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Patent # Description
US-9,035,687 Gate clamping
A circuit is described that includes a switch, a switchable clamping element coupled to the switch, and a driver configured to control the switch based at least...
US-9,035,437 Packaged device comprising non-integer lead pitches and method of manufacturing the same
Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device...
US-9,035,375 Field-effect device and manufacturing method thereof
Embodiments relate to a field-effect device that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region,...
US-9,035,355 Multi-channel HEMT
A transistor device includes a semiconductor heterostructure including a plurality of alternating two-dimensional electron gasses (2DEGs) and two-dimensional...
US-9,035,322 Silicon carbide device and a method for manufacturing a silicon carbide device
A silicon carbide device includes an epitaxial silicon carbide layer including a first conductivity type and a buried lateral silicon carbide edge termination...
US-9,034,751 Method for mounting a semiconductor chip on a carrier
A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the...
US-9,034,233 Method of processing a substrate
In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into...
US-9,032,273 Method, apparatus and device for data processing
An embodiment relates to a method for data processing that includes reading data, the data comprising overhead information and payload information, and...
US-9,032,258 Safety system challenge-and-response using modified watchdog timer
Some embodiments of the present disclosure relate to a watchdog timer having an enhanced functionality that enables the watchdog timer to monitor a process flow...
US-9,032,221 Apparatus for logging a configuration of a microprocessor system and method for logging a configuration of a...
An apparatus includes a logging apparatus and a configuration apparatus. The logging apparatus has a security module operable to create a manipulation-proof...
US-9,032,140 System and method for adaptive bit rate programming of a memory device
The disclosure relates to an electronic memory system, and more specifically, to a system for adaptive bit rate programming of a memory device, and a method for...
US-9,031,769 Sensor current interface transceiver with adaptive linearization
Some embodiments of the present disclosure relate to a sensor interface module having a linearization module that increase a size of a linear region of a...
US-9,031,266 Electrostatic loudspeaker with membrane performing out-of-plane displacement
An electrostatic loudspeaker comprises a membrane structure and an electrode structure. The membrane structure comprises a central membrane portion and a...
US-9,030,877 Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure...
US-9,030,797 Thin substrate electrostatic chuck system and method
In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate...
US-9,030,744 Fabrication of micro lenses
A method for fabricating a micro lens array is provided. The method includes forming a first lens material structure on a substrate. The first lens material...
US-9,030,028 Method for manufacturing semiconductor devices having a metallisation layer
A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to...
US-9,030,019 Semiconductor device and method of manufacture thereof
A semiconductor device and a method of making a semiconductor device are disclosed. The semiconductor device comprises a redistribution layer arranged over a...
US-9,029,974 Semiconductor device, junction field effect transistor and vertical field effect transistor
A semiconductor device according to an embodiment is at least partially arranged in or on a substrate and includes a recess forming a mesa, wherein the mesa...
US-9,029,966 Thin-wafer current sensors
Embodiments relate to IC current sensors fabricated using thin-wafer manufacturing technologies. Such technologies can include processing in which dicing before...
US-9,029,944 Super junction semiconductor device comprising implanted zones
In a semiconductor substrate with a first surface and a working surface parallel to the first surface, columnar first and second super junction regions of a...
US-9,029,941 Vertical transistor component
A vertical transistor component includes a semiconductor body with first and second surfaces, a drift region, and a source region and body region arranged...
US-9,029,250 Method for producing semiconductor regions including impurities
A method for producing semiconductor regions including impurities includes forming a trench in a first surface of a semiconductor body. Impurity atoms are...
US-9,029,243 Method for producing a semiconductor device and field-effect semiconductor device
A method for producing a semiconductor device is provided. The method includes providing a wafer including a main surface and a silicon layer arranged at the...
US-9,029,220 Method of manufacturing a semiconductor device with self-aligned contact plugs and semiconductor device
Semiconductor oxide pillars are selectively grown on semiconductor mesas between precursor structures that extend from a main surface into a semiconductor...
US-9,029,200 Method for manufacturing semiconductor devices having a metallisation layer
A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to...
US-9,029,049 Method for processing a carrier, a carrier, an electronic device and a lithographic mask
Various embodiments provide a method for processing a carrier, the method including changing the three-dimensional structure of a mask layer arranged over the...
US-9,026,866 Method and system for realtime detection of stack frame corruption during nested procedure calls
The present disclosure relates to some aspects relate to a method for detecting stack memory corruption. In some embodiments, the method comprises determining...
US-9,025,449 Network retransmission protocols using a proxy node
One embodiment relates to a device. The device includes reception circuitry adapted to receive a data unit from a first node of a network and a confirmation...
US-9,025,391 Circuit arrangement and method for operating a circuit arrangement
A circuit arrangement, having a plurality of electronic components; a plurality of first access lines and second access lines, wherein each electronic component...
US-9,024,794 Virtual analog to digital converter
The disclosure relates to analog to digital converters, in particular to logical circuit blocks, a system and a method, which provide functionality of an...
US-9,024,678 Current sensing circuit arrangement for output voltage regulation
A circuit arrangement including a first transistor, a second transistor and a third transistor. The first transistor and the second transistor are configured so...
US-9,024,629 Hall sensors having forced sensing nodes
Embodiments relate to forced spinning Hall sensors. In embodiments, forced Hall sensors can provide reduced residual offset, lower current consumption and...
US-9,024,433 Power semiconductor module system with undercut connection
A semiconductor module system includes a first semiconductor module and a second semiconductor module. The first semiconductor module has a first housing and a...
US-9,024,413 Semiconductor device with IGBT cell and desaturation channel structure
A semiconductor device includes an IGBT cell including a second-type doped drift zone, and a desaturation semiconductor structure for desaturating a charge...
US-9,024,396 Device with MEMS structure and ventilation path in support structure
A device includes a support structure, a sound port disposed in the support structure, and a MEMS structure including a membrane acoustically coupled to the...
US-9,024,383 Semiconductor device with a super junction structure with one, two or more pairs of compensation layers
A super junction semiconductor device comprises a semiconductor portion with mesa regions protruding from a base section. The mesa regions are spatially...
US-9,024,356 Compound semiconductor device with buried field plate
A semiconductor device includes a first compound semiconductor material and a second compound semiconductor material on the first compound semiconductor...
US-9,021,887 Micromechanical semiconductor sensing device
Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a...
US-9,021,284 Standby operation with additional micro-controller
One embodiment of the present invention relates to a low-power micro-controller unit having both a standby micro-controller optimized for low power consumption...
US-9,020,089 Phase-locked loop (PLL)-based frequency synthesizer
This disclosure describes techniques for generating signals that have relatively steep frequency profiles with a phase-locked loop (PLL) circuit architecture....
US-9,019,154 Radar circuit, radar system and method for testing
A radar circuit for controlling a radar antenna in a vehicle comprises an antenna connection for connection of a radar antenna, a transmitting and receiving...
US-9,019,005 Voltage regulating circuit
In various embodiments, a circuit is provided including a supply terminal, a logic circuit, an inverter and a control transistor which may include a body...
US-9,018,948 Hall sensors and sensing methods
Embodiments relate to multi-contact sensor devices and operating methods thereof that can reduce or eliminate offset error. In embodiments, sensor devices can...
US-9,018,773 Chip arrangement and a method for forming a chip arrangement
A chip arrangement is provided. The chip arrangement includes: a first chip electrically connected to the first chip carrier top side; a second chip...
US-9,018,744 Semiconductor device having a clip contact
A semiconductor device comprises a carrier. Further, the semiconductor devices comprises a semiconductor chip comprising a first main surface and a second main...
US-9,018,742 Electronic device and a method for fabricating an electronic device
An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a...
US-9,018,674 Reverse conducting insulated gate bipolar transistor
A semiconductor includes a drift zone of a first conductivity type arranged between a first side and a second side of a semiconductor body. The semiconductor...
US-9,017,539 Method for fabricating a heat sink, and a heat sink
A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a...
US-9,016,116 Extraction of tire characteristics combining direct TPMS and tire resonance analysis
Embodiments relate to tire characterization systems and methods for combining direct tire pressure monitoring systems (TPMS) and tire resonance analysis in...
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