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Patent # Description
US-8,946,074 Method of making interconnect structure
A method of forming a semiconductor device, comprising: providing a Si-containing layer; forming a barrier layer over said Si-containing layer, said barrier...
US-8,946,037 Methods for producing a tunnel field-effect transistor
A method for producing a tunnel field-effect transistor is disclosed. Connection regions of different doping types are produced by means of self-aligning...
US-8,946,034 Strained semiconductor device and method of making the same
In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate...
US-8,945,990 Chip package and method of forming the same
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip...
US-8,943,303 Monitoring circuit with a window watchdog
A method of monitoring a processing circuit is disclosed. The processing circuit is operable, in a normal operation mode, to generate a sequence of trigger...
US-8,943,251 System and method for processing device with differentiated execution mode
In accordance with an embodiment of the present invention, a method of operating a system includes operating in a first operating mode to not permit access to...
US-8,942,949 Apparatus and method for determining a state parameter of an object to be monitored
An apparatus for determining a state parameter of an object to be monitored includes a means for providing a plurality of measurement values, wherein the...
US-8,941,404 System and method for testing a power supply controller
In accordance with an embodiment, a method of testing a power supply controller includes detecting whether an external switch is coupled between a first supply...
US-8,941,217 Semiconductor device having a through contact
A semiconductor device includes a semiconductor substrate having a first side and a second side opposite the first side, an active area and a through contact...
US-8,941,206 Semiconductor device including a diode and method of manufacturing a semiconductor device
A semiconductor device includes a transistor cell array in the semiconductor body of a first conductivity type. The semiconductor device further includes a...
US-8,941,188 Semiconductor arrangement with a superjunction transistor and a further device integrated in a common...
A semiconductor arrangement includes a semiconductor body and a power transistor arranged in a first device region of the semiconductor body. The power...
US-8,941,148 Semiconductor device and method
A semiconductor device is disclosed. One embodiment includes a lateral HEMT (High Electron Mobility Transistor) structure with a heterojunction between two...
US-8,941,035 Soldering method
A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering...
US-8,940,603 Method of making semiconductor device
A semiconductor device and method of making a semiconductor device are disclosed. A semiconductor body, a floating gate poly and a source/drain region are...
US-8,939,028 Integrated sensors and sensing methods
Embodiments relate to integrated sensors and sensing methods. Embodiments relate to integrated sensor layouts. Embodiments are configured to maximize a ratio of...
US-8,937,380 Die edge protection for pressure sensor packages
A semiconductor package includes a lead spaced apart from a semiconductor die. The die includes a diaphragm disposed at a first side of the die and is...
US-8,936,995 Methods of fabricating isolation regions of semiconductor devices and structures thereof
Methods of fabricating isolation regions of semiconductor devices and structures thereof are disclosed. In a preferred embodiment, a semiconductor device...
US-8,935,590 Circuitry and method for multi-bit correction
A circuitry is provided that includes a memory including a plurality of memory cells, wherein at least one of the plurality of memory cells of the memory is...
US-8,934,597 Multiple delay locked loop integration system and method
A delay locked loop (DLL) circuit having an expanded operating frequency range is achieved by providing multiple DLLs, each having a different range of...
US-8,933,722 Measuring device and a method for measuring a chip-to-chip-carrier connection
A measuring device is provided, the measuring device including: a power supply to provide electric power to a chip via at least one of a chip connection and a...
US-8,933,721 Power source arrangement and method of diagnosing a power source arrangement
An embodiment method of diagnosing a power source arrangement includes a plurality of n power sources connected in series between output terminals, wherein...
US-8,933,647 LED controller with current-ripple control
An LED controller and a method for controlling an LED device is disclosed. A current sense signal is representative of a load current flowing through the LED...
US-8,933,569 Pressure contact arrangement and method for producing a pressure contact arrangement
A pressure contact arrangement includes a pressure contact device having an upper contact piece and a lower contact piece, one or more vertical first...
US-8,933,555 Semiconductor chip package
A semiconductor chip package is disclosed. One embodiment provides at least one semiconductor chip including contact elements on a first surface of the chip. An...
US-8,933,533 Solid-state bidirectional switch having a first and a second power-FET
According to an embodiment, a solid-state bidirectional switch includes a first and a second power field-effect transistor electrically connected anti-serial...
US-8,933,448 Wafers and chips comprising test structures
Wafers with chips thereon and corresponding chips are provided where test structures or parts thereof are provided in a peripheral chip area of the chip....
US-8,932,476 Porous metal etching
Apparatuses and methods are provided where porous metal is deposited on a substrate, a mask is provided on the porous metal and then an etching is performed.
US-8,930,657 Method and apparatus for realtime detection of heap memory corruption by buffer overruns
One embodiment of the present invention relates to a heap overflow detection system that includes an arithmetic logic unit, a datapath, and address violation...
US-8,928,297 uk based current source
Disclosed is a uk based current source, a control circuit for a uk based current source, and a method for providing a current.
US-8,928,140 Method of manufacturing an electronic system
A method of manufacturing an electronic system. One embodiment provides a semiconductor chip having a first main face and a second main face opposite to the...
US-8,928,066 Integrated circuit with power and sense transistors
An integrated circuit may include a semiconductor portion with a power transistor including first gate trenches that cross a first region and a sense transistor...
US-8,927,419 Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer...
A method can be used for locally rendering a carbonic isolating layer conductive. In one embodiment, a laser beam is directed onto the carbonic isolating layer...
US-8,924,672 Device with processing unit and information storage
Embodiments related to a processing unit and a first information storage are described and depicted. First information is provided from a first unit into a...
US-8,922,411 Configurable hardware-sharing multi-channel ADC
Representative implementations of devices and techniques provide configurable multi-channel analog-to-digital conversion. In a multi-channel analog-to-digital...
US-8,922,331 Communication including a request signal and reply signal
A controller unit is configured to transmit a request signal. A sensor is configured to transmit a reply signal in response to the request signal, the reply...
US-8,922,207 Electronic device comprising hall effect region with three contacts
An electronic device is disclosed as a part of a magnetic field sensor or a mechanical stress sensor. The electronic device includes a Hall effect region, a...
US-8,922,030 Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module
A semiconductor module is provided which is well protected against corrosion and/or other damage which can be caused by moisture and/or other harmful substances...
US-8,922,016 Method for producing a composite material, associated composite material and associated semiconductor circuit...
A method for producing a composite material, associated composite material and associated semiconductor circuit arrangements is disclosed. A plurality of first...
US-8,921,979 Method for producing a semiconductor layer
A method for producing a semiconductor layer is disclosed. One embodiment provides for a semiconductor layer on a semiconductor substrate containing oxygen....
US-8,921,974 Semiconductor manufacturing and semiconductor device with semiconductor structure
Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.
US-8,921,956 MEMS device having a back plate with elongated protrusions
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate...
US-8,921,954 Method of providing a semiconductor structure with forming a sacrificial structure
A method for providing a semiconductor structure includes forming a sacrificial structure by etching a plurality of trenches from a first main surface of a...
US-8,921,931 Semiconductor device with trench structures including a recombination structure and a fill structure
A semiconductor body of a semiconductor device includes a doped layer of a first conductivity type and one or more doped zones of a second conductivity type....
US-8,921,166 Structure and method for placement, sizing and shaping of dummy structures
A chip includes a number a plurality of functional areas of a layer and a number of dummy structures within the layer. The dummy structures are spaced from the...
US-8,918,702 Semiconductor memory having non-standard form factor
A semiconductor memory chip including error correction circuitry configured to receive data words from an external device, each data word comprising a binary...
US-8,918,679 Apparatus and method for checking an error detection functionality of a data processor
An apparatus for checking an error detection functionality of a data processing circuit, comprising an arithmetic logic unit, which provides an output datum...
US-8,918,610 Protection of chips against attacks
A chip including a processor for performing a predetermined operation, a provider for providing a clock signal, with which the processor is clocked, a counter...
US-8,918,597 Digital data inversion flag generator circuit
An integrated circuit includes an array of memory cells and a digital flag generator circuit configured to generate a data inversion flag based on whether a...
US-8,917,875 Method for driving loudspeakers
A circuit for operating loudspeakers includes a first, second, third and fourth loudspeaker circuit, having one input each for injecting a signal and one output...
US-8,917,195 System including feedback circuit with digital chopping circuit
A system including a first circuit, a second circuit, and a feedback circuit. The first circuit is configured to provide input signals. The second circuit is...
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