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System and method for a phase detector
In accordance with an embodiment, a phase detector circuit includes a plurality of cascaded RF stages that each has a first RF amplifier and a second RF...
Determining the dead time in driving a half-bridge
Disclosed is a circuit arrangement for determining a temporal change of an output voltage of a half-bridge circuit during a dead time. In one embodiment, the...
Method and circuit for LED driver dimming
An LED driver includes a transformer, current control loop and current adjustment circuit. The primary side of the transformer transfers energy to the secondary...
Method of packaging a die
A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment...
PCB based RF-power package window frame
A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal attached to the die...
Stress-inducing structures, methods, and materials
Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a...
A semiconductor device includes a transistor array, including first transistors and second transistors. Gate electrodes of the first transistors are disposed in...
Stress-reduced field-effect semiconductor device and method for forming
A field-effect semiconductor device is provided. The field-effect semiconductor device includes a semiconductor body with a first surface defining a vertical...
Semiconductor arrangement with an integrated hall sensor
A semiconductor arrangement includes a semiconductor body and a semiconductor device, the semiconductor device including first and second load terminals...
Method of separating semiconductor die using material modification
A method for separating semiconductor die includes forming a porous region on a semiconductor wafer and separating the die at the porous region using mechanical...
Method for fabricating a semiconductor device
A semiconductor device and a method for making a semiconductor device are disclosed. In an embodiment a semiconductor device includes a semiconductor chip and a...
Identification of contactless cards
A communication system includes at least one contactless card configured to transmit an encoded identifier; and a reader configured to receive the encoded...
Contactless data reception using a cancellation circuit
A contactless device including a transmission antenna configured to transmit a transmission signal; a pickup antenna configured to detect a field generated by a...
Reader application device
A communication system including a reader application device having a reader application, and a reader configured to operate under control of the reader...
Method and apparatus for storing data in solid state memory
A method and a storage device for storing data in a flash memory drive are disclosed. In order to increase data throughput, the drive includes a cache memory...
Configurable system for cancellation of the mean value of a modulated
Some embodiments of the invention relate to a DC offset correction circuit comprising a feedback loop having a DAC controlled by a reconfigurable ADC, which...
In accordance with an embodiment, a description is given of a storage circuit including an input stage configured to provide a value to be stored, a storage...
Angle measurement system for determining an angular position of a rotating
Some aspects of the present disclosure relate to techniques for measuring an angular position of a rotating shaft. As will be described in greater detail below,...
Methods and apparatus for DC-DC conversion using digitally controlled
adaptive pulse frequency modulation
A method and apparatus for regulating voltage comprising calculating a first PFM on time and a second PFM on time and selecting one the PFM on times according...
Embedded chip package, a chip package, and a method for manufacturing an
embedded chip package
An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least...
Integrated circuit arrangement with an auxiliary indentation, particularly
with aligning marks
An integrated circuit arrangement is disclosed having a wiring indentation and an auxiliary indentation in a dielectric layer. The wiring indentation contains a...
Semiconductor device and manufacturing method
A semiconductor device includes a drift zone of a first conductivity type formed within a semiconductor body, wherein one side of opposing sides of the drift...
Method for manufacturing a marked single-crystalline substrate and
semiconductor device with marking
A method for manufacturing a marked single-crystalline substrate comprises providing a single-crystalline substrate comprising a first material, the...
Semiconductor device with first and second field-effect structures and an
integrated circuit including the...
A semiconductor device includes a source metallization and a semiconductor body. The semiconductor body includes a first field-effect structure including a...
Semiconductor device including first and second semiconductor elements
A semiconductor device includes a first semiconductor element including a first pn junction between a first terminal and a second terminal. The semiconductor...
Charge compensation semiconductor device
A semiconductor device includes a semiconductor body having a first surface defining a vertical direction and a source metallization arranged on the first...
Schottky diodes having metal gate electrodes and methods of formation
In one embodiment, the semiconductor device includes a first doped region disposed in a first region of a substrate. A first metal electrode having a first...
Super junction semiconductor device with overcompensation zones
According to an embodiment, a super junction semiconductor device may be manufactured by introducing impurities of a first impurity type into an exposed surface...
Self-doped ohmic contacts for compound semiconductor devices
A compound semiconductor device is manufactured by forming an III-nitride compound semiconductor device structure on a silicon-containing semiconductor...
A semiconductor device includes a wafer having a first surface opposite a second surface, and at least one laser irradiated region between the first and second...
Error tolerant flip-flops
One embodiment of the present invention relates to an error tolerant memory circuit having a low hardware overhead that can tolerate both single volatile soft...
RF switch circuit including a series connection of a plurality of
transistors, RF switch including an RF switch...
An RF switch circuit for switching RF signals includes a first terminal and a second terminal and a series connection of a plurality of transistors between the...
Fractional-N phase locked loop
A frequency division circuit with a rational-valued division ratio includes a frequency divider with a selectable integer-valued division ratio supplied with an...
Integrated circuit including sensor having injection molded magnetic
An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
Semiconductor module comprising an insert
A power semiconductor module is fabricated by providing a base with a metal surface and an insulating substrate comprising an insulation carrier having a bottom...
Semiconductor module having a semiconductor chip stack and method
A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with...
Transistor arrangement with a MOSFET
A semiconductor arrangement includes a MOSFET having a source region, a drift region and a drain region of a first conductivity type, a body region of a second...
Integrated circuit using a superjunction semiconductor device
In an embodiment, an apparatus includes a source region, a gate region and a drain region supported by a substrate, and a drift region including a plurality of...
Monolithically integrated HEMT and current protection device
A transistor device includes a high electron mobility field effect transistor (HEMT) and a protection device. The HEMT has a source, a drain and a gate. The...
Method for forming laterally varying doping concentrations and a
A method for forming a laterally varying n-type doping concentration is provided. The method includes providing a semiconductor wafer with a first surface, a...
Normally-off compound semiconductor tunnel transistor
Disclosed herein are embodiments of a normally-off compound semiconductor tunnel field effect transistor having a drive current above 100 mA per mm of gate...
Conductive lines and pads and method of manufacturing thereof
A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer...
Power semiconductor arrangement and method for producing a power
In a method for producing a power semiconductor arrangement, an insulation carrier with a top side, a metallization, and a contact pin with a first end are...
Identification circuit and method for generating an identification bit
using physical unclonable functions
An embodiment of the present invention is an identification circuit installed on an integrated circuit for generating an identification bit, comprising a first...
Transmission gate and control circuit for transmission gate inputs
A transmission gate includes first and second transmission path terminals, a series connection of first and second field effect transistors (FETs), and a...
Integrated circuit having a semiconductor substrate with barrier layer
An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic...
Connection element for a semiconductor component and method for producing
A connection element is arranged on a connection area of a semiconductor component. The connection element includes at least one bonding wire portion fixed on...
Semiconductor device with field electrode and method
A semiconductor device with a field electrode and method. One embodiment provides a controllable semiconductor device including a control electrode for...
Semiconductor structure and method for making same
One or more embodiments relate to a method for forming a semiconductor structure, comprising: providing a workpiece; forming a dielectric barrier layer over the...
A method of manufacturing an array of semiconductor devices comprises providing a first carrier having multiple chip alignment regions. Multiple chips are...