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Patent # Description
US-9,123,766 Transistor and method of manufacturing a transistor
In accordance with an embodiment of the present invention a transistor is disclosed. The transistor comprises a collector, a base and an emitter, wherein a...
US-9,123,764 Method of manufacturing a component comprising cutting a carrier
A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being...
US-9,123,735 Semiconductor device with combined passive device on chip back side
Semiconductor chips are described that combine a semiconductor device and a capacitor onto a single substrate such that the semiconductor device and the...
US-9,123,708 Semiconductor chip package
The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face,...
US-9,123,701 Semiconductor die and package with source down and sensing configuration
A semiconductor die includes a semiconductor body, a transistor device disposed in the semiconductor body and having a gate, a source and a drain, and a sense...
US-9,123,687 Method of manufacturing a semiconductor device
One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules...
US-9,123,559 Method for producing a semiconductor component
Methods for producing a semiconductor component that includes a transistor having a cell structure with a number of transistor cells monolithically integrated...
US-9,123,544 Semiconductor device and method
An electrical device includes a semiconductor chip. The semiconductor chip includes a routing line. An insulating layer is arranged over the semiconductor chip....
US-9,123,526 Module comprising a semiconductor chip
A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a...
US-9,123,397 Circuit arrangement and method for operating a circuit arrangement
A circuit arrangement comprising a plurality of electronic components; a plurality of first access lines and second access lines, wherein each electronic...
US-9,121,885 Sensor package and method of manufacturing thereof
A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment includes a sensor and a conductive line, wherein the sensor is...
US-9,121,884 Capacitive test method, apparatus and system for semiconductor packages
A multi-channel probe plate includes an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically...
US-9,121,880 Magnetic sensor device
A magnetic sensor device includes a magnet configured to generate a bias magnetic field. A plurality of electrical wires extend through the magnet. A magnetic...
US-9,118,395 Chip comprising a radio frequency switch arrangement, circuit arrangement and method for producing a radio...
A chip includes an RF switch arrangement that has a plurality of RF switches arranged jointly on the chip. Each of the RF switches has at least one first RF...
US-9,118,351 System and method for signature-based redundancy comparison
A system and method for signature-based redundancy comparison provides for receiving, by a master part, an input signal and generating, by the master part, a...
US-9,117,874 Method for fabricating a trench structure, and a semiconductor arrangement comprising a trench structure
A semiconductor device, in which a first trench section is produced proceeding from a surface of a semiconductor body into the semiconductor body. A...
US-9,117,807 Integrated passives package, semiconductor module and method of manufacturing
An integrated passives package includes an encapsulation compound and a plurality of electrically conductive pads embedded in the encapsulation compound. Each...
US-9,117,801 Semiconductor devices having a glass substrate, and method for manufacturing thereof
A method for manufacturing semiconductor devices includes providing a stack having a semiconductor wafer and a glass substrate with openings and at least one...
US-9,117,786 Chip module, an insulation material and a method for fabricating a chip module
The chip module includes a carrier, a semiconductor chip arranged on or embedded inside the carrier, and an insulation layer that at least partly covers a face...
US-9,117,748 Semiconductor device including a phase change material
A semiconductor device includes a transistor including a plurality of transistor cells in a semiconductor body, each transistor cell including a control...
US-9,117,694 Super junction structure semiconductor device based on a compensation structure including compensation layers...
A super junction semiconductor device includes strip structures between mesa regions that protrude from a base section in a cell area. Each strip structure...
US-9,117,586 Trimmable transformer arrangement
A circuit arrangement includes a coreless transformer. A trimming device is connected to the transformer and includes a variable capacitance and/or inductance.
US-9,116,875 Test circuit and method for processing a test routine
According to one embodiment, a test circuit is provided comprising a tester configured to perform a test routine comprising a plurality of test commands for...
US-9,116,841 Methods and systems for securely transferring embedded code and/or data designed for a device to a customer
The invention relates to methods and systems for securely transferring embedded code or data to a customer, in particular to methods and systems for securely...
US-9,116,196 Low offset vertical hall device and current spinning method
One embodiment of the present invention relates to a vertical Hall-effect device. The device includes at least two supply terminals arranged to supply...
US-9,116,046 Device and method for determining a direction from a surface of one or more photodetector elements of an...
In various embodiments a device is provided. The device includes an integrated circuit that includes one or more photodetector elements and a blocking structure...
US-9,112,501 Electronic circuit with an electronic switch and a monitoring circuit
An electronic circuit includes an electronic switch having a control terminal and a load path. A monitoring circuit includes a switched-capacitor circuit with a...
US-9,112,497 Circuit arrangement and method for generating a drive signal for a transistor
Disclosed is a circuit arrangement for generating a drive signal for a transistor. In one embodiment, the circuit arrangement includes a control circuit that...
US-9,112,494 Charge pump driven electronic switch with rapid turn off
An electronic circuit includes an electronic switch with a control terminal and a load path between a first and a second load terminal, and a drive circuit with...
US-9,112,491 Identification circuit and method for generating an identification bit using physical unclonable functions
An embodiment of the present invention is an identification circuit installed on an integrated circuit for generating an identification bit, comprising a first...
US-9,112,053 Method for producing a semiconductor device including a dielectric layer
A semiconductor device with a dielectric layer is produced by providing a semiconductor body with a first trench extending into the semiconductor body, the...
US-9,112,022 Super junction structure having a thickness of first and second semiconductor regions which gradually changes...
A super junction semiconductor device includes a super junction structure including first and second areas alternately arranged along a first lateral direction...
US-9,112,021 High voltage bipolar transistor with trench field plate
A bipolar transistor structure includes an epitaxial layer on a semiconductor substrate, a bipolar transistor device formed in the epitaxial layer and a trench...
US-9,111,989 Insulated gate bipolar transistor including emitter short regions
A semiconductor device includes an IGBT having a semiconductor body including a transistor cell array in a first area. A junction termination structure is in a...
US-9,111,847 Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a...
A method for manufacturing a chip package is provided. The method includes forming a layer over a carrier; forming further carrier material over the layer;...
US-9,111,781 Trench capacitors and methods of forming the same
A method of forming a semiconductor device includes forming an opening having a sidewall in a substrate and forming a first epitaxial layer in the opening. The...
US-9,111,772 Electronic array and chip package
An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation...
US-9,111,766 Transistor device with a field electrode
A transistor device includes a source region, a drift region, and a body region arranged between the source region and the drift region. A gate electrode is...
US-9,111,764 Integrated semiconductor device and a bridge circuit with the integrated semiconductor device
A bridge circuit is provided. The bridge circuit includes a first integrated semiconductor device having a high-side switch, a second integrated semiconductor...
US-9,110,480 Voltage ramp circuitry and voltage ramp methods for voltage regulators
Methods and apparatus for power regulation according to various aspects of the present invention may operate in conjunction with producing a voltage ramp...
US-9,110,121 Spinning current hall sensor with residual offset calibration signal
A spinning current Hall sensor configured to provide a sequence of input signals in response to a bias current being applied to a sequence of terminals of Hall...
US-9,107,335 Method for manufacturing an integrated circuit and an integrated circuit
A method for manufacturing an integrated circuit may include forming an electronic circuit in or above a carrier; forming at least one metallization layer...
US-9,106,211 System and method for an oversampled data converter
In accordance with an embodiment, a circuit includes an oscillator having an oscillation frequency dependent on an input signal, a digital accumulator having a...
US-9,106,124 Low-inductance power semiconductor assembly
A low-inductive power semiconductor assembly is provided in which semiconductor switches are arranged behind one another in a main current path.
US-9,105,747 Tunable stressed polycrystalline silicon on dielectrics in an integrated circuit
A method of forming an integrated circuit device is disclosed. A polycrystalline silicon layer is formed in direct contact with a dielectric material so that...
US-9,105,717 Manufacturing a semiconductor device using electrochemical etching, semiconductor device and super junction...
A trench is formed in a semiconductor substrate between mesas of a first conductivity type. The trench extends from a process surface down to a bottom plane. A...
US-9,105,713 Semiconductor device with metal-filled groove in polysilicon gate electrode
A semiconductor device includes a semiconductor substrate, a body region of a first conductivity type in the substrate, a source region of a second conductivity...
US-9,105,682 Semiconductor component with improved dynamic behavior
Disclosed is a semiconductor component that includes a semiconductor body, a first emitter region of a first conductivity type in the semiconductor body, a...
US-9,105,679 Semiconductor device and insulated gate bipolar transistor with barrier regions
In a semiconductor device a barrier region is sandwiched between a drift region and a charge carrier transfer region. The barrier and charge carrier transfer...
US-9,105,562 Integrated circuit package and packaging methods
An integrated circuit packaging method includes fabricating a package module from successive build-up layers which define circuit interconnections, forming a...
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