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Patent # Description
US-9,006,062 Method of manufacturing a semiconductor device including an edge area
A method of manufacturing a semiconductor device includes providing a doped layer containing a first dopant of a first conductivity type and forming a...
US-9,004,360 Contactless communication via a plurality of interfaces
A contactless communication device including an energy interface configured to activate the contactless communication device or a contactless communication...
US-9,003,234 Machine and methods for reassign positions of a software program based on a fail/pass performance
A machine and methods for reassign the execution order of program steps of a multi-step test program is disclosed. In an embodiment a machine for evaluating an...
US-9,003,198 Method and apparatus for data processing
A method for processing an operating sequence of instructions of a program in a processor, wherein each instruction is represented by an assigned instruction...
US-9,002,037 MEMS structure with adjustable ventilation openings
A MEMS structure includes a backplate, a membrane, and an adjustable ventilation opening configured to reduce a pressure difference between a first space...
US-9,001,952 Master slave interface
Implementations related to systems, devices, and methods that make use of a master slave arrangement are described. In one implementation, a method of reducing...
US-9,000,809 Method and device for sampling an input signal
In accordance with various embodiments, a method for sampling an input signal may be provided, wherein the method may include providing a single frequency clock...
US-9,000,763 3-D magnetic sensor
One embodiment of the present invention relates to a magnetic field sensor comprising a squat soft-magnetic body disposed on a surface of a substrate comprising...
US-9,000,597 Dummy structures and methods
A semiconductor device and a method of making a semiconductor device are disclosed. The method of manufacturing a semiconductor device comprises forming a...
US-9,000,580 Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with...
A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the...
US-9,000,531 Method and manufacture of transistor devices
A method of forming transistors and structures thereof. A CMOS device includes high k gate dielectric materials. A PMOS device includes a gate that is implanted...
US-9,000,520 Semiconductor device with an insulating structure for insulating an electrode from a semiconductor body
A semiconductor device includes an electrode arranged on a main surface of a semiconductor body and an insulating structure insulating the electrode from the...
US-8,999,826 Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate and...
Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate with a first and a second surface opposite the first...
US-8,999,783 Method for producing a semiconductor device with a vertical dielectric layer
A method for producing a semiconductor device is disclosed. The method includes providing a semiconductor body having a first surface, and a second surface...
US-8,999,758 Fixing semiconductor die in dry and pressure supported assembly processes
Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or...
US-8,999,756 Method and apparatus for semiconductor device fabrication using a reconstituted wafer
Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed...
US-8,999,187 Method for manufacturing a device on a substrate
A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure,...
US-RE45,449 Power semiconductor having a lightly doped drift and buffer layer
A power semiconductor element having a lightly doped drift and buffer layer is disclosed. One embodiment has, underneath and between deep well regions of a...
US-8,996,931 System and method to transmit data, in particular error data over a bus system
The invention relates to an electrical or electronic system, and more specifically, to a system with a bus, and a method to transmit data, in particular error...
US-8,996,926 DMA integrity checker
Some embodiments relate to a Direct Memory Access (DMA) controller. The DMA controller includes a set of transaction control registers to receive a sequence of...
US-8,995,690 Microphone and method for calibrating a microphone
A microphone and a method for calibrating a microphone are disclosed. In one embodiment the method for calibrating a microphone comprises operating a MEMS...
US-8,995,158 Circuit arrangement with a rectifier circuit
A rectifier circuit includes first and second load terminals, a first semiconductor device having a load path and configured to receive a drive signal, and a...
US-8,994,943 Selectivity by polarization
Representative implementations of devices and techniques provide selectivity for imaging devices and systems. Polarization may be applied to emitted light...
US-8,994,563 Signal converter and method for operating a signal converter
In accordance with an embodiment, a method for operating a signal converter includes converting an analog input signal to a digital output signal, comprising by...
US-8,994,526 Sensor interface making use of virtual resistor techniques
Some embodiments of the present disclosure relate to a sensor interface module. The sensor interface module includes a comparator having a first comparator...
US-8,994,413 Method for driving power semiconductor switches
A method for driving a controllable power semiconductor switch, having a first input terminal and first and second output terminals coupled to a voltage supply...
US-8,994,411 System and method for bootstrapping a switch driver
In accordance with an embodiment, a driver circuit includes a low-side driver having a first output configured to be coupled to a control node of a first...
US-8,994,179 Semiconductor device and method for making same
One or more embodiments relate to a semiconductor device that includes: a conductive layer including a sidewall; a conductive capping layer disposed over the...
US-8,994,161 Semiconductor device package and methods for producing same
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts...
US-8,994,148 Device bond pads over process control monitor structures in a semiconductor die
A semiconductor die includes a semiconductor substrate having an edge region surrounding an active region, the active region containing devices of an integrated...
US-8,994,127 Method of fabricating isolating semiconductor structures using a layout of trenches and openings
Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.
US-8,994,113 Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device formed in a semiconductor substrate includes an isolation trench in the semiconductor substrate to laterally insulate adjacent components...
US-8,994,078 Semiconductor device
A semiconductor device includes a cell region and a contact region, the cell region including a functional unit including a gate electrode, a source and a drain...
US-8,993,437 Method for etching substrate
One or more embodiments relate to a method of making a semiconductor structure, comprising: forming a patterned metallic layer over a semiconductor substrate;...
US-8,993,422 Process tools and methods of forming devices using process tools
In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber....
US-8,993,394 Micro-electromechanical system devices
Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer...
US-8,993,381 Method for forming a thin semiconductor device
A method for forming a thin semiconductor device is disclosed. In one embodiment, a lead frame is provided over a carrier. At least one semiconductor chip is...
US-8,993,372 Method for producing a semiconductor component
Exemplary embodiments of a method for producing a semiconductor component having a polycrystalline semiconductor body region are disclosed, wherein the...
US-8,992,267 Connecting system for electrically connecting electronic devices and method for connecting an electrically...
A connecting system for electrically connecting electronic devices includes an electrically conductive first connector, an electrically conductive second...
US-8,991,711 Chip card module
In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first...
US-8,991,253 Microelectromechanical system
In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip...
US-8,990,744 Electrical measurement based circuit wiring layout modification method and system
The capacitance or inductance of electrical circuits is adjusted by measuring inductance or capacitance values of passive components fabricated on a first...
US-8,990,466 Arbiter for asynchronous state machines
An arbiter can be used for processing a plurality of asynchronous data signals. Each data signal is associated with a request signal and a respective...
US-8,989,680 Determining a state of a receiver on a transmission line
According to one aspect, a method is provided for determining a state of a receiver on a transmission line. The method may comprise, for example, evaluating a...
US-8,988,072 Vertical hall sensor with high electrical symmetry
A vertical Hall sensor includes a Hall effect region and a plurality of contacts formed in or on a surface of the Hall effect region. The plurality of contacts...
US-8,988,039 Power converter circuit
A power converter circuit includes input terminals configured to receive an input voltage and an input current and output terminals configured to provide an...
US-8,987,880 Chip module and a method for manufacturing a chip module
In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first...
US-8,987,879 Semiconductor device including a contact clip having protrusions and manufacturing thereof
A semiconductor device includes a leadframe with a die pad and a first lead, a semiconductor chip with a first electrode, and a contact clip with a first...
US-8,987,090 Method of manufacturing a semiconductor device with device separation structures
A method of manufacturing a semiconductor device includes introducing at least a first and a second trench pattern including array trenches from a first surface...
US-8,984,300 Secure operation of programmable devices
According to an embodiment, a programmable logic device includes a plurality of logic blocks, memory, a plurality of connection control elements and a logic...
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