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Method of forming a semiconductor device including a silicon controlled
A semiconductor device includes an SCR ESD device region disposed within a semiconductor body, and a plurality of first device regions of the first conductivity...
Method of manufacturing a chip arrangement comprising disposing a metal
structure over a carrier
A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal...
Method for fabricating a bond
The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective...
Method and system for detection of latent faults in microcontrollers
Embodiments relate to systems and methods for detecting register corruption within CPUs operating on the same input data enabling non-invasive read access to...
Controlled transmission of data in a data transmission system
This disclosure relates to controlled transmission of data in a data transmission system. Data from data interface elements may be transmitted in a controlled...
Circuit arrangement, systems for transmitting a serial data stream, pixel
matrix display and method for...
A circuit arrangement comprises an input circuit for reading in a serial data stream, which comprises a plurality of useful data bits, and for reading in a...
Converter with reduced power consumption
A converter may include a transformer; a first circuit arrangement coupled to a first transformer side; a second circuit arrangement coupled to a second...
Circuit arrangement with an overcurrent fuse
A circuit arrangement includes a semiconductor switch having a control terminal and a load path. A drive circuit is coupled to the control terminal of the...
Bus interface and method for short-circuit detection
Embodiments of bus interface circuitry and methods for short circuit detection are generally described herein. Other embodiments may be described and claimed....
Magnetic out-of-axis angle sensing principle
The present disclosure relates to a magnetic angle sensor module having first magnetic polewheel comprising a first number of poles and a second magnetic...
Electronic device including a carrier and a semiconductor chip attached to
the carrier and manufacturing thereof
One aspect is a device including a carrier comprising a first conducting layer, a first insulating layer over the first conducting layer, and at least one first...
Semiconductor packages with integrated antenna and method of forming
In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A...
Semiconductor package and method for fabricating the same
A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within...
Electronic circuit arrangement
An electronic circuit arrangement in accordance with some embodiments has a substrate, the substrate including: a plurality of metallization layers located one...
Radiation conversion device and method of manufacturing a radiation
A radiation conversion device such as a photovoltaic cell, a photodiode or a semiconductor radiation detection device, includes a semiconductor portion with...
RF power HEMT grown on a silicon or SiC substrate with a front-side plug
A compound semiconductor device includes a plurality of high-resistance crystalline silicon epitaxial layers and a plurality of activated dopant regions...
Methods for manufacturing a chip arrangement, methods for manufacturing a
chip package, a chip package and chip...
A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole...
Method for producing a protective structure
A method for producing a protective structure may include: providing a semiconductor base substrate with a doping of a first conductivity type; producing a...
Clip frame semiconductor packages and methods of formation thereof
In one embodiment, a semiconductor package includes a clip frame with a first clip having a first support structure, a first lever, and a first contact portion,...
Clock determination for a sensor
A method for determining a clock for a sensor signal which has a synchronization signal, which method involves a control unit measuring the period between a...
Switched mode power supply including a flyback converter with primary side
A method and apparatus for controlling a flyback converter are presented. The flyback converter includes a transformer, a semiconductor switch coupled to a...
An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip...
Temperature evaluation circuit
An electronic circuit includes a temperature evaluation circuit. The temperature evaluation circuit includes a first sensor circuit with a first output terminal...
Apparatus and method for aligning a wafer's backside to a wafer's
Structures of a backside of a wafer can be aligned to structures of a frontside of the wafer for a lithographic treatment of the backside. The wafer is...
ADC with noise-shaping SAR
Representative implementations of devices and techniques provide analog to digital conversion of analog inputs. A multistage comparator using a feed-forward...
System, drivers for switches and methods for synchronizing measurements of
A driver for a switch includes a primary side having a trigger input and a secondary side comprising an analog-to-digital converter (ADC). The primary side and...
System and method for driving an electronic switch dependent on
An electronic switch is connected in series with a load dependent on an input signal. The electronic switch is operated in a first operation mode for a first...
Power supply system with charge balancing
A power supply system includes a first charge storage. A series circuit with a plurality of n charge storage modules is connected between load terminals. A...
LED driver circuit
A semiconductor chip includes an LED driver circuit operably coupled to at least one LED and configured to supply a load current to the at least one LED such...
High side switch
A semiconductor chip includes at least one power semiconductor switch configured to activate and deactivate current conduction from a first supply terminal,...
Device and method for manufacturing a device
A device includes a semiconductor chip including a frontside, a backside, and a side surface extending from the backside to the frontside. The side surface...
Method for producing a semiconductor
A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the...
Semiconductor component with optimized edge termination
A semiconductor component includes a two-sided semiconductor body, an inner zone with a basic doping of a first conduction type, and two semiconductor zones....
Integrated circuit including a power transistor and an auxiliary
In one embodiment of an integrated circuit, the integrated circuit includes a power transistor with a power control terminal, a first power load terminal and a...
Electrostatic discharge protection element and electrostatic discharge
protection chip and method of producing...
An electrostatic discharge (ESD) protection element includes a collector area, a first barrier area, a semiconductor area, a second barrier area and an emitter...
Semiconductor device with compensation regions
A semiconductor device includes a semiconductor body including an inner region, and an edge region, a first doped device region of a first doping type in the...
Reduced charge transistor
Representative implementations of devices and techniques provide a reduced charge transistor arrangement. The capacitance and/or charge of a transistor...
Monolithic semiconductor switches and method for manufacturing
A semiconductor device and method are disclosed. One embodiment provides a semiconductor die with a first n-type channel FET and a second n-type channel FET. A...
Method of making interconnect structure
A method of forming a semiconductor device, comprising: providing a Si-containing layer; forming a barrier layer over said Si-containing layer, said barrier...
Methods for producing a tunnel field-effect transistor
A method for producing a tunnel field-effect transistor is disclosed. Connection regions of different doping types are produced by means of self-aligning...
Strained semiconductor device and method of making the same
In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate...
Chip package and method of forming the same
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip...
Monitoring circuit with a window watchdog
A method of monitoring a processing circuit is disclosed. The processing circuit is operable, in a normal operation mode, to generate a sequence of trigger...
System and method for processing device with differentiated execution mode
In accordance with an embodiment of the present invention, a method of operating a system includes operating in a first operating mode to not permit access to...
Apparatus and method for determining a state parameter of an object to be
An apparatus for determining a state parameter of an object to be monitored includes a means for providing a plurality of measurement values, wherein the...
System and method for testing a power supply controller
In accordance with an embodiment, a method of testing a power supply controller includes detecting whether an external switch is coupled between a first supply...
Semiconductor device having a through contact
A semiconductor device includes a semiconductor substrate having a first side and a second side opposite the first side, an active area and a through contact...
Semiconductor device including a diode and method of manufacturing a
A semiconductor device includes a transistor cell array in the semiconductor body of a first conductivity type. The semiconductor device further includes a...
Semiconductor arrangement with a superjunction transistor and a further
device integrated in a common...
A semiconductor arrangement includes a semiconductor body and a power transistor arranged in a first device region of the semiconductor body. The power...
Semiconductor device and method
A semiconductor device is disclosed. One embodiment includes a lateral HEMT (High Electron Mobility Transistor) structure with a heterojunction between two...