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Patent # Description
US-9,064,875 Semiconductor structure and method for making same
Embodiments relate to a method for making a semiconductor structure, the method comprising: forming a seed layer in direct contact with a dielectric material;...
US-9,064,869 Semiconductor module and a method for fabrication thereof by extended embedding technologies
The semiconductor module includes a carrier, a plurality of semiconductor transistor chips disposed on the carrier, a plurality of semiconductor diode chips...
US-9,064,796 Semiconductor device and method of making the same
A semiconductor device includes a drift region in a first region of a semiconductor body. The drift region includes dopants of a first conductivity type. A...
US-9,064,787 Integrated antennas in wafer level package
A semiconductor module having one or more integrated antennas in a single package is provided herein. The semiconductor module has a bonding interconnect...
US-9,064,713 Voltage regulator using N-type substrate
In various embodiments a voltage regulating circuit is provided which may include a control transistor at least partially formed in an n-type substrate, and a...
US-9,064,557 Systems and methods for non-volatile memory
A self powered memory system is disclosed. The system includes a volatile supply component, a battery component, a switch component, and a volatile memory...
US-9,063,851 Fail safe code functionality
Some aspects of the present disclosure provide for a system and method for fault mitigation of a non-volatile memory (NVM) store subject to error correction...
US-9,061,896 Method for manufacturing a MEMS device and MEMS device
A method for manufacturing a MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer...
US-9,059,879 Test signal generation and application in receivers
One embodiment of the present invention relates to a test signal generator configured to generate a single sideband (SSB) test signal that is used for testing...
US-9,059,637 System and method for calibrating a power supply
In accordance with an embodiment, a method of calibrating a power supply includes coupling a reference load to an output of the power supply, setting an output...
US-9,059,302 Floating gate memory device with at least partially surrounding control gate
One or more embodiments relate to a floating gate memory device, comprising: a substrate; a floating gate disposed over the substrate; and a control gate...
US-9,059,282 Semiconductor devices having transistors along different orientations
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes an array having at least one first...
US-9,059,273 Methods for processing a semiconductor wafer
A method for processing a semiconductor wafer in accordance with various embodiments may include: providing a semiconductor wafer including at least one chip...
US-9,059,256 Method for producing a controllable semiconductor component
Disclosed is a method for producing a controllable semiconductor component. In a semiconductor body with a top side and a bottom side, a first trench protruding...
US-9,059,182 Method for producing bonding connection of semiconductor device
An arrangement is employed in a semiconductor device having a semiconductor body, the semiconductor body having a surface. The arrangement includes a surface...
US-9,059,155 Chip package and method for manufacturing the same
Various embodiments provide a chip package. The chip package may include a metallic chip carrier; at least one chip carried by the metallic chip carrier;...
US-9,059,141 Buried gate transistor
An embodiment of the invention provides a semiconductor fabrication method. The method comprises forming an isolation region between a first and a second region...
US-9,059,133 Capacitor structure
One or more embodiments relate to a semiconductor device, comprising: A semiconductor device, comprising: a semiconductor substrate; a plurality of first...
US-9,059,083 Semiconductor device
A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first...
US-9,058,991 Diode string
Devices and methods are provided, wherein a diode string is provided in a well and the well is biased with an intermediate voltage between voltages applied to...
US-9,055,632 Bit packer for control signals
Representative implementations of devices and techniques provide a bit packing arrangement for a control signal. The control signal is received as a bit stream...
US-9,055,432 Targeted muting for communication between electronic appliances
A method for controlling the flow of data in a near field communication appliance having an interposed element and a plurality of secure elements connected to...
US-9,054,711 Frequency divider
This disclosure relates to a divide-by-N frequency divider system and frequency dividing method. The system includes a ring oscillator having M stages, where M...
US-9,054,618 Safety circuit and emergency power supply for gate control circuit
A power supply circuit can be used to provide an alternating-current supply voltage to an electric motor. The power supply circuit is supplied by line power....
US-9,054,515 Current measurement and overcurrent detection
Techniques are described for determining the amount of current flowing through an electrical conductor of an isolation device by measuring the voltage level...
US-9,054,182 Semiconductor device with field electrode and method
A semiconductor device with a field electrode and method. One embodiment provides a controllable semiconductor device including a control electrode for...
US-9,054,181 Semiconductor device, integrated circuit and method of manufacturing a semiconductor device
A semiconductor device includes a transistor. The transistor includes a source region, a drain region, a body region, a drift zone, and a gate electrode being...
US-9,054,151 Semiconductor device with laterally varying doping concentrations
A semiconductor device includes a semiconductor body including a first surface having a normal direction defining a vertical direction, a first n-type...
US-9,054,150 Chip edge sealing
The invention relates to a semiconductor component comprising a semiconductor body, an insulation on the semiconductor body and a cell array arranged at least...
US-9,054,123 Method for manufacturing a semiconductor device
A method for producing a semiconductor device is provided. The method includes: providing a wafer including an upper surface and a plurality of semiconductor...
US-9,054,063 High power single-die semiconductor package
A semiconductor package includes a single semiconductor die and an electrically and thermally conductive base. The single semiconductor die includes a...
US-9,054,040 Multi-die package with separate inter-die interconnects
A first electrode at a first side of a first semiconductor die is connected to a first conductive region of a substrate. A first electrode at a first side of a...
US-9,054,035 Increasing the doping efficiency during proton irradiation
A description is given of a method for doping a semiconductor body, and a semiconductor body produced by such a method. The method comprises irradiating the...
US-9,048,838 Switching circuit
In an embodiment, a switching circuit includes input drain, source and gate nodes, a high voltage depletion mode transistor including a current path coupled in...
US-9,048,338 Device including two power semiconductor chips and manufacturing thereof
A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the...
US-9,048,303 Group III-nitride-based enhancement mode transistor
A Group III-nitride-based enhancement mode transistor includes a heterojunction fin structure. Side faces and a top face of the heterojunction fin structure are...
US-9,048,248 Integrated circuit package assembly including wave guide
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a...
US-9,048,244 Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking
A method for manufacturing a marked single-crystalline substrate comprises providing a single-crystalline substrate comprising a first material, the...
US-9,048,150 Testing of semiconductor components and circuit layouts therefor
In one embodiment of the present invention, a method of forming a semiconductor device includes performing a test during the forming of the semiconductor device...
US-9,048,096 Diode-based ESD concept for DEMOS protection
The invention relates to an ESD protection circuit for an integrated circuit including a drain-extended MOS device and an output pad that requires protection....
US-9,048,095 Method for manufacturing a semiconductor device having a channel region in a trench
A method of manufacturing a semiconductor device includes forming a semiconductor diode by forming a drift region, forming a first semiconductor region of a...
US-9,048,091 Method and substrate for thick III-N epitaxy
A method of manufacturing an III-N substrate includes bonding a Si substrate to a support substrate, the Si substrate having a (111) growth surface facing away...
US-9,048,019 Semiconductor structure including guard ring
One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer...
US-9,047,985 Apparatus, storage device, switch and methods, which include microstructures extending from a support
An apparatus has a support and a plurality of bendable and conductive microstructures extending from the support. Two adjacent microstructures of the plurality...
US-9,042,860 Monolithically integrated circuit
A monolithically integrated circuit, particularly an integrated circuit for radio frequency power applications, may include a transistor and a spiral inductor....
US-9,042,127 LED power supply
A method can be used for controlling the switching operation of a switching power converter that includes a semiconductor switch coupled in series to an...
US-9,041,505 System and method for a coreless transformer
In accordance with an embodiment, a transformer includes a first coil disposed in a first conductive layer on a first side of a first dielectric layer, and a...
US-9,041,460 Packaged power transistors and power packages
A power package is provided comprising a packaged transistor and a driving unit connected to the transistor and adapted to drive the transistor. A control...
US-9,041,433 System and method for driving transistors
In accordance with an embodiment, a circuit includes a first transistor, a second transistor having a reference node coupled to an output node of the first...
US-9,041,375 High resolution control for a multimode SMPS converter and high resolution slope generator
In various embodiments a controller for controlling the operation of a switched mode power supply is provided, the controller comprising: a first signal source...
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