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Patent # Description
US-8,983,097 Adjustable ventilation openings in MEMS structures
A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure...
US-8,983,068 Masked nonlinear feedback shift register
An NLFSR of length k, configured to output a sequence of masked values x'.sub.i=x.sub.i+m.sub.i according to a masked recurrence x'.sub.n+k=f(x'.sub.n, . . . ,...
US-8,981,932 Apparatus comprising a pair of an alarm condition generator and an associated alarm circuit, chip card, and method
An apparatus includes a pair of an alarm condition generator and an associated alarm circuit and a test circuit. The alarm circuit is configured to generate an...
US-8,981,836 Charge pumps with improved latchup characteristics
Some embodiments relate to charge pump regulators to selectively activate a charge pump based not only on the voltage output of the charge pump, but also on a...
US-8,981,820 Driver circuit
Devices and methods are provided in which a driver is supplied via a first current path and a second current path which can comprise a switching element.
US-8,981,763 Di/dt current sensing
A circuit includes a power circuit and a current sensing circuit. The power circuit has a main current loop. The current sensing circuit is spaced apart from...
US-8,981,553 Power semiconductor module with integrated thick-film printed circuit board
A power semiconductor module includes a first printed circuit board having a first insulation carrier, and a first upper metallization and a first lower...
US-8,981,545 Explosion-protected semiconductor module
A semiconductor module includes an electrically conductive lower contact piece and an electrically conductive upper contact piece spaced apart from one another...
US-8,981,520 Semiconductor device with an edge termination structure
A semiconductor device having a semiconductor die and an edge termination structure is provided. The semiconductor die includes an outer edge and an active area...
US-8,981,504 Vertical hall sensor with series-connected hall effect regions
A vertical Hall sensor includes first and second vertical Hall effect regions in a semiconductor substrate, with first and second pluralities of contacts...
US-8,980,714 Semiconductor device with buried gate electrode structures
A method of manufacturing a semiconductor device includes introducing at least a first and a second trench pattern from a first surface into a semiconductor...
US-8,980,687 Semiconductor device and method of manufacturing thereof
A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer...
US-8,979,362 Circuit and method for sensing a physical quantity, an oscillator circuit, a smartcard, and a...
A circuit for sensing a physical quantity according to an embodiment of the present invention includes a first oscillator circuit configured to provide a first...
US-8,977,668 Calculating unit for reducing an input number with respect to a modulus
A calculating unit for reducing an input number with respect to a modulus, wherein the input number has input number portions of different significances,...
US-8,977,210 Radio-frequency circuit
A radio-frequency circuit has a signal processing unit for processing a symmetrical input signal, two signal inputs for receiving the symmetrical input signal,...
US-8,977,198 Communication method between electronic appliances, and corresponding appliances
A communication method for the communication between two appliances which are set up for communication in a first communication mode is provided. The method...
US-8,976,496 Electrostatic discharge blocking circuits
Techniques and architectures corresponding to electrostatic discharge blocking circuits are described.
US-8,976,051 Floating point timer techniques
Aspects of the present disclosure relate to floating point timers and counters that are used in a variety of contexts. In some implementations, a floating point...
US-8,975,972 Oscillator system
An oscillator system includes a first oscillator, a second oscillator, and a changeover component. The first oscillator is configured to generate a first signal...
US-8,975,915 Driver circuit for a digital signal transmitting bus
A driver circuit for a digital signal transmitting bus includes a main switch. The main switch is connected to the bus, is controllable by the digital signal to...
US-8,975,889 Current difference sensors, systems and methods
Embodiments relate to current difference sensors, systems and methods. In an embodiment, a current difference sensor includes first and second conductors...
US-8,975,735 Redistribution board, electronic component and module
A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a...
US-8,975,721 Integrated circuit having an edge passivation and oxidation resistant layer and method
An integrated circuit having a semiconductor component arrangement and production method is provided. The integrated circuit includes a semiconductor material...
US-8,975,715 Photodetector and method for manufacturing the same
A photodetector includes a substrate and an insulating arrangement formed in the substrate. The insulating arrangement electrically insulates a confined region...
US-8,975,711 Device including two power semiconductor chips and manufacturing thereof
A device includes a first power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face....
US-8,975,696 Lateral MOS power transistor having backside terminal electrode
A semiconductor component may include a semiconductor layer which has a front side and a back side, a first terminal electrode on the front side, a second...
US-8,975,688 Semiconductor device with voltage compensation structure
A voltage compensation structure includes a first semiconductor or insulating material disposed along one or more sidewalls of a trench formed in a doped...
US-8,975,662 Method of manufacturing a semiconductor device using an impurity source containing a metallic recombination...
Source zones of a first conductivity type and body zones of a second conductivity type are formed in a semiconductor die. The source zones directly adjoin a...
US-8,975,640 Heterojunction semiconductor device and manufacturing method
A heterojunction semiconductor device having a semiconductor body is provided. The semiconductor body includes a first semiconductor region comprising aluminum...
US-8,975,612 Integrated circuits with magnetic core inductors and methods of fabrications thereof
In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is...
US-8,975,151 Semiconductor body with a buried material layer and method
One aspect includes a method for forming a buried material layer in a semiconductor body, including providing a semiconductor body having a first side and...
US-8,975,136 Manufacturing a super junction semiconductor device
A super junction semiconductor device includes a semiconductor portion with a first surface and a parallel second surface. A doped layer of a first conductivity...
US-8,975,117 Semiconductor device using diffusion soldering
A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the...
US-8,975,107 Method of manufacturing a semiconductor device comprising a membrane over a substrate by forming a plurality of...
In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface...
US-8,972,216 Methods and apparatus for calibration of power converters
Methods and apparatus for a power regulator according to various aspects of the present invention may comprise a sensor adapted to generate a measurement of a...
US-8,971,398 System and method for generating a radio frequency pulse-width modulated signal
In an embodiment, a method of producing a multi-level RF signal includes producing plurality of pulse-width modulated signals based on an input signal. The...
US-8,971,390 Power saving in a communication device
A communication device includes an application data interface, a first communication layer and a physical media interface. The first communication layer...
US-8,971,206 Self synchronizing data communication method and device
A method of receiving a data transmission includes detecting a first switching of a transmission signal to a first signal value, starting a duration measurement...
US-8,971,134 Memory controller comprising adjustable transmitter impedance
Memory controllers, memory devices and methods are provided in which test data is transmitted and signal parameters are varied. The transmitted test data is...
US-8,971,080 Circuit arrangement with a rectifier circuit
A circuit arrangement includes a rectifier circuit having a first and a second load terminal, a first semiconductor device having a load path and a control...
US-8,970,408 Built-in-self-test for an analog-to-digital converter
A semiconductor chip with a built-in-self-test circuit including a first analog-to-digital converter (ADC) configured to convert an analog input voltage signal...
US-8,970,323 Circuit arrangement with an antenna switch and a bandstop filter and corresponding method
Implementations are presented herein that include an antenna switch that includes a plurality of ports. A bandstop filter is coupled to at least one of the...
US-8,970,308 Input match network with RF bypass path
A power circuit includes a RF transistor and an input match network coupled to an input to the RF transistor and to an input to the power circuit. The input...
US-8,970,295 System and method for a power amplifier
In accordance with an embodiment, a system includes a first amplifier and a first bandpass filter having an input coupled in series with an output of the first...
US-8,970,262 Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor...
Disclosed is a semiconductor device arrangement including a first semiconductor device having a load path, and a plurality of second transistors, each having a...
US-8,970,196 Mode control circuit for DC-DC converter
Representative implementations of devices and techniques determine when a dc to dc converter switches from a first mode of operation to a second mode of...
US-8,970,032 Chip module and method for fabricating a chip module
The chip module includes a semiconductor chip having a first contact element on a first main face and a second contact element on a second main face. The...
US-8,970,008 Wafer and integrated circuit chip having a crack stop structure
A wafer has a number of IC areas and a kerf area arranged between the IC areas. The kerf area has a dicing area, a crack stop structure arranged between an IC...
US-8,970,000 Signal transmission arrangement
A signal transmission arrangement is disclosed. A voltage converter includes a signal transmission arrangement.
US-8,969,985 Semiconductor chip package and method
A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a...
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