer over the first conducting layer, and at least one first...
US-8,952,521 Semiconductor packages with integrated antenna and method of forming thereof
In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A...
US-8,952,489 Semiconductor package and method for fabricating the same
A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within...
US-8,952,487 Electronic circuit arrangement
An electronic circuit arrangement in accordance with some embodiments has a substrate, the substrate including: a plurality of metallization layers located one...
US-8,952,478 Radiation conversion device and method of manufacturing a radiation conversion device
A radiation conversion device such as a photovoltaic cell, a photodiode or a semiconductor radiation detection device, includes a semiconductor portion with...
US-8,952,421 RF power HEMT grown on a silicon or SiC substrate with a front-side plug connection
A compound semiconductor device includes a plurality of high-resistance crystalline silicon epitaxial layers and a plurality of activated dopant regions...
US-8,951,915 Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip...
A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole...
US-8,951,879 Method for producing a protective structure
A method for producing a protective structure may include: providing a semiconductor base substrate with a doping of a first conductivity type; producing a...
US-8,951,841 Clip frame semiconductor packages and methods of formation thereof
In one embodiment, a semiconductor package includes a clip frame with a first clip having a first support structure, a first lever, and a first contact portion,...
US-8,948,280 Clock determination for a sensor
A method for determining a clock for a sensor signal which has a synchronization signal, which method involves a control unit measuring the period between a...
US-8,947,894 Switched mode power supply including a flyback converter with primary side control
A method and apparatus for controlling a flyback converter are presented. The flyback converter includes a transformer, a semiconductor switch coupled to a...
US-8,947,886 Electronic component
An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip...
US-8,947,842 Temperature evaluation circuit
An electronic circuit includes a temperature evaluation circuit. The temperature evaluation circuit includes a first sensor circuit with a first output terminal...
US-8,947,664 Apparatus and method for aligning a wafer's backside to a wafer's frontside
Structures of a backside of a wafer can be aligned to structures of a frontside of the wafer for a lithographic treatment of the backside. The wafer is...
US-8,947,285 ADC with noise-shaping SAR
Representative implementations of devices and techniques provide analog to digital conversion of analog inputs. A multistage comparator using a feed-forward...
US-8,947,126 System, drivers for switches and methods for synchronizing measurements of analog-to-digital converters
A driver for a switch includes a primary side having a trigger input and a secondary side comprising an analog-to-digital converter (ADC). The primary side and...
US-8,947,064 System and method for driving an electronic switch dependent on temperature
An electronic switch is connected in series with a load dependent on an input signal. The electronic switch is operated in a first operation mode for a first...
US-8,947,048 Power supply system with charge balancing
A power supply system includes a first charge storage. A series circuit with a plurality of n charge storage modules is connected between load terminals. A...
US-8,946,995 LED driver circuit
A semiconductor chip includes an LED driver circuit operably coupled to at least one LED and configured to supply a load current to the at least one LED such...
US-8,946,943 High side switch
A semiconductor chip includes at least one power semiconductor switch configured to activate and deactivate current conduction from a first supply terminal,...
US-8,946,902 Device and method for manufacturing a device
A device includes a semiconductor chip including a frontside, a backside, and a side surface extending from the backside to the frontside. The side surface...
US-8,946,872 Method for producing a semiconductor
A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the...
US-8,946,867 Semiconductor component with optimized edge termination
A semiconductor component includes a two-sided semiconductor body, an inner zone with a basic doping of a first conduction type, and two semiconductor zones....
US-8,946,850 Integrated circuit including a power transistor and an auxiliary transistor
In one embodiment of an integrated circuit, the integrated circuit includes a power transistor with a power control terminal, a first power load terminal and a...
US-8,946,823 Electrostatic discharge protection element and electrostatic discharge protection chip and method of producing...
An electrostatic discharge (ESD) protection element includes a collector area, a first barrier area, a semiconductor area, a second barrier area and an emitter...
US-8,946,817 Semiconductor device with compensation regions
A semiconductor device includes a semiconductor body including an inner region, and an edge region, a first doped device region of a first doping type in the...
US-8,946,787 Reduced charge transistor
Representative implementations of devices and techniques provide a reduced charge transistor arrangement. The capacitance and/or charge of a transistor...
US-8,946,767 Monolithic semiconductor switches and method for manufacturing
A semiconductor device and method are disclosed. One embodiment provides a semiconductor die with a first n-type channel FET and a second n-type channel FET. A...
US-8,946,074 Method of making interconnect structure
A method of forming a semiconductor device, comprising: providing a Si-containing layer; forming a barrier layer over said Si-containing layer, said barrier...
US-8,946,037 Methods for producing a tunnel field-effect transistor
A method for producing a tunnel field-effect transistor is disclosed. Connection regions of different doping types are produced by means of self-aligning...
US-8,946,034 Strained semiconductor device and method of making the same
In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate...
US-8,945,990 Chip package and method of forming the same
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip...
US-8,943,303 Monitoring circuit with a window watchdog
A method of monitoring a processing circuit is disclosed. The processing circuit is operable, in a normal operation mode, to generate a sequence of trigger...
US-8,943,251 System and method for processing device with differentiated execution mode
In accordance with an embodiment of the present invention, a method of operating a system includes operating in a first operating mode to not permit access to...
US-8,942,949 Apparatus and method for determining a state parameter of an object to be monitored
An apparatus for determining a state parameter of an object to be monitored includes a means for providing a plurality of measurement values, wherein the...
US-8,941,404 System and method for testing a power supply controller
In accordance with an embodiment, a method of testing a power supply controller includes detecting whether an external switch is coupled between a first supply...
US-8,941,217 Semiconductor device having a through contact
A semiconductor device includes a semiconductor substrate having a first side and a second side opposite the first side, an active area and a through contact...
US-8,941,206 Semiconductor device including a diode and method of manufacturing a semiconductor device
A semiconductor device includes a transistor cell array in the semiconductor body of a first conductivity type. The semiconductor device further includes a...
US-8,941,188 Semiconductor arrangement with a superjunction transistor and a further device integrated in a common...
A semiconductor arrangement includes a semiconductor body and a power transistor arranged in a first device region of the semiconductor body. The power...
US-8,941,148 Semiconductor device and method
A semiconductor device is disclosed. One embodiment includes a lateral HEMT (High Electron Mobility Transistor) structure with a heterojunction between two...
US-8,941,035 Soldering method
A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering...
US-8,940,603 Method of making semiconductor device
A semiconductor device and method of making a semiconductor device are disclosed. A semiconductor body, a floating gate poly and a source/drain region are...
US-8,939,028 Integrated sensors and sensing methods
Embodiments relate to integrated sensors and sensing methods. Embodiments relate to integrated sensor layouts. Embodiments are configured to maximize a ratio of...
US-8,937,380 Die edge protection for pressure sensor packages
A semiconductor package includes a lead spaced apart from a semiconductor die. The die includes a diaphragm disposed at a first side of the die and is...
US-8,936,995 Methods of fabricating isolation regions of semiconductor devices and structures thereof
Methods of fabricating isolation regions of semiconductor devices and structures thereof are disclosed. In a preferred embodiment, a semiconductor device...
US-8,935,590 Circuitry and method for multi-bit correction
A circuitry is provided that includes a memory including a plurality of memory cells, wherein at least one of the plurality of memory cells of the memory is...
US-8,934,597 Multiple delay locked loop integration system and method
A delay locked loop (DLL) circuit having an expanded operating frequency range is achieved by providing multiple DLLs, each having a different range of...
US-8,933,722 Measuring device and a method for measuring a chip-to-chip-carrier connection
A measuring device is provided, the measuring device including: a power supply to provide electric power to a chip via at least one of a chip connection and a...
US-8,933,721 Power source arrangement and method of diagnosing a power source arrangement
An embodiment method of diagnosing a power source arrangement includes a plurality of n power sources connected in series between output terminals, wherein...
US-8,933,647 LED controller with current-ripple control
An LED controller and a method for controlling an LED device is disclosed. A current sense signal is representative of a load current flowing through the LED...
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