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Patent # Description
US-9,012,280 Method of manufacturing a super junction semiconductor device with overcompensation zones
According to an embodiment, a super junction semiconductor device may be manufactured by introducing impurities of a first impurity type into an exposed surface...
US-9,009,517 Embedded voltage regulator trace
One embodiment of the present invention relates to a power and trace profiling system. The system includes a microcontroller based device having a voltage...
US-9,007,951 Self synchronizing data communication method and device
A method comprises: detecting a first change of a physical property of a signal; starting a measurement of a duration of a first time interval that begins with...
US-9,007,791 Digital slope control for switched capacitor dc-dc converter
Representative implementations of devices and techniques minimize switching losses in a switched capacitor dc-dc converter. The slope of the charging and/or...
US-9,007,117 Solid-state switching device having a high-voltage switching transistor and a low-voltage driver transistor
According to an embodiment, a solid-state switching device includes a high-voltage switching transistor including a source, a drain and a gate, and being...
US-9,007,103 Switch circuit arrangements and method for powering a driver circuit
In various embodiments, a switch circuit arrangement may include a switch circuit, a driver circuit and a supply circuit. The driver circuit may be configured...
US-9,007,100 High-side semiconductor-switch low-power driving circuit and method
A high-side semiconductor-switch driving method includes generating power for controlling a high side semiconductor switch. The high side semiconductor switch...
US-9,007,060 Electronic device with ring-connected hall effect regions
An electronic device includes a number of n Hall effect regions with n>1, wherein the n Hall effect regions are isolated from each other. The electronic...
US-9,006,899 Layer stack
In one embodiment method, a first Ti based layer is deposited on the substrate. An intermediate Al based layer is deposited on the first layer, a second NiV...
US-9,006,898 Conductive lines and pads and method of manufacturing thereof
A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer...
US-9,006,873 Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
A method includes providing a carrier having a first cavity, providing a dielectric foil with a metal layer attached to the dielectric foil, placing a first...
US-9,006,845 MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device...
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS...
US-9,006,811 Semiconductor device including a fin and a drain extension region and manufacturing method
One embodiment of a semiconductor device includes a fin on a first side of a semiconductor body. The semiconductor device further includes a body region of a...
US-9,006,798 Semiconductor device including trench transistor cell array and manufacturing method
A semiconductor device includes a trench transistor cell array in a silicon semiconductor body with a first main surface and a second main surface opposite to...
US-9,006,109 Semiconductor devices and methods for manufacturing semiconductor devices
A method includes a step of performing a time multiplexed etching process, wherein the last etching step of the time multiplexed etching process is of a first...
US-9,006,062 Method of manufacturing a semiconductor device including an edge area
A method of manufacturing a semiconductor device includes providing a doped layer containing a first dopant of a first conductivity type and forming a...
US-9,004,360 Contactless communication via a plurality of interfaces
A contactless communication device including an energy interface configured to activate the contactless communication device or a contactless communication...
US-9,003,234 Machine and methods for reassign positions of a software program based on a fail/pass performance
A machine and methods for reassign the execution order of program steps of a multi-step test program is disclosed. In an embodiment a machine for evaluating an...
US-9,003,198 Method and apparatus for data processing
A method for processing an operating sequence of instructions of a program in a processor, wherein each instruction is represented by an assigned instruction...
US-9,002,037 MEMS structure with adjustable ventilation openings
A MEMS structure includes a backplate, a membrane, and an adjustable ventilation opening configured to reduce a pressure difference between a first space...
US-9,001,952 Master slave interface
Implementations related to systems, devices, and methods that make use of a master slave arrangement are described. In one implementation, a method of reducing...
US-9,000,809 Method and device for sampling an input signal
In accordance with various embodiments, a method for sampling an input signal may be provided, wherein the method may include providing a single frequency clock...
US-9,000,763 3-D magnetic sensor
One embodiment of the present invention relates to a magnetic field sensor comprising a squat soft-magnetic body disposed on a surface of a substrate comprising...
US-9,000,597 Dummy structures and methods
A semiconductor device and a method of making a semiconductor device are disclosed. The method of manufacturing a semiconductor device comprises forming a...
US-9,000,580 Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with...
A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the...
US-9,000,531 Method and manufacture of transistor devices
A method of forming transistors and structures thereof. A CMOS device includes high k gate dielectric materials. A PMOS device includes a gate that is implanted...
US-9,000,520 Semiconductor device with an insulating structure for insulating an electrode from a semiconductor body
A semiconductor device includes an electrode arranged on a main surface of a semiconductor body and an insulating structure insulating the electrode from the...
US-8,999,826 Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate and...
Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate with a first and a second surface opposite the first...
US-8,999,783 Method for producing a semiconductor device with a vertical dielectric layer
A method for producing a semiconductor device is disclosed. The method includes providing a semiconductor body having a first surface, and a second surface...
US-8,999,758 Fixing semiconductor die in dry and pressure supported assembly processes
Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or...
US-8,999,756 Method and apparatus for semiconductor device fabrication using a reconstituted wafer
Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed...
US-8,999,187 Method for manufacturing a device on a substrate
A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure,...
US-RE45,449 Power semiconductor having a lightly doped drift and buffer layer
A power semiconductor element having a lightly doped drift and buffer layer is disclosed. One embodiment has, underneath and between deep well regions of a...
US-8,996,931 System and method to transmit data, in particular error data over a bus system
The invention relates to an electrical or electronic system, and more specifically, to a system with a bus, and a method to transmit data, in particular error...
US-8,996,926 DMA integrity checker
Some embodiments relate to a Direct Memory Access (DMA) controller. The DMA controller includes a set of transaction control registers to receive a sequence of...
US-8,995,690 Microphone and method for calibrating a microphone
A microphone and a method for calibrating a microphone are disclosed. In one embodiment the method for calibrating a microphone comprises operating a MEMS...
US-8,995,158 Circuit arrangement with a rectifier circuit
A rectifier circuit includes first and second load terminals, a first semiconductor device having a load path and configured to receive a drive signal, and a...
US-8,994,943 Selectivity by polarization
Representative implementations of devices and techniques provide selectivity for imaging devices and systems. Polarization may be applied to emitted light...
US-8,994,563 Signal converter and method for operating a signal converter
In accordance with an embodiment, a method for operating a signal converter includes converting an analog input signal to a digital output signal, comprising by...
US-8,994,526 Sensor interface making use of virtual resistor techniques
Some embodiments of the present disclosure relate to a sensor interface module. The sensor interface module includes a comparator having a first comparator...
US-8,994,413 Method for driving power semiconductor switches
A method for driving a controllable power semiconductor switch, having a first input terminal and first and second output terminals coupled to a voltage supply...
US-8,994,411 System and method for bootstrapping a switch driver
In accordance with an embodiment, a driver circuit includes a low-side driver having a first output configured to be coupled to a control node of a first...
US-8,994,179 Semiconductor device and method for making same
One or more embodiments relate to a semiconductor device that includes: a conductive layer including a sidewall; a conductive capping layer disposed over the...
US-8,994,161 Semiconductor device package and methods for producing same
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts...
US-8,994,148 Device bond pads over process control monitor structures in a semiconductor die
A semiconductor die includes a semiconductor substrate having an edge region surrounding an active region, the active region containing devices of an integrated...
US-8,994,127 Method of fabricating isolating semiconductor structures using a layout of trenches and openings
Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.
US-8,994,113 Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device formed in a semiconductor substrate includes an isolation trench in the semiconductor substrate to laterally insulate adjacent components...
US-8,994,078 Semiconductor device
A semiconductor device includes a cell region and a contact region, the cell region including a functional unit including a gate electrode, a source and a drain...
US-8,993,437 Method for etching substrate
One or more embodiments relate to a method of making a semiconductor structure, comprising: forming a patterned metallic layer over a semiconductor substrate;...
US-8,993,422 Process tools and methods of forming devices using process tools
In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber....
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