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Patent # Description
US-9,136,397 Field-effect semiconductor device
A field-effect semiconductor device having a semiconductor body with a main surface is provided. The semiconductor body includes, in a vertical cross-section...
US-9,136,328 Silicon on nothing devices and methods of formation thereof
In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a first cavity within a substrate. The...
US-9,136,213 Integrated system and method of making the integrated system
A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a...
US-9,136,199 Monitoring and controlling temperatures in a semiconductor structure
An electronic device includes a semiconductor structure. A first temperature sensor is located at a hot spot of the semiconductor structure and a second...
US-9,136,136 Method and structure for creating cavities with extreme aspect ratios
Embodiments relate to structures, systems and methods for more efficiently and effectively etching sacrificial and other layers in substrates and other...
US-9,135,893 Display device
A display device is provided. The display device comprises a display comprising a plurality of pixels arranged in a display plane. The display device is...
US-9,135,549 Smart card module, smart card and method for producing a smart card module
A smart card module includes a carrier; a chip arrangement arranged over a first side of the carrier; and an antenna arranged over a second side of the carrier,...
US-9,135,546 Smart card
In accordance with various embodiments, a smart card is described which has an antenna, which is configured to receive an electromagnetic signal, a rectifier,...
US-9,134,743 Low-dropout voltage regulator
A low-dropout voltage regulator includes a power transistor configured to receive an input voltage and to provide a regulated output voltage at an output...
US-9,130,482 Pseudo zero vectors for space vector modulation and enhanced space vector modulation
A method of performing space vector modulation for PWM control for creating AC waveforms includes generating and sampling a reference signal to generate...
US-9,130,478 Rectifier with bridge circuit and parallel resonant circuit
A rectifier circuit includes a bridge circuit configured to receive an alternating input signal. A parallel resonant circuit is coupled between the bridge...
US-9,130,451 Circuitry, multi-branch charge pump, method for controlling a charge pump and system
One example refers to a circuitry comprising a first charge pump stage controlled by a first control signal, a second charge pump stage controlled by a second...
US-9,129,959 Method for manufacturing an electronic module and an electronic module
A number of semiconductor chips each include a first main face and a second main face opposite from the first main face. The second main face includes at least...
US-9,129,934 Power semiconductor module and method for operating a power semiconductor module
A power semiconductor module includes a circuit carrier including an insulation carrier having a top side on which a metallization layer is arranged. A power...
US-9,129,836 High-frequency switching transistor and high-frequency circuit
A circuit includes first, second, third and fourth terminals, and first and second switches. The first switch switches a first signal from the first terminal to...
US-9,129,820 Integrated circuit and method of manufacturing an integrated circuit
An integrated circuit is formed in a semiconductor substrate. The integrated circuit includes a trench formed in a first main surface of the semiconductor...
US-9,129,805 Diode biased ESD protection device and method
An ESD protection device includes an MOS transistor with a source region, drain region and gate region. A node designated for ESD protection is electrically...
US-9,128,838 System and method of high integrity DMA operation
A system and method for direct memory access (DMA) operation provides for receiving DMA requestors, assigning the received DMA requestors to one or more of a...
US-9,128,136 Apparatus and method for determining the sensitivity of a capacitive sensing device
Embodiments relate to an apparatus for determining a sensitivity of a capacitive sensing device having a sensor capacitor with a variable capacitance. The...
US-9,126,260 Method of processing a substrate
In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into...
US-9,124,281 Accurate and cost efficient linear hall sensor with digital output
One embodiment of the present invention relates to a magnetic sensor circuit having a magnetic field sensor device configured to generate a digital signal...
US-9,124,194 Methods and systems for a full-bridge voltage converting device
A device includes a full-bridge configured to convert a direct current (DC) voltage to an alternating current (AC) voltage. The full-bridge includes at least...
US-9,124,189 Converter with galvanic isolation
A converter is suggested comprising a transformer providing a galvanic isolation between a primary side and a secondary side of the converter; at least one...
US-9,123,829 Method for producing chip stacks
The present disclosures relates to a method for producing ultrathin chip stacks and chip stacks. Generally, a plurality of first semiconductor chips is formed...
US-9,123,828 Semiconductor device and method for forming a semiconductor device
A semiconductor device includes at least one ohmic contact region between a semiconductor substrate of the semiconductor device and an electrically conductive...
US-9,123,806 Method of manufacturing a semiconductor device
The method includes providing a semiconductor chip having a first main face and a second main face opposite the first main face. The semiconductor chip includes...
US-9,123,801 Semiconductor device, integrated circuit and method of manufacturing a semiconductor device
A semiconductor device includes a transistor in a semiconductor substrate having a first main surface. The transistor includes a source region, a drain region,...
US-9,123,791 Semiconductor device and method
A semiconductor device includes a first compound semiconductor material including a first doping concentration and a second compound semiconductor material on...
US-9,123,766 Transistor and method of manufacturing a transistor
In accordance with an embodiment of the present invention a transistor is disclosed. The transistor comprises a collector, a base and an emitter, wherein a...
US-9,123,764 Method of manufacturing a component comprising cutting a carrier
A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being...
US-9,123,735 Semiconductor device with combined passive device on chip back side
Semiconductor chips are described that combine a semiconductor device and a capacitor onto a single substrate such that the semiconductor device and the...
US-9,123,708 Semiconductor chip package
The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face,...
US-9,123,701 Semiconductor die and package with source down and sensing configuration
A semiconductor die includes a semiconductor body, a transistor device disposed in the semiconductor body and having a gate, a source and a drain, and a sense...
US-9,123,687 Method of manufacturing a semiconductor device
One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules...
US-9,123,559 Method for producing a semiconductor component
Methods for producing a semiconductor component that includes a transistor having a cell structure with a number of transistor cells monolithically integrated...
US-9,123,544 Semiconductor device and method
An electrical device includes a semiconductor chip. The semiconductor chip includes a routing line. An insulating layer is arranged over the semiconductor chip....
US-9,123,526 Module comprising a semiconductor chip
A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a...
US-9,123,397 Circuit arrangement and method for operating a circuit arrangement
A circuit arrangement comprising a plurality of electronic components; a plurality of first access lines and second access lines, wherein each electronic...
US-9,121,885 Sensor package and method of manufacturing thereof
A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment includes a sensor and a conductive line, wherein the sensor is...
US-9,121,884 Capacitive test method, apparatus and system for semiconductor packages
A multi-channel probe plate includes an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically...
US-9,121,880 Magnetic sensor device
A magnetic sensor device includes a magnet configured to generate a bias magnetic field. A plurality of electrical wires extend through the magnet. A magnetic...
US-9,118,395 Chip comprising a radio frequency switch arrangement, circuit arrangement and method for producing a radio...
A chip includes an RF switch arrangement that has a plurality of RF switches arranged jointly on the chip. Each of the RF switches has at least one first RF...
US-9,118,351 System and method for signature-based redundancy comparison
A system and method for signature-based redundancy comparison provides for receiving, by a master part, an input signal and generating, by the master part, a...
US-9,117,874 Method for fabricating a trench structure, and a semiconductor arrangement comprising a trench structure
A semiconductor device, in which a first trench section is produced proceeding from a surface of a semiconductor body into the semiconductor body. A...
US-9,117,807 Integrated passives package, semiconductor module and method of manufacturing
An integrated passives package includes an encapsulation compound and a plurality of electrically conductive pads embedded in the encapsulation compound. Each...
US-9,117,801 Semiconductor devices having a glass substrate, and method for manufacturing thereof
A method for manufacturing semiconductor devices includes providing a stack having a semiconductor wafer and a glass substrate with openings and at least one...
US-9,117,786 Chip module, an insulation material and a method for fabricating a chip module
The chip module includes a carrier, a semiconductor chip arranged on or embedded inside the carrier, and an insulation layer that at least partly covers a face...
US-9,117,748 Semiconductor device including a phase change material
A semiconductor device includes a transistor including a plurality of transistor cells in a semiconductor body, each transistor cell including a control...
US-9,117,694 Super junction structure semiconductor device based on a compensation structure including compensation layers...
A super junction semiconductor device includes strip structures between mesa regions that protrude from a base section in a cell area. Each strip structure...
US-9,117,586 Trimmable transformer arrangement
A circuit arrangement includes a coreless transformer. A trimming device is connected to the transformer and includes a variable capacitance and/or inductance.
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