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Patent # Description
US-8,993,394 Micro-electromechanical system devices
Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer...
US-8,993,381 Method for forming a thin semiconductor device
A method for forming a thin semiconductor device is disclosed. In one embodiment, a lead frame is provided over a carrier. At least one semiconductor chip is...
US-8,993,372 Method for producing a semiconductor component
Exemplary embodiments of a method for producing a semiconductor component having a polycrystalline semiconductor body region are disclosed, wherein the...
US-8,992,267 Connecting system for electrically connecting electronic devices and method for connecting an electrically...
A connecting system for electrically connecting electronic devices includes an electrically conductive first connector, an electrically conductive second...
US-8,991,711 Chip card module
In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first...
US-8,991,253 Microelectromechanical system
In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip...
US-8,990,744 Electrical measurement based circuit wiring layout modification method and system
The capacitance or inductance of electrical circuits is adjusted by measuring inductance or capacitance values of passive components fabricated on a first...
US-8,990,466 Arbiter for asynchronous state machines
An arbiter can be used for processing a plurality of asynchronous data signals. Each data signal is associated with a request signal and a respective...
US-8,989,680 Determining a state of a receiver on a transmission line
According to one aspect, a method is provided for determining a state of a receiver on a transmission line. The method may comprise, for example, evaluating a...
US-8,988,072 Vertical hall sensor with high electrical symmetry
A vertical Hall sensor includes a Hall effect region and a plurality of contacts formed in or on a surface of the Hall effect region. The plurality of contacts...
US-8,988,039 Power converter circuit
A power converter circuit includes input terminals configured to receive an input voltage and an input current and output terminals configured to provide an...
US-8,987,880 Chip module and a method for manufacturing a chip module
In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first...
US-8,987,879 Semiconductor device including a contact clip having protrusions and manufacturing thereof
A semiconductor device includes a leadframe with a die pad and a first lead, a semiconductor chip with a first electrode, and a contact clip with a first...
US-8,987,090 Method of manufacturing a semiconductor device with device separation structures
A method of manufacturing a semiconductor device includes introducing at least a first and a second trench pattern including array trenches from a first surface...
US-8,984,300 Secure operation of programmable devices
According to an embodiment, a programmable logic device includes a plurality of logic blocks, memory, a plurality of connection control elements and a logic...
US-8,983,097 Adjustable ventilation openings in MEMS structures
A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure...
US-8,983,068 Masked nonlinear feedback shift register
An NLFSR of length k, configured to output a sequence of masked values x'.sub.i=x.sub.i+m.sub.i according to a masked recurrence x'.sub.n+k=f(x'.sub.n, . . . ,...
US-8,981,932 Apparatus comprising a pair of an alarm condition generator and an associated alarm circuit, chip card, and method
An apparatus includes a pair of an alarm condition generator and an associated alarm circuit and a test circuit. The alarm circuit is configured to generate an...
US-8,981,836 Charge pumps with improved latchup characteristics
Some embodiments relate to charge pump regulators to selectively activate a charge pump based not only on the voltage output of the charge pump, but also on a...
US-8,981,820 Driver circuit
Devices and methods are provided in which a driver is supplied via a first current path and a second current path which can comprise a switching element.
US-8,981,763 Di/dt current sensing
A circuit includes a power circuit and a current sensing circuit. The power circuit has a main current loop. The current sensing circuit is spaced apart from...
US-8,981,553 Power semiconductor module with integrated thick-film printed circuit board
A power semiconductor module includes a first printed circuit board having a first insulation carrier, and a first upper metallization and a first lower...
US-8,981,545 Explosion-protected semiconductor module
A semiconductor module includes an electrically conductive lower contact piece and an electrically conductive upper contact piece spaced apart from one another...
US-8,981,520 Semiconductor device with an edge termination structure
A semiconductor device having a semiconductor die and an edge termination structure is provided. The semiconductor die includes an outer edge and an active area...
US-8,981,504 Vertical hall sensor with series-connected hall effect regions
A vertical Hall sensor includes first and second vertical Hall effect regions in a semiconductor substrate, with first and second pluralities of contacts...
US-8,980,714 Semiconductor device with buried gate electrode structures
A method of manufacturing a semiconductor device includes introducing at least a first and a second trench pattern from a first surface into a semiconductor...
US-8,980,687 Semiconductor device and method of manufacturing thereof
A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer...
US-8,979,362 Circuit and method for sensing a physical quantity, an oscillator circuit, a smartcard, and a...
A circuit for sensing a physical quantity according to an embodiment of the present invention includes a first oscillator circuit configured to provide a first...
US-8,977,668 Calculating unit for reducing an input number with respect to a modulus
A calculating unit for reducing an input number with respect to a modulus, wherein the input number has input number portions of different significances,...
US-8,977,210 Radio-frequency circuit
A radio-frequency circuit has a signal processing unit for processing a symmetrical input signal, two signal inputs for receiving the symmetrical input signal,...
US-8,977,198 Communication method between electronic appliances, and corresponding appliances
A communication method for the communication between two appliances which are set up for communication in a first communication mode is provided. The method...
US-8,976,496 Electrostatic discharge blocking circuits
Techniques and architectures corresponding to electrostatic discharge blocking circuits are described.
US-8,976,051 Floating point timer techniques
Aspects of the present disclosure relate to floating point timers and counters that are used in a variety of contexts. In some implementations, a floating point...
US-8,975,972 Oscillator system
An oscillator system includes a first oscillator, a second oscillator, and a changeover component. The first oscillator is configured to generate a first signal...
US-8,975,915 Driver circuit for a digital signal transmitting bus
A driver circuit for a digital signal transmitting bus includes a main switch. The main switch is connected to the bus, is controllable by the digital signal to...
US-8,975,889 Current difference sensors, systems and methods
Embodiments relate to current difference sensors, systems and methods. In an embodiment, a current difference sensor includes first and second conductors...
US-8,975,735 Redistribution board, electronic component and module
A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a...
US-8,975,721 Integrated circuit having an edge passivation and oxidation resistant layer and method
An integrated circuit having a semiconductor component arrangement and production method is provided. The integrated circuit includes a semiconductor material...
US-8,975,715 Photodetector and method for manufacturing the same
A photodetector includes a substrate and an insulating arrangement formed in the substrate. The insulating arrangement electrically insulates a confined region...
US-8,975,711 Device including two power semiconductor chips and manufacturing thereof
A device includes a first power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face....
US-8,975,696 Lateral MOS power transistor having backside terminal electrode
A semiconductor component may include a semiconductor layer which has a front side and a back side, a first terminal electrode on the front side, a second...
US-8,975,688 Semiconductor device with voltage compensation structure
A voltage compensation structure includes a first semiconductor or insulating material disposed along one or more sidewalls of a trench formed in a doped...
US-8,975,662 Method of manufacturing a semiconductor device using an impurity source containing a metallic recombination...
Source zones of a first conductivity type and body zones of a second conductivity type are formed in a semiconductor die. The source zones directly adjoin a...
US-8,975,640 Heterojunction semiconductor device and manufacturing method
A heterojunction semiconductor device having a semiconductor body is provided. The semiconductor body includes a first semiconductor region comprising aluminum...
US-8,975,612 Integrated circuits with magnetic core inductors and methods of fabrications thereof
In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is...
US-8,975,151 Semiconductor body with a buried material layer and method
One aspect includes a method for forming a buried material layer in a semiconductor body, including providing a semiconductor body having a first side and...
US-8,975,136 Manufacturing a super junction semiconductor device
A super junction semiconductor device includes a semiconductor portion with a first surface and a parallel second surface. A doped layer of a first conductivity...
US-8,975,117 Semiconductor device using diffusion soldering
A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the...
US-8,975,107 Method of manufacturing a semiconductor device comprising a membrane over a substrate by forming a plurality of...
In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface...
US-8,972,216 Methods and apparatus for calibration of power converters
Methods and apparatus for a power regulator according to various aspects of the present invention may comprise a sensor adapted to generate a measurement of a...
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