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Patent # Description
US-1,005,6365 Semiconductor device
A semiconductor device incudes a cell region and a contact region, the cell region including a functional unit including a gate electrode, a source and a drain...
US-1,005,6362 Multi-phase power converter with common connections
In some examples, a device comprises at least two semiconductor die, wherein each respective semiconductor die of the at least two semiconductor die comprises...
US-1,005,6348 Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip...
US-1,005,6305 Wafer arrangement, a method for testing a wafer, and a method for processing a wafer
According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component...
US-1,005,6295 Method for handling a product substrate, a bonded substrate system and a temporary adhesive
A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the...
US-1,005,6145 Resistive memory transition monitoring
A circuit for monitoring a resistive memory having an array of cells coupled between respective bitlines and respective wordlines. The circuit includes a...
US-1,005,5194 Operation based on two operands
A method for performing an operation based on at least two operands is proposed, in which steps of the operation are performed in time-randomized fashion. In...
US-1,005,2922 Magnetic sensor used for LF communication in TPMS application
A tire pressure monitoring system (TPMS) sensor and a communication method are provided. The TPMS sensor includes a microcontroller unit, a pressure sensor...
US-1,005,0649 Communication devices and methods
Devices and methods are provided where a first signal is provided via an interface, and a second signal is provided related to the suitability of the first...
US-1,005,0530 Method and apparatus for control adaptation in resonant-tapped inductor converters
A semi-resonant voltage converter has a synchronous rectification (SR) switch through which a half-cycle sinusoidal-like current is conducted when turned on. An...
US-1,005,0528 Current distribution in DC-DC converters
A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active...
US-1,005,0443 PFC controller add-on circuit to stabilize THDi performance
A total harmonic distortion (THDi) reduction circuit for a power factor correction (PFC) controller to control a PFC stage. The THDi reduction circuit...
US-1,005,0316 Communication between battery cells
A system includes a battery and a plurality of integrated circuits. The battery includes a plurality of battery cells. Each integrated circuit of the plurality...
US-1,005,0139 Semiconductor device including a LDMOS transistor and method
In an embodiment, a semiconductor device includes a semiconductor substrate having a front surface, a LDMOS transistor in the front surface, and a metallization...
US-1,005,0113 Semiconductor device with needle-shaped field plates and a gate structure with edge and node portions
A semiconductor device includes needle-shaped field plate structures extending from a first surface into transistor sections of a semiconductor portion in a...
US-1,004,9994 Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads...
US-1,004,9962 Arrangement of multiple power semiconductor chips and method of manufacturing the same
A semiconductor power arrangement includes a chip carrier having a first surface and a second surface opposite the first surface. The semiconductor power...
US-1,004,9914 Method for thinning substrates
According to various embodiments, a method may include: providing a substrate having a first side and a second side opposite the first side; forming a buried...
US-1,004,9912 Method of manufacturing a semiconductor device having a vertical edge termination structure
A method of manufacturing a semiconductor device includes forming a frame trench extending from a first surface into a base substrate, forming, in the frame...
US-1,004,9879 Self aligned silicon carbide contact formation using protective layer
A silicon-carbide substrate that includes: a doped silicon-carbide contact region directly adjoining a main surface of the substrate, and a dielectric layer...
US-1,004,9072 Method and apparatus for use in a data processing system
A method is described, for use in a data processing system, the system having a node and a communication link, wherein the communication link is coupled to the...
US-1,004,8328 Redundant magnetic angle sensor with improved accuracy
An angle sensor may comprise a first primary sensing element and a second primary sensing element. The first primary sensing element may be positioned adjacent...
US-1,004,8327 Sensor with micro break compensation
A sensor device includes a high voltage circuit, a sensor and a charge storage. The sensor utilizes a low voltage supply. The high voltage circuit includes a...
US-1,004,8297 Method and apparatus for measuring a disturbed variable
Provided are apparatuses and methods, in which a disturbed measurement variable is converted to a digital signal. The digital signal is then averaged over a...
US-1,004,8296 Detection of current change in an integrated circuit
An embodiment relates to an integrated circuit comprising measurement means for detection of a current change, wherein said measurement means comprise at least...
US-1,004,8091 Magnetic multimedia control element
A magnetic sensor may include a set of elements to detect a set of magnetic field strengths of a magnetic field generated by a magnet, and determine, based on...
US-1,004,4368 Sigma delta analog to digital converter
A sigma delta analog to digital converter for converting an analog input into a digital output comprises a reference path for receiving a reference voltage. The...
US-1,004,4255 Multiphase power supply and phase control
A multi-phase power supply circuit includes at least a first phase and a second phase (such as semi-resonant DC-DC power converter circuits), each of which...
US-1,004,4005 Electrode, an electronic device, and a method for manufacturing an optoelectronic device
According to various embodiments, an electrode may include at least one layer including a chemical compound including aluminum and titanium.
US-1,004,3866 Semiconductor device and a method for forming a semiconductor device
A method for forming a semiconductor device includes forming an oxide layer on a semiconductor substrate. A first portion of the oxide layer forms a gate oxide...
US-1,004,3782 Electronic device package having a dielectric layer and an encapsulant
A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip...
US-1,004,3768 Semiconductor device and method of manufacture thereof
A semiconductor device and a method of making a semiconductor device are disclosed. The semiconductor device comprises a redistribution layer arranged over a...
US-1,004,3750 Nanotube structure based metal damascene process
In various embodiments a method for manufacturing a metallization layer on a substrate is provided, wherein the method may include forming a plurality of groups...
US-1,004,3701 Substrate removal from a carrier
Methods and apparatuses are provided where a parting agent is applied to at least one portion of a substrate. The at least one portion of the substrate is...
US-1,004,3683 Plasma system, chuck and method of making a semiconductor device
A chuck, a system including a chuck and a method for making a semiconductor device are disclosed. In one embodiment the chuck includes a first conductive region...
US-1,004,3640 Process tools and methods of forming devices using process tools
In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber....
US-1,004,3126 Chip card module, chip card and method of forming a chip card module
In various embodiments, a chip card module for a chip card is provided. The chip card module may include a carrier with a first side and an opposite second...
US-1,004,2807 Differential bus receiver with four-quadrant input circuit
Systems, devices, methods, and techniques for bus receivers operable to provide a data output corresponding to a voltage differential provided on a...
US-1,004,2738 Lightweight trace based measurement systems and methods
An automotive electronics system includes an electronic control unit and a trace adapter. The electronic control unit is configured to receive measurement...
US-1,004,2693 Diverse integrated processing using processors and diverse firmware
Fault detection devices, systems and methods are provided which implement identical processors. A first processor is configured to receive a first measurement,...
US-1,004,2002 System and method for contact measurement circuit
According to an embodiment, a contact measurement circuit is configured to be coupled between a first contact and a second contact, and the contact measurement...
US-1,004,1979 Method of sensing current flowing in a power module
A method of sensing current flowing in a power module is provided. The module includes a first substrate having a metallized side, a second substrate spaced...
US-1,004,1973 Method and apparatus for dynamic alignment of semiconductor devices
A semiconductor device is aligned by placing the semiconductor device in a nest between first and second sections of the nest when the nest is in a receiving...
US-1,004,1839 Thermal observer and overload protection for power switches
The present disclosure proposes the placing of temperature sensors embedded in the power semiconductor device. In this, at least one of the embedded temperature...
US-1,003,8404 Adaptive biasing control for radio frequency power amplifiers
Techniques are provided for adapting a bias provided to a radio frequency (RF) power amplifier (PA), so as to achieve linear operation over a wide range of...
US-1,003,8105 Semiconductor devices, a semiconductor diode and a method for forming a semiconductor device
A semiconductor device includes at least one highly doped region of an electrical device arrangement formed in a semiconductor substrate and a contact structure...
US-1,003,8087 Semiconductor device and transistor cell having a diode region
According to an embodiment of a semiconductor device, the device includes a semiconductor body with a drift region and neighboring device cells integrated in...
US-1,003,8085 High electron mobility transistor with carrier injection mitigation gate structure
A method includes providing a heterostructure body with a buffer region, and a barrier region disposed on the buffer region, and forming a gate structure for...
US-1,003,8052 Semiconductor device with channelstopper and method for producing the same
A vertical semiconductor device comprises a substrate having a front surface and a back surface, an active area (AA) located in the substrate, having a drift...
US-1,003,8051 Vertical potential short in the periphery region of a III-nitride stack for preventing lateral leakage
A semiconductor die includes a substrate and a semiconductor body supported by the substrate and having a periphery which is devoid of active devices and...
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