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Patent # Description
US-9,030,797 Thin substrate electrostatic chuck system and method
In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate...
US-9,030,744 Fabrication of micro lenses
A method for fabricating a micro lens array is provided. The method includes forming a first lens material structure on a substrate. The first lens material...
US-9,030,028 Method for manufacturing semiconductor devices having a metallisation layer
A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to...
US-9,030,019 Semiconductor device and method of manufacture thereof
A semiconductor device and a method of making a semiconductor device are disclosed. The semiconductor device comprises a redistribution layer arranged over a...
US-9,029,974 Semiconductor device, junction field effect transistor and vertical field effect transistor
A semiconductor device according to an embodiment is at least partially arranged in or on a substrate and includes a recess forming a mesa, wherein the mesa...
US-9,029,966 Thin-wafer current sensors
Embodiments relate to IC current sensors fabricated using thin-wafer manufacturing technologies. Such technologies can include processing in which dicing before...
US-9,029,944 Super junction semiconductor device comprising implanted zones
In a semiconductor substrate with a first surface and a working surface parallel to the first surface, columnar first and second super junction regions of a...
US-9,029,941 Vertical transistor component
A vertical transistor component includes a semiconductor body with first and second surfaces, a drift region, and a source region and body region arranged...
US-9,029,250 Method for producing semiconductor regions including impurities
A method for producing semiconductor regions including impurities includes forming a trench in a first surface of a semiconductor body. Impurity atoms are...
US-9,029,243 Method for producing a semiconductor device and field-effect semiconductor device
A method for producing a semiconductor device is provided. The method includes providing a wafer including a main surface and a silicon layer arranged at the...
US-9,029,220 Method of manufacturing a semiconductor device with self-aligned contact plugs and semiconductor device
Semiconductor oxide pillars are selectively grown on semiconductor mesas between precursor structures that extend from a main surface into a semiconductor...
US-9,029,200 Method for manufacturing semiconductor devices having a metallisation layer
A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to...
US-9,029,049 Method for processing a carrier, a carrier, an electronic device and a lithographic mask
Various embodiments provide a method for processing a carrier, the method including changing the three-dimensional structure of a mask layer arranged over the...
US-9,026,866 Method and system for realtime detection of stack frame corruption during nested procedure calls
The present disclosure relates to some aspects relate to a method for detecting stack memory corruption. In some embodiments, the method comprises determining...
US-9,025,449 Network retransmission protocols using a proxy node
One embodiment relates to a device. The device includes reception circuitry adapted to receive a data unit from a first node of a network and a confirmation...
US-9,025,391 Circuit arrangement and method for operating a circuit arrangement
A circuit arrangement, having a plurality of electronic components; a plurality of first access lines and second access lines, wherein each electronic component...
US-9,024,794 Virtual analog to digital converter
The disclosure relates to analog to digital converters, in particular to logical circuit blocks, a system and a method, which provide functionality of an...
US-9,024,678 Current sensing circuit arrangement for output voltage regulation
A circuit arrangement including a first transistor, a second transistor and a third transistor. The first transistor and the second transistor are configured so...
US-9,024,629 Hall sensors having forced sensing nodes
Embodiments relate to forced spinning Hall sensors. In embodiments, forced Hall sensors can provide reduced residual offset, lower current consumption and...
US-9,024,433 Power semiconductor module system with undercut connection
A semiconductor module system includes a first semiconductor module and a second semiconductor module. The first semiconductor module has a first housing and a...
US-9,024,413 Semiconductor device with IGBT cell and desaturation channel structure
A semiconductor device includes an IGBT cell including a second-type doped drift zone, and a desaturation semiconductor structure for desaturating a charge...
US-9,024,396 Device with MEMS structure and ventilation path in support structure
A device includes a support structure, a sound port disposed in the support structure, and a MEMS structure including a membrane acoustically coupled to the...
US-9,024,383 Semiconductor device with a super junction structure with one, two or more pairs of compensation layers
A super junction semiconductor device comprises a semiconductor portion with mesa regions protruding from a base section. The mesa regions are spatially...
US-9,024,356 Compound semiconductor device with buried field plate
A semiconductor device includes a first compound semiconductor material and a second compound semiconductor material on the first compound semiconductor...
US-9,021,887 Micromechanical semiconductor sensing device
Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a...
US-9,021,284 Standby operation with additional micro-controller
One embodiment of the present invention relates to a low-power micro-controller unit having both a standby micro-controller optimized for low power consumption...
US-9,020,089 Phase-locked loop (PLL)-based frequency synthesizer
This disclosure describes techniques for generating signals that have relatively steep frequency profiles with a phase-locked loop (PLL) circuit architecture....
US-9,019,154 Radar circuit, radar system and method for testing
A radar circuit for controlling a radar antenna in a vehicle comprises an antenna connection for connection of a radar antenna, a transmitting and receiving...
US-9,019,005 Voltage regulating circuit
In various embodiments, a circuit is provided including a supply terminal, a logic circuit, an inverter and a control transistor which may include a body...
US-9,018,948 Hall sensors and sensing methods
Embodiments relate to multi-contact sensor devices and operating methods thereof that can reduce or eliminate offset error. In embodiments, sensor devices can...
US-9,018,773 Chip arrangement and a method for forming a chip arrangement
A chip arrangement is provided. The chip arrangement includes: a first chip electrically connected to the first chip carrier top side; a second chip...
US-9,018,744 Semiconductor device having a clip contact
A semiconductor device comprises a carrier. Further, the semiconductor devices comprises a semiconductor chip comprising a first main surface and a second main...
US-9,018,742 Electronic device and a method for fabricating an electronic device
An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a...
US-9,018,674 Reverse conducting insulated gate bipolar transistor
A semiconductor includes a drift zone of a first conductivity type arranged between a first side and a second side of a semiconductor body. The semiconductor...
US-9,017,539 Method for fabricating a heat sink, and a heat sink
A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a...
US-9,016,116 Extraction of tire characteristics combining direct TPMS and tire resonance analysis
Embodiments relate to tire characterization systems and methods for combining direct tire pressure monitoring systems (TPMS) and tire resonance analysis in...
US-9,014,652 Mobile communication device
Embodiments provide a mobile communication device comprising an adaptive filter for filtering a RF signal and a controller. The adaptive filter comprises a...
US-9,013,890 Semiconductor packages and methods for producing the same
In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The...
US-9,013,842 Semiconductor ESD circuit and method
In an embodiment, an electrostatic discharge (ESD) circuit for providing protection between a first node and a second node includes a first MOS device having a...
US-9,013,181 Magnetoresistive sensors having reduced AMR effects
Embodiments related to magnetoresistive angle sensor layouts having reduced anisotropic magneto resistance (AMR) effects. Embodiments provide magnetoresistive...
US-9,013,030 Leadframe, semiconductor package including a leadframe and method for producing a leadframe
A lead frame includes a die pad and a lead finger with an inner portion which is configured to be electrically connected to contact pads of a die and with an...
US-9,013,027 Semiconductor device, a semiconductor wafer structure, and a method for forming a semiconductor wafer structure
Embodiments relate to a semiconductor device, a semiconductor wafer structure, and a method for manufacturing or forming a semiconductor wafer structure. The...
US-9,013,014 Chip package and a method of manufacturing the same
In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and...
US-9,013,013 Pressure sensor package having a stacked die arrangement
A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical...
US-9,012,995 Semiconductor device including FinFET device
A memory element includes a FinFET select device and a memory element. In some embodiments a memory cell has a contact element coupled between a surface of the...
US-9,012,980 Method of manufacturing a semiconductor device including proton irradiation and semiconductor device including...
A method of manufacturing a semiconductor device includes forming a charge compensation device structure in a semiconductor substrate. The method further...
US-9,012,325 Method of protecting sidewall surfaces of a semiconductor device
One or more embodiments relate to a method of making a semiconductor structure, comprising: forming a opening partially through a semiconductor substrate, the...
US-9,012,311 Method for producing a semiconductor body having a recombination zone, semiconductor component having a...
In a method for producing a semiconductor body, impurities which act as recombination centers in the semiconductor body and form a recombination zone are...
US-9,012,297 Methods of forming moisture barrier capacitors in semiconductor components
Structures and methods of forming moisture barrier capacitor on a semiconductor component are disclosed. The capacitor is located on the periphery of a...
US-9,012,295 Compressive polycrystalline silicon film and method of manufacture thereof
In one embodiment a method of forming a compressive polycrystalline semiconductive material layer is disclosed. The method comprises forming a polycrystalline...
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