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Semiconductor device, integrated circuit and method of manufacturing a
A semiconductor device includes a transistor. The transistor includes a source region, a drain region, a body region, a drift zone, and a gate electrode being...
Semiconductor device with laterally varying doping concentrations
A semiconductor device includes a semiconductor body including a first surface having a normal direction defining a vertical direction, a first n-type...
Chip edge sealing
The invention relates to a semiconductor component comprising a semiconductor body, an insulation on the semiconductor body and a cell array arranged at least...
Method for manufacturing a semiconductor device
A method for producing a semiconductor device is provided. The method includes: providing a wafer including an upper surface and a plurality of semiconductor...
High power single-die semiconductor package
A semiconductor package includes a single semiconductor die and an electrically and thermally conductive base. The single semiconductor die includes a...
Multi-die package with separate inter-die interconnects
A first electrode at a first side of a first semiconductor die is connected to a first conductive region of a substrate. A first electrode at a first side of a...
Increasing the doping efficiency during proton irradiation
A description is given of a method for doping a semiconductor body, and a semiconductor body produced by such a method. The method comprises irradiating the...
In an embodiment, a switching circuit includes input drain, source and gate nodes, a high voltage depletion mode transistor including a current path coupled in...
Device including two power semiconductor chips and manufacturing thereof
A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the...
Group III-nitride-based enhancement mode transistor
A Group III-nitride-based enhancement mode transistor includes a heterojunction fin structure. Side faces and a top face of the heterojunction fin structure are...
Integrated circuit package assembly including wave guide
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a...
Method for manufacturing a marked single-crystalline substrate and
semiconductor device with marking
A method for manufacturing a marked single-crystalline substrate comprises providing a single-crystalline substrate comprising a first material, the...
Testing of semiconductor components and circuit layouts therefor
In one embodiment of the present invention, a method of forming a semiconductor device includes performing a test during the forming of the semiconductor device...
Diode-based ESD concept for DEMOS protection
The invention relates to an ESD protection circuit for an integrated circuit including a drain-extended MOS device and an output pad that requires protection....
Method for manufacturing a semiconductor device having a channel region in
A method of manufacturing a semiconductor device includes forming a semiconductor diode by forming a drift region, forming a first semiconductor region of a...
Method and substrate for thick III-N epitaxy
A method of manufacturing an III-N substrate includes bonding a Si substrate to a support substrate, the Si substrate having a (111) growth surface facing away...
Semiconductor structure including guard ring
One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer...
Apparatus, storage device, switch and methods, which include
microstructures extending from a support
An apparatus has a support and a plurality of bendable and conductive microstructures extending from the support. Two adjacent microstructures of the plurality...
Monolithically integrated circuit
A monolithically integrated circuit, particularly an integrated circuit for radio frequency power applications, may include a transistor and a spiral inductor....
LED power supply
A method can be used for controlling the switching operation of a switching power converter that includes a semiconductor switch coupled in series to an...
System and method for a coreless transformer
In accordance with an embodiment, a transformer includes a first coil disposed in a first conductive layer on a first side of a first dielectric layer, and a...
Packaged power transistors and power packages
A power package is provided comprising a packaged transistor and a driving unit connected to the transistor and adapted to drive the transistor. A control...
System and method for driving transistors
In accordance with an embodiment, a circuit includes a first transistor, a second transistor having a reference node coupled to an output node of the first...
High resolution control for a multimode SMPS converter and high resolution
In various embodiments a controller for controlling the operation of a switched mode power supply is provided, the controller comprising: a first signal source...
On-board power supply protection
The system includes a first and a second power supply terminal configured to have at least one of a battery and a generator connected thereto, a first external...
Chip arrangement and a method of manufacturing a chip arrangement
In various embodiments, a chip arrangement is provided. The chip arrangement may include a chip carrier and a chip mounted on the chip carrier. The chip may...
Semiconductor module arrangement and method for producing and operating a
semiconductor module arrangement
A semiconductor module arrangement includes a semiconductor module having a top side, an underside opposite the top side, and a plurality of electrical...
Chip-housing module and a method for forming a chip-housing module
A chip-housing module is provided, the chip-housing module including a carrier configured to carry one or more chips; the carrier including a first plurality of...
Multi-level semiconductor package
A semiconductor package includes a semiconductor die having a first electrode at a first side and a second electrode at a second side opposing the first side, a...
Wafer and a method of dicing a wafer
A wafer includes a plurality of chips, each of the chips being spaced from each other by kerf-line regions including a reduced width.
Power MOS transistor with integrated gate-resistor
A transistor device comprises: at least one individual transistor cell arranged in a transistor cell field on a semiconductor body, each individual transistor...
Memory device and method for making same
Embodiments relate to a method of forming a memory array, comprising: forming a collector layer; forming a plurality of collector regions in the collector...
Protection device for normally-on and normally-off high electron mobility
A transistor device includes a compound semiconductor body, a normally-on high electron mobility field effect transistor (HEMT) formed in the compound...
In one embodiment, a method of forming a semiconductor device comprises forming a groove on and/or over a first side of a substrate. A dicing layer is formed...
Method for processing a carrier, method for fabricating a charge storage
memory cell, method for processing a...
A method for processing a carrier accordance with various embodiments may include: forming a structure over the carrier, the structure including at least two...
Chip comprising a fill structure
A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the...
Semiconductor package and methods of formation thereof
In one embodiment, a semiconductor package includes a semiconductor chip having a first contact region on a first major surface and a second contact region on...
Variable load driver with power message transfer
Representative implementations of devices and techniques provide a modulation arrangement for a control signal. The control signal is received as a digital...
Circuit arrangement with a first semiconductor device and with a plurality
of second semiconductor devices
A circuit arrangement includes a first semiconductor device having a load path and a number of second semiconductor devices. Each second semiconductor device...
A circuit is described that includes a switch, a switchable clamping element coupled to the switch, and a driver configured to control the switch based at least...
Packaged device comprising non-integer lead pitches and method of
manufacturing the same
Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device...
Field-effect device and manufacturing method thereof
Embodiments relate to a field-effect device that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region,...
A transistor device includes a semiconductor heterostructure including a plurality of alternating two-dimensional electron gasses (2DEGs) and two-dimensional...
Silicon carbide device and a method for manufacturing a silicon carbide
A silicon carbide device includes an epitaxial silicon carbide layer including a first conductivity type and a buried lateral silicon carbide edge termination...
Method for mounting a semiconductor chip on a carrier
A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the...
Method of processing a substrate
In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into...
Method, apparatus and device for data processing
An embodiment relates to a method for data processing that includes reading data, the data comprising overhead information and payload information, and...
Safety system challenge-and-response using modified watchdog timer
Some embodiments of the present disclosure relate to a watchdog timer having an enhanced functionality that enables the watchdog timer to monitor a process flow...
Apparatus for logging a configuration of a microprocessor system and
method for logging a configuration of a...
An apparatus includes a logging apparatus and a configuration apparatus. The logging apparatus has a security module operable to create a manipulation-proof...
System and method for adaptive bit rate programming of a memory device
The disclosure relates to an electronic memory system, and more specifically, to a system for adaptive bit rate programming of a memory device, and a method for...