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Method for producing a semiconductor body having a recombination zone,
semiconductor component having a...
In a method for producing a semiconductor body, impurities which act as recombination centers in the semiconductor body and form a recombination zone are...
Methods of forming moisture barrier capacitors in semiconductor components
Structures and methods of forming moisture barrier capacitor on a semiconductor component are disclosed. The capacitor is located on the periphery of a...
Compressive polycrystalline silicon film and method of manufacture thereof
In one embodiment a method of forming a compressive polycrystalline semiconductive material layer is disclosed. The method comprises forming a polycrystalline...
Method of manufacturing a super junction semiconductor device with
According to an embodiment, a super junction semiconductor device may be manufactured by introducing impurities of a first impurity type into an exposed surface...
Embedded voltage regulator trace
One embodiment of the present invention relates to a power and trace profiling system. The system includes a microcontroller based device having a voltage...
Self synchronizing data communication method and device
A method comprises: detecting a first change of a physical property of a signal; starting a measurement of a duration of a first time interval that begins with...
Digital slope control for switched capacitor dc-dc converter
Representative implementations of devices and techniques minimize switching losses in a switched capacitor dc-dc converter. The slope of the charging and/or...
Solid-state switching device having a high-voltage switching transistor
and a low-voltage driver transistor
According to an embodiment, a solid-state switching device includes a high-voltage switching transistor including a source, a drain and a gate, and being...
Switch circuit arrangements and method for powering a driver circuit
In various embodiments, a switch circuit arrangement may include a switch circuit, a driver circuit and a supply circuit. The driver circuit may be configured...
High-side semiconductor-switch low-power driving circuit and method
A high-side semiconductor-switch driving method includes generating power for controlling a high side semiconductor switch. The high side semiconductor switch...
Electronic device with ring-connected hall effect regions
An electronic device includes a number of n Hall effect regions with n>1, wherein the n Hall effect regions are isolated from each other. The electronic...
In one embodiment method, a first Ti based layer is deposited on the substrate. An intermediate Al based layer is deposited on the first layer, a second NiV...
Conductive lines and pads and method of manufacturing thereof
A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer...
Method of manufacturing a semiconductor device with a carrier having a
cavity and semiconductor device
A method includes providing a carrier having a first cavity, providing a dielectric foil with a metal layer attached to the dielectric foil, placing a first...
MEMS device with polymer layer, system of a MEMS device with a polymer
layer, method of making a MEMS device...
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS...
Semiconductor device including a fin and a drain extension region and
One embodiment of a semiconductor device includes a fin on a first side of a semiconductor body. The semiconductor device further includes a body region of a...
Semiconductor device including trench transistor cell array and
A semiconductor device includes a trench transistor cell array in a silicon semiconductor body with a first main surface and a second main surface opposite to...
Semiconductor devices and methods for manufacturing semiconductor devices
A method includes a step of performing a time multiplexed etching process, wherein the last etching step of the time multiplexed etching process is of a first...
Method of manufacturing a semiconductor device including an edge area
A method of manufacturing a semiconductor device includes providing a doped layer containing a first dopant of a first conductivity type and forming a...
Contactless communication via a plurality of interfaces
A contactless communication device including an energy interface configured to activate the contactless communication device or a contactless communication...
Machine and methods for reassign positions of a software program based on
a fail/pass performance
A machine and methods for reassign the execution order of program steps of a multi-step test program is disclosed. In an embodiment a machine for evaluating an...
Method and apparatus for data processing
A method for processing an operating sequence of instructions of a program in a processor, wherein each instruction is represented by an assigned instruction...
MEMS structure with adjustable ventilation openings
A MEMS structure includes a backplate, a membrane, and an adjustable ventilation opening configured to reduce a pressure difference between a first space...
Master slave interface
Implementations related to systems, devices, and methods that make use of a master slave arrangement are described. In one implementation, a method of reducing...
Method and device for sampling an input signal
In accordance with various embodiments, a method for sampling an input signal may be provided, wherein the method may include providing a single frequency clock...
3-D magnetic sensor
One embodiment of the present invention relates to a magnetic field sensor comprising a squat soft-magnetic body disposed on a surface of a substrate comprising...
Dummy structures and methods
A semiconductor device and a method of making a semiconductor device are disclosed. The method of manufacturing a semiconductor device comprises forming a...
Power semiconductor module with pressed baseplate and method for producing
a power semiconductor module with...
A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the...
Method and manufacture of transistor devices
A method of forming transistors and structures thereof. A CMOS device includes high k gate dielectric materials. A PMOS device includes a gate that is implanted...
Semiconductor device with an insulating structure for insulating an
electrode from a semiconductor body
A semiconductor device includes an electrode arranged on a main surface of a semiconductor body and an insulating structure insulating the electrode from the...
Method of producing a vertically inhomogeneous platinum or gold
distribution in a semiconductor substrate and...
Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate with a first and a second surface opposite the first...
Method for producing a semiconductor device with a vertical dielectric
A method for producing a semiconductor device is disclosed. The method includes providing a semiconductor body having a first surface, and a second surface...
Fixing semiconductor die in dry and pressure supported assembly processes
Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or...
Method and apparatus for semiconductor device fabrication using a
Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed...
Method for manufacturing a device on a substrate
A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure,...
Power semiconductor having a lightly doped drift and buffer layer
A power semiconductor element having a lightly doped drift and buffer layer is disclosed. One embodiment has, underneath and between deep well regions of a...
System and method to transmit data, in particular error data over a bus
The invention relates to an electrical or electronic system, and more specifically, to a system with a bus, and a method to transmit data, in particular error...
DMA integrity checker
Some embodiments relate to a Direct Memory Access (DMA) controller. The DMA controller includes a set of transaction control registers to receive a sequence of...
Microphone and method for calibrating a microphone
A microphone and a method for calibrating a microphone are disclosed. In one embodiment the method for calibrating a microphone comprises operating a MEMS...
Circuit arrangement with a rectifier circuit
A rectifier circuit includes first and second load terminals, a first semiconductor device having a load path and configured to receive a drive signal, and a...
Selectivity by polarization
Representative implementations of devices and techniques provide selectivity for imaging devices and systems. Polarization may be applied to emitted light...
Signal converter and method for operating a signal converter
In accordance with an embodiment, a method for operating a signal converter includes converting an analog input signal to a digital output signal, comprising by...
Sensor interface making use of virtual resistor techniques
Some embodiments of the present disclosure relate to a sensor interface module. The sensor interface module includes a comparator having a first comparator...
Method for driving power semiconductor switches
A method for driving a controllable power semiconductor switch, having a first input terminal and first and second output terminals coupled to a voltage supply...
System and method for bootstrapping a switch driver
In accordance with an embodiment, a driver circuit includes a low-side driver having a first output configured to be coupled to a control node of a first...
Semiconductor device and method for making same
One or more embodiments relate to a semiconductor device that includes: a conductive layer including a sidewall; a conductive capping layer disposed over the...
Semiconductor device package and methods for producing same
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts...
Device bond pads over process control monitor structures in a
A semiconductor die includes a semiconductor substrate having an edge region surrounding an active region, the active region containing devices of an integrated...
Method of fabricating isolating semiconductor structures using a layout of
trenches and openings
Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.
Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device formed in a semiconductor substrate includes an isolation trench in the semiconductor substrate to laterally insulate adjacent components...