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Patent # Description
US-1,020,4995 Normally off HEMT with self aligned gate structure
A heterostructure body with a buffer region, and a barrier region disposed on the buffer region is provided. A gate trench is formed in the barrier region. A...
US-1,020,4993 Power semiconductor device having a field electrode
A power semiconductor device includes: a semiconductor body for conducting a load current between first and second load terminals; source and channel regions...
US-1,020,4873 Breakable substrate for semiconductor die
In some examples, a device includes a substrate and a conductive pad extending through the substrate, wherein the substrate is coupled to the conductive pad at...
US-1,020,4845 Semiconductor chip package having a repeating footprint pattern
A semiconductor chip package includes a semiconductor chip disposed over a main surface of a carrier. An encapsulation body encapsulates the chip. First...
US-1,020,4804 Apparatuses and methods for gas mixed liquid polishing, etching, and cleaning
In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The...
US-1,020,3365 Device testing
A device may include a plurality of cells. Each cell may include a field-effect transistor and a switch configured to selectively connect a second contact of...
US-1,020,3224 Sensor package
A device for detecting an object is suggested comprising a magnetic field sensor, a magnet that is arranged to rotate in a vicinity of the magnetic field...
US-1,020,1087 Discrete device
A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal...
US-1,020,0801 System and method for a transducer
According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal...
US-1,020,0065 Apparatus and method for correcting at least one bit error within a coded bit sequence
An apparatus for correcting at least one bit error within a coded bit sequence includes an error syndrome generator and a bit error corrector. The error...
US-1,020,0028 Electric assembly including a reverse conducting switching device and a rectifying device
An electric assembly includes a reverse conducting switching device and a rectifying device. The reverse conducting switching device includes transistor cells...
US-1,019,9968 Fault handling for alternator control devices
In some examples, an alternator control device includes interface configured to receive a voltage signal from an engine control device, pull-down circuitry, and...
US-1,019,9928 Soft start of switched capacitor converters by reducing voltage provided by initial power switch
Circuits and methods are provided for soft-starting a switched-capacitor converter (SCC), so as to limit inrush current at the start-up of the SCC. This is...
US-1,019,9843 Connect/disconnect module for use with a battery pack
There are disclosed herein various implementations of a connect/disconnect module for use with a battery pack. The connect/disconnect module includes a...
US-1,019,9526 Radiation detector and a method for forming a semiconductor device
A method for forming a semiconductor device includes forming an amorphous semiconductor layer adjacent to a lightly doped region of a semiconductor wafer. The...
US-1,019,9514 Methods for manufacturing a semiconductor device having a non-ohmic contact formed between a semiconductor...
An embodiment of a method of manufacturing a semiconductor device includes providing a semiconductor material that comprises SiC and forming an electrically...
US-1,019,9491 Vertical transistor with improved robustness
A transistor is disclosed that includes a semiconductor body having a first horizontal surface. A drift region is arranged in the semiconductor body. A...
US-1,019,9490 Semiconductor device with a guard structure and corresponding methods of manufacture
A semiconductor device includes a guard structure located laterally between a first active area of a semiconductor substrate and a second active area of the...
US-1,019,9468 Methods for forming semiconductor devices, semiconductor devices and power semiconductor devices
A method for forming a semiconductor device includes forming a first insulation layer on a semiconductor substrate and forming a structured etch stop layer....
US-1,019,9456 Method of manufacturing a semiconductor device having a charge compensation region underneath a gate trench
A method of forming a semiconductor device is provided. The device includes a semiconductor substrate having a main surface and a rear surface vertically spaced...
US-1,019,9372 Monolithically integrated chip including active electrical components and passive electrical components with...
An integrated circuit device including a chip die having a first area with a first thickness surrounding a second area with a second thickness, the first...
US-1,019,9367 Semiconductor device
A semiconductor device includes a semiconductor body having opposite first and second surfaces. The semiconductor device further includes a transistor structure...
US-1,019,9334 Digital circuit and method for manufacturing a digital circuit
According to one embodiment, a method for manufacturing a digital circuit is described comprising forming a modified RS master latch with an output for...
US-1,019,9332 Method of manufacturing a semiconductor device comprising a support element and semiconductor device comprising...
A semiconductor device includes a power transistor in a semiconductor substrate portion, where the semiconductor substrate portion includes a central portion...
US-1,019,9330 Alignment mark arrangement, semiconductor workpiece, and method for aligning a wafer
In various embodiments, an alignment mark arrangement may include a plurality of alignment marks disposed next to each other in a row, wherein at least one of...
US-1,019,9291 Sensor for a semiconductor device
A semiconductor arrangement is presented. The semiconductor arrangement comprises a semiconductor body, the semiconductor body including a semiconductor drift...
US-1,019,9255 Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more...
US-1,019,9238 Semiconductor module cooling system
A cooling apparatus includes a discrete module and a plastic housing. The discrete module includes a semiconductor die encapsulated by a mold compound, a...
US-1,019,9216 Semiconductor wafer and method
In an embodiment, a method includes treating an edge region of a wafer including a substrate having an upper surface and one or more epitaxial Group III nitride...
US-1,019,8684 Smart card module, smart card, and method for producing a smart card module
A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a...
US-1,019,8332 System on chip integrity verification method and system
Methods and systems for checking the integrity of a system on chip (SOC) are described. The SOC can include a controller and one or more registers. Register...
US-1,019,7636 Extended fault indication and reporting in voltage regulator systems
A voltage regulator controller includes a first pin for receiving aggregate temperature information from a plurality of power stages, a plurality of second pins...
US-1,019,7599 Test pin configuration for test device for testing devices under test
A test pin for a test device for electrically contacting a device under test to be tested, wherein the test pin comprises an electrically conductive base...
US-1,019,7452 Determining a temperature
A temperature sensor may include at least one cell. Each one of the at least one cell may include a bi-stable flip-flop having a first branch and a second...
US-1,019,5704 Lift pin for substrate processing
Lift pins and devices having lift pins are provided. According to an aspect, a lift pin may have a tapered distal portion. According to another aspect, a lift...
US-1,019,4696 Electronic cigarette, liquid container, and method of operating an electronic cigarette
According to various embodiments, an electronic cigarette may be provided including a heater configured to vaporize a liquid; a mouth piece to deliver the...
US-1,019,4250 Sensor with movable parts and biasing
Methods and apparatuses are provided wherein a sensor which comprises at least two electrodes and a movable part is alternately biased with at least two...
US-1,019,4226 Device for detecting acoustic waves
A device for detecting acoustic waves may include a housing having a housing wall with an inner surface, and an acoustic wave sensor provided at least partially...
US-1,019,3573 Method and data processing device for determining an error vector in a data word
In various embodiments, a method for determining an error vector in a data word is provided. The method includes determining the syndrome of the error vector,...
US-1,019,3521 Adjustable impedance matching network
An impedance matching network includes a first terminal, a second terminal, and a reference potential terminal. The impedance matching network further includes...
US-1,019,3462 Power converter using bi-directional active rectifying bridge
Power converters that use bi-directional switches to rectify an AC power source, rather than diode bridges, are provided. In additional to performing...
US-1,019,3449 Buck voltage converter
A buck voltage converter is provided which is configured so that a dominant pole of an open loop transfer function of the buck voltage converter is a pole...
US-1,019,2974 Method for forming a semiconductor device and a semiconductor substrate
A method for forming a semiconductor device includes incorporating chalcogen dopant atoms into a semiconductor doping region of a semiconductor substrate of a...
US-1,019,2955 Semiconductor device containing oxygen-related thermal donors
A method of manufacturing a semiconductor device includes determining information that indicates an extrinsic dopant concentration and an intrinsic oxygen...
US-1,019,2849 Semiconductor modules with semiconductor dies bonded to a metal foil
A method of manufacturing semiconductor modules includes providing a metal composite substrate including a metal foil attached to a metal layer, the metal foil...
US-1,019,2846 Method of inserting an electronic component into a slot in a circuit board
In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in...
US-1,019,1871 Safe double buffering using DMA safe linked lists
In some embodiments, a DMA controller includes a set of transaction control registers configured to receive a linked list sequence of transaction control sets....
US-1,019,1795 Method and system for timeout monitoring
Embodiments relate to systems and methods for timeout monitoring of concurrent commands or parallel communication channels comprising assigning or de-assigning...
US-1,019,1143 Method and apparatus for calibrating an IQ modulator
The present disclosure relates to a concept for calibrating an IQ modulator. A calibration method comprises setting one or more control values of the IQ...
US-1,018,9699 MEMS device and MEMS vacuum microphone
In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low...
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