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Testing process for semiconductor devices
In accordance with an embodiment of the present invention, a method of manufacturing a semiconductor device includes providing a wafer having a top surface and...
Molded semiconductor package with backside die metallization
A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at...
Power transistor arrangement and method for manufacturing the same
Various embodiments provide a power transistor arrangement. The power transistor arrangement may include a carrier; a first power transistor having a control...
Test method and test arrangement
A test method in accordance with one or more embodiments may include: providing a semiconductor device to be tested, the semiconductor device including at least...
Semiconductor package with top-side insulation layer
A semiconductor package includes a base, a die attached to the base, a lead and a connector electrically connecting the lead to the die. A mold compound...
Interface for ensuring efficient data requests
The interface between a memory device and a device requesting data from the memory device ensures that the data requested are read from the memory device and...
Direct clutch slip control
An automatic transmission for a vehicle drivetrain includes a transmission housing, an input shaft, an output shaft, and a plurality of gears within the...
Low-power activation circuit with magnetic motion sensor
One embodiment of the present invention relates to a method and apparatus to perform a low power activation of a system by measuring the slope of a digital...
Circuit arrangements and methods for operating an electrical machine
A circuit arrangement is described comprising a first battery; a second battery; an electrical machine connected between the first battery and the second...
Method for controlling a transistor and control circuit
A description is given of a method for the pulsed control of a transistor which has a control terminal and a load path. The load path of the transistor is...
In a semiconductor diode a semiconductor body includes an injection efficiency control region between a drift region of a first conductivity type and a first...
Packaged vertical power device comprising compressive stress and method of
making a packaged vertical power device
A packaged vertical semiconductive device including a compressive stress and a method of making such a packaged vertical semiconductive device are disclosed. In...
Chip-package and a method for forming a chip-package
A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in...
Method for processing a semiconductor workpiece with metallization
A method for processing a semiconductor workpiece is provided, which may include: providing a semiconductor workpiece including a metallization layer stack...
Electronic device with a plurality of memory cells and with physically
An electronic device includes a non-volatile memory having a plurality of memory cells, a memory controller, and an evaluator. The memory controller is...
Trace based measurement architecture
A method for performing trace based measurement for a plurality of CPUs in parallel includes receiving a signal to perform a CPU parallel trace mode and...
Integrated sensor and magnetic field concentrator devices
Embodiments relate to integrated sensor and magnetic concentrator devices and methods. In one embodiment, an integrated sensor and magnetic field concentrator...
Sensor module and semiconductor chip
A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface...
Interface deactivation for communication between electronic appliances
A method for controlling the flow of data in a near field communication appliance having an interposed element and a plurality of secure elements is disclosed....
Apparatus and method for the characterization of analog-to-digital
A method and apparatus for characterizing an A/D converter are provided. The A/D converter is configured to convert an input signal into a digital output...
Methods of fabricating semiconductor devices and structures thereof
Methods of fabricating semiconductor devices and structures thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes...
Drain extended field effect transistors and methods of formation thereof
In an embodiment of the invention, a semiconductor device includes a first region having a first doping type, a channel region having the first doping type...
A semiconductor arrangement includes a first and second controllable vertical n-channel semiconductor chip. Each of the controllable vertical n-channel...
Mixed wire semiconductor lead frame package
One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A...
Semiconductor arrangement with a power transistor and a high voltage
device integrated in a common...
A semiconductor arrangement includes a semiconductor body and a power transistor including a source region, a drain region, a body region and a drift region...
Circuit with a plurality of modes of operation
A circuit capable of being operated in a first and a second mode of operation comprises a storage location adapted to store at least a first state, a second...
Electronic circuit and method for monitoring a data processing
According to one embodiment, an electronic circuit is described comprising a processing circuit configured to perform a data processing including a plurality of...
Charge recovery in power converter driver stages
A power converter includes a first transistor operable to source current to a load when switched on, a second transistor operable to freewheel inductor current...
Apparatus and method for measuring local surface temperature of
An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a...
Method of embedding an electronic component into an aperture of a
Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within...
Devices are provided comprising oscillator circuits coupled to a supply voltage via an adjustable resistance. Corresponding methods to control adjustable...
System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure...
System and method for capacitive signal source amplifier
In accordance with an embodiment, a system for amplifying a signal provided by a capacitive signal source includes a first voltage follower device, a second...
Protection circuit for protecting a half-bridge circuit
The present invention relates to a protection circuit for protecting a half-bridge circuit. The protection circuit detects an incorrect response of the...
Method of fabricating a power semiconductor chip package
A device includes a vertical power semiconductor chip having an epitaxial layer and a bulk semiconductor layer. A first contact pad is arranged on a first main...
Semiconductor device with step-shaped edge termination, and method for
manufacturing a semiconductor device
A semiconductor body has a first side, second side, lateral edge, active area, edge termination between the active area and the lateral edge, and drift region...
Power device and a reverse conducting power IGBT
A semiconductor device is provided which includes a semiconductor body having a base region and a main horizontal surface, and a first electrode arranged on the...
Integrated circuit, semiconductor device and method of manufacturing a
An integrated circuit including a semiconductor device has a power component including a plurality of trenches in a cell array, the plurality of trenches...
Embedded integrated circuit package and method for manufacturing an
embedded integrated circuit package
A embedded integrated circuit package is provided, the embedded integrated circuit package including: at least one chip arranged over a chip carrier, the at...
Semiconductor packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a die paddle, and an encapsulant disposed around the die paddle. The...
Method for forming self-aligned trench contacts of semiconductor
components and a semiconductor component
A semiconductor body component has a first surface and is comprised of a first semiconductor material extending to the first surface. At least one trench...
Semiconductor device including first and second semiconductor materials
A semiconductor device includes a first semiconductor region including a first semiconductor material. The semiconductor device further includes a second...
System and method for an electronic package with a fail-open mechanism
A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on...
Method for removing a dielectric layer from a bottom of a trench
Embodiments provide a method for removing a dielectric layer from a bottom of a trench while maintaining the dielectric layer on sidewalls of the trench. The...
Semiconductor device with a semiconductor chip and electrical connecting
elements to a conductor structure
A semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure, and a method for producing the same is disclosed....
Method of manufacturing and testing a chip package
A method of producing and testing a chip package is described. The chip package to be produced includes a semiconductor chip containing an integrated circuit...
Semiconductor device and method for forming a semiconductor device
A semiconductor device includes an insulated gate bipolar transistor (IGBT) arrangement. The IGBT arrangement includes a carrier confinement reduction region...
Conductive pads and methods of formation thereof
In one embodiment, a device includes a first conductive pad disposed over a substrate, and a etch stop layer disposed over a top surface of the first conductive...
Methods and systems for addressing memory with variable density
Embodiments relate to systems and methods for simplified addressing of a memory device whose total memory capacity is extendible by an additional memory...
Voltage regulator having input stage and current mirror
A voltage regulator includes an output stage including a control terminal and a load path, with the load path coupled between the input terminal and the output...