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Patent # Description
US-9,991,340 Mechanical stress-decoupling in semiconductor device
According to a method in semiconductor device fabrication, a first trench and a second trench are concurrently etched in a semi-finished semiconductor device....
US-9,991,252 Semiconductor device comprising electrostatic discharge protection structure
A semiconductor device includes a semiconductor body having first and second opposing surfaces, a first isolation layer on the first surface of the...
US-9,991,183 Semiconductor component having inner and outer semiconductor component housings
A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component...
US-9,989,630 Structured-light based multipath cancellation in ToF imaging
Representative implementations of devices and techniques provide multipath interference cancelling for imaging devices and systems. In various implementations,...
US-9,989,574 System and method for short-circuit detection in load chains
An embodiment method for short-circuit detection includes determining a set of local reference voltages each associated with a respective load chain in a...
US-9,988,262 Temporary mechanical stabilization of semiconductor cavities
A method for fabricating an electronic device is disclosed. In one example, the method comprises providing a semiconductor wafer, forming a plurality of...
US-9,987,830 Method for processing a carrier and method for transferring a graphene layer
According to various embodiments, a method for processing a carrier may include: forming a layer structure over the carrier, the layer structure including a...
US-9,986,354 Pre-mold for a microphone assembly and method of producing the same
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially...
US-9,986,344 MEMS microphone with low pressure region between diaphragm and counter electrode
A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter...
US-9,985,639 Detection and mitigation of non-linearity of phase interpolator
Representative implementations of devices and techniques provide non-linearity detection and mitigation for a phase interpolator of a controlled oscillator...
US-9,985,126 Semiconductor device comprising a first gate electrode and a second gate electrode
A semiconductor device includes a transistor. The transistor includes a source region and a drain region disposed adjacent to a first main surface of a...
US-9,985,017 Semiconductor device comprising a clamping structure
Semiconductor device with a semiconductor body that includes a clamping structure including a pn junction diode and a Schottky junction diode serially connected...
US-9,984,930 Method for processing a carrier
A method for processing a carrier may include: forming a plurality of structure elements at least one of over and in a carrier, wherein at least two adjacent...
US-9,984,928 Method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Method for producing chip assemblies that include semiconductor chip arrangements, each semiconductor chip arrangement including a semiconductor chip having a...
US-9,984,927 Method and apparatus for separating semiconductor devices from a wafer
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor...
US-9,984,917 Semiconductor device with an interconnect and a method for manufacturing thereof
A method for manufacturing a semiconductor device in accordance with various embodiments may include: forming an opening in a first region of a semiconductor...
US-9,984,915 Semiconductor wafer and method for processing a semiconductor wafer
According to various embodiments, a semiconductor wafer may include: a semiconductor body including an integrated circuit structure; and at least one...
US-9,984,900 Semiconductor device including at least one element
A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element,...
US-9,984,897 Method for manufacturing a chip arrangement including a ceramic layer
A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the...
US-9,984,691 System for a transducer system with wakeup detection
According to embodiments described herein, a circuit includes an interface circuit configured to be coupled to a transducer and a detection circuit. The...
US-9,982,989 Angle sensors, systems and methods
Embodiments relate to magnetic field angle sensors, including off-axis and on-axis sensors. In an embodiment, a magnetic field angle sensor comprises two sensor...
US-9,981,844 Method of manufacturing semiconductor device with glass pieces
A source material, which is based on a glass, is arranged on a working surface of a mold substrate. The mold substrate is made of a single-crystalline material....
US-9,981,843 Chip package and a method of producing the same
A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of...
US-9,979,187 Power device with overvoltage arrester
An example power device includes a semiconductor chip and an arrester element configurable to, in response to a voltage across the arrester element being...
US-9,978,672 Transistor package with terminals coupled via chip carrier
A package comprising an at least partially electrically conductive chip carrier, a first transistor chip comprising a first connection terminal, a second...
US-9,978,406 Magnetic sensor device having a magneto-resistive structure that generates a vortex magnetization pattern
An embodiment relates to a magnetic sensor device, comprising a magneto-resistive structure. The magneto-resistive structure comprises a magnetic free layer...
US-9,974,190 System and method of providing a semiconductor carrier and redistribution structure
In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the...
US-9,974,187 Power in lead
Representative implementations of devices and techniques provide off-board power conversion. A power cable is arranged to distribute power from a power supply...
US-9,974,130 Driving several light sources
A device for driving several light sources is suggested comprising a shift register comprising at least two cells, wherein an output of each cell controls one...
US-9,973,860 System and method for an optical MEMS transducer
According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in...
US-9,973,835 Signal generator, a decoder, a method for generating a transmit signal and a method for determining speed data
A signal generator comprises a signal provider and a signal processing unit. The signal provider is configured to provide a sensor signal indicating a...
US-9,973,195 Local phase detection in realigned oscillator
Representative implementations of devices and techniques provide reduced jitter and local phase detection for a controlled oscillator. An edge of a reference...
US-9,973,094 Power converter and power conversion method
In accordance with an embodiment, a method includes disabling a first electronic switch connected in series with a primary winding of a transformer in a power...
US-9,973,093 Controller device for resonant mode power converter circuit
In some examples, a controller device for a resonant mode power converter circuit comprises a feed-forward pin configured to receive an input voltage signal of...
US-9,973,084 Switching voltage regulator input power estimation
An estimate of voltage regulator input power is provide by estimating output power of the voltage regulator based on output voltage and output current of the...
US-9,972,714 Semiconductor device with a termination mesa between a termination structure and a cell field of field...
A semiconductor device includes a cell field with a plurality of field electrode structures and cell mesas. The field electrode structures are arranged in...
US-9,972,704 Method for forming a semiconductor device and a semiconductor device
A method for forming a semiconductor device comprises implanting a defined dose of protons into a semiconductor substrate and tempering the semiconductor...
US-9,972,689 Semiconductor device having a surface with ripples
According to one embodiment of a semiconductor device, the semiconductor device includes a semiconductor substrate having a first surface, an insulation layer...
US-9,972,619 Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor...
Disclosed is a semiconductor device arrangement including a first semiconductor device having a load path, and a plurality of second transistors, each having a...
US-9,972,613 Semiconductor device including a phase change material
A semiconductor device includes a transistor having a plurality of transistor cells in a semiconductor body. Each transistor cell includes a control terminal...
US-9,972,596 Chip assemblage, press pack cell and method for operating a press pack cell
One aspect of the invention relates to a chip assemblage. The latter comprises a number of semiconductor chips, each of which has a semiconductor body having an...
US-9,972,576 Semiconductor chip package comprising side wall marking
The semiconductor chip package comprises a semiconductor chip, and an encapsulation body encapsulating the semiconductor chip, wherein the encapsulation body...
US-9,972,535 Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and...
Separation grooves are etched from a main surface into a semiconductor substrate. The separation grooves separate chip regions in horizontal directions parallel...
US-9,972,488 Method of reducing defects in an epitaxial layer
A method of reducing defects in an epitaxial layer. The method includes forming one or more barrier structures within a peripheral edge region of a wafer...
US-9,971,023 Systems and methods for time of flight measurement using a single exposure
A sensor array arrangement for a time of flight measurement system is disclosed. The arrangement includes a plurality of pixels and circuitry. The plurality of...
US-9,970,983 Methods and devices for the computer-aided determination of deviation patterns during the production and/or...
In various embodiments, a method for the computer-aided determination of deviation patterns during at least one of the production or testing of a multiplicity...
US-9,970,982 Apparatus and a method for providing an output parameter and a sensor device
An apparatus for providing an output parameter includes an output parameter generator circuit configured to determine a value of an output parameter repeatedly....
US-9,970,980 Test circuit for stress leakage measurements
In accordance with an embodiment, a circuit includes: a gate drive circuit; an output transistor, and a gate coupled to the gate drive circuit; a normally-on...
US-9,967,679 System and method for an integrated transducer and temperature sensor
According to embodiment, a transducer includes a microfabricated element integrated on a single die and an interface IC coupled to the microfabricated element....
US-9,967,677 System and method for sensor-supported microphone
A system and method for a sensor-supported microphone includes an amplifier having an input configured to be coupled to a transducer, and an output coupled to...
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