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A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering...
Method of making semiconductor device
A semiconductor device and method of making a semiconductor device are disclosed. A semiconductor body, a floating gate poly and a source/drain region are...
Integrated sensors and sensing methods
Embodiments relate to integrated sensors and sensing methods. Embodiments relate to integrated sensor layouts. Embodiments are configured to maximize a ratio of...
Die edge protection for pressure sensor packages
A semiconductor package includes a lead spaced apart from a semiconductor die. The die includes a diaphragm disposed at a first side of the die and is...
Methods of fabricating isolation regions of semiconductor devices and
Methods of fabricating isolation regions of semiconductor devices and structures thereof are disclosed. In a preferred embodiment, a semiconductor device...
Circuitry and method for multi-bit correction
A circuitry is provided that includes a memory including a plurality of memory cells, wherein at least one of the plurality of memory cells of the memory is...
Multiple delay locked loop integration system and method
A delay locked loop (DLL) circuit having an expanded operating frequency range is achieved by providing multiple DLLs, each having a different range of...
Measuring device and a method for measuring a chip-to-chip-carrier
A measuring device is provided, the measuring device including: a power supply to provide electric power to a chip via at least one of a chip connection and a...
Power source arrangement and method of diagnosing a power source
An embodiment method of diagnosing a power source arrangement includes a plurality of n power sources connected in series between output terminals, wherein...
LED controller with current-ripple control
An LED controller and a method for controlling an LED device is disclosed. A current sense signal is representative of a load current flowing through the LED...
Pressure contact arrangement and method for producing a pressure contact
A pressure contact arrangement includes a pressure contact device having an upper contact piece and a lower contact piece, one or more vertical first...
Semiconductor chip package
A semiconductor chip package is disclosed. One embodiment provides at least one semiconductor chip including contact elements on a first surface of the chip. An...
Solid-state bidirectional switch having a first and a second power-FET
According to an embodiment, a solid-state bidirectional switch includes a first and a second power field-effect transistor electrically connected anti-serial...
Wafers and chips comprising test structures
Wafers with chips thereon and corresponding chips are provided where test structures or parts thereof are provided in a peripheral chip area of the chip....
Porous metal etching
Apparatuses and methods are provided where porous metal is deposited on a substrate, a mask is provided on the porous metal and then an etching is performed.
Method and apparatus for realtime detection of heap memory corruption by
One embodiment of the present invention relates to a heap overflow detection system that includes an arithmetic logic unit, a datapath, and address violation...
uk based current source
Disclosed is a uk based current source, a control circuit for a uk based current source, and a method for providing a current.
Method of manufacturing an electronic system
A method of manufacturing an electronic system. One embodiment provides a semiconductor chip having a first main face and a second main face opposite to the...
Integrated circuit with power and sense transistors
An integrated circuit may include a semiconductor portion with a power transistor including first gate trenches that cross a first region and a sense transistor...
Chip comprising an integrated circuit, fabrication method and method for
locally rendering a carbonic layer...
A method can be used for locally rendering a carbonic isolating layer conductive. In one embodiment, a laser beam is directed onto the carbonic isolating layer...
Device with processing unit and information storage
Embodiments related to a processing unit and a first information storage are described and depicted. First information is provided from a first unit into a...
Configurable hardware-sharing multi-channel ADC
Representative implementations of devices and techniques provide configurable multi-channel analog-to-digital conversion. In a multi-channel analog-to-digital...
Communication including a request signal and reply signal
A controller unit is configured to transmit a request signal. A sensor is configured to transmit a reply signal in response to the request signal, the reply...
Electronic device comprising hall effect region with three contacts
An electronic device is disclosed as a part of a magnetic field sensor or a mechanical stress sensor. The electronic device includes a Hall effect region, a...
Moisture-tight semiconductor module and method for producing a
moisture-tight semiconductor module
A semiconductor module is provided which is well protected against corrosion and/or other damage which can be caused by moisture and/or other harmful substances...
Method for producing a composite material, associated composite material
and associated semiconductor circuit...
A method for producing a composite material, associated composite material and associated semiconductor circuit arrangements is disclosed. A plurality of first...
Method for producing a semiconductor layer
A method for producing a semiconductor layer is disclosed. One embodiment provides for a semiconductor layer on a semiconductor substrate containing oxygen....
Semiconductor manufacturing and semiconductor device with semiconductor
Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.
MEMS device having a back plate with elongated protrusions
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate...
Method of providing a semiconductor structure with forming a sacrificial
A method for providing a semiconductor structure includes forming a sacrificial structure by etching a plurality of trenches from a first main surface of a...
Semiconductor device with trench structures including a recombination
structure and a fill structure
A semiconductor body of a semiconductor device includes a doped layer of a first conductivity type and one or more doped zones of a second conductivity type....
Structure and method for placement, sizing and shaping of dummy structures
A chip includes a number a plurality of functional areas of a layer and a number of dummy structures within the layer. The dummy structures are spaced from the...
Semiconductor memory having non-standard form factor
A semiconductor memory chip including error correction circuitry configured to receive data words from an external device, each data word comprising a binary...
Apparatus and method for checking an error detection functionality of a
An apparatus for checking an error detection functionality of a data processing circuit, comprising an arithmetic logic unit, which provides an output datum...
Protection of chips against attacks
A chip including a processor for performing a predetermined operation, a provider for providing a clock signal, with which the processor is clocked, a counter...
Digital data inversion flag generator circuit
An integrated circuit includes an array of memory cells and a digital flag generator circuit configured to generate a data inversion flag based on whether a...
Method for driving loudspeakers
A circuit for operating loudspeakers includes a first, second, third and fourth loudspeaker circuit, having one input each for injecting a signal and one output...
System including feedback circuit with digital chopping circuit
A system including a first circuit, a second circuit, and a feedback circuit. The first circuit is configured to provide input signals. The second circuit is...
Circuit with a plurality of diodes and method for controlling such a
A circuit includes a diode circuit and a deactivation circuit. The diode circuit includes a first terminal, a second terminal, and a plurality of diodes coupled...
Semiconductor device having a switchable element
A semiconductor device arrangement and a method. One embodiment includes at least one power transistor and at least one gate resistor located between a gate of...
Multichip power semiconductor device
An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted...
Semiconductor package with multiple chips and substrate in metal cap
A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are...
Semiconductor device and method for fabricating a semiconductor device
A semiconductor device is disclosed. In one embodiment, the semiconductor device includes two different semiconductor materials. The two semiconductor materials...
Photodetector with controllable spectral response
A photodetector includes a semiconductor substrate having an irradiation zone configured to generate charge carriers having opposite charge carrier types in...
Semiconductor modules and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor module includes a first semiconductor package having a first semiconductor die, which...
Method for manufacturing an electronic component
A semiconductor wafer includes a first main face and a second main face opposite to the first main face and a number of semiconductor chip regions. The wafer is...
Double die sensor
One embodiment of the present invention relates to a device, such as a sensor device. The device includes a sensor die and a circuit die. The sensor die...
Apparatus and method for the protection and for the non-destructive
testing of safety-relevant registers
The present invention enables a safety management of safety measures as well as the non-destructive testing of safety-relevant registers which are required for...
Processing unit that detects manipulations thereof, device comprising two
processing units, method for testing...
A processing unit having a control unit configured to execute after a reset phase a sequence of test instructions to detect a manipulation of the processing...
Multi-port DRAM architecture for accessing different memory partitions
Embodiments of the invention provide a memory device that may be accessed by a plurality of controllers or processor cores via respective ports of the memory...