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Patent # Description
US-9,099,547 Testing process for semiconductor devices
In accordance with an embodiment of the present invention, a method of manufacturing a semiconductor device includes providing a wafer having a top surface and...
US-9,099,454 Molded semiconductor package with backside die metallization
A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at...
US-9,099,441 Power transistor arrangement and method for manufacturing the same
Various embodiments provide a power transistor arrangement. The power transistor arrangement may include a carrier; a first power transistor having a control...
US-9,099,419 Test method and test arrangement
A test method in accordance with one or more embodiments may include: providing a semiconductor device to be tested, the semiconductor device including at least...
US-9,099,391 Semiconductor package with top-side insulation layer
A semiconductor package includes a base, a die attached to the base, a lead and a connector electrically connecting the lead to the die. A mold compound...
US-9,098,393 Interface for ensuring efficient data requests
The interface between a memory device and a device requesting data from the memory device ensures that the data requested are read from the memory device and...
US-9,097,345 Direct clutch slip control
An automatic transmission for a vehicle drivetrain includes a transmission housing, an input shaft, an output shaft, and a plurality of gears within the...
US-9,094,015 Low-power activation circuit with magnetic motion sensor
One embodiment of the present invention relates to a method and apparatus to perform a low power activation of a system by measuring the slope of a digital...
US-9,093,929 Circuit arrangements and methods for operating an electrical machine
A circuit arrangement is described comprising a first battery; a second battery; an electrical machine connected between the first battery and the second...
US-9,093,836 Method for controlling a transistor and control circuit
A description is given of a method for the pulsed control of a transistor which has a control terminal and a load path. The load path of the transistor is...
US-9,093,568 Semiconductor diode
In a semiconductor diode a semiconductor body includes an injection efficiency control region between a drift region of a first conductivity type and a first...
US-9,093,437 Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
A packaged vertical semiconductive device including a compressive stress and a method of making such a packaged vertical semiconductive device are disclosed. In...
US-9,093,416 Chip-package and a method for forming a chip-package
A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in...
US-9,093,385 Method for processing a semiconductor workpiece with metallization
A method for processing a semiconductor workpiece is provided, which may include: providing a semiconductor workpiece including a metallization layer stack...
US-9,093,128 Electronic device with a plurality of memory cells and with physically unclonable function
An electronic device includes a non-volatile memory having a plurality of memory cells, a memory controller, and an evaluator. The memory controller is...
US-9,092,560 Trace based measurement architecture
A method for performing trace based measurement for a plurality of CPUs in parallel includes receiving a signal to perform a CPU parallel trace mode and...
US-9,091,702 Integrated sensor and magnetic field concentrator devices
Embodiments relate to integrated sensor and magnetic concentrator devices and methods. In one embodiment, an integrated sensor and magnetic field concentrator...
US-9,090,453 Sensor module and semiconductor chip
A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface...
US-9,088,304 Interface deactivation for communication between electronic appliances
A method for controlling the flow of data in a near field communication appliance having an interposed element and a plurality of secure elements is disclosed....
US-9,088,294 Apparatus and method for the characterization of analog-to-digital converters
A method and apparatus for characterizing an A/D converter are provided. The A/D converter is configured to convert an input signal into a digital output...
US-9,087,919 Methods of fabricating semiconductor devices and structures thereof
Methods of fabricating semiconductor devices and structures thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes...
US-9,087,892 Drain extended field effect transistors and methods of formation thereof
In an embodiment of the invention, a semiconductor device includes a first region having a first doping type, a channel region having the first doping type...
US-9,087,829 Semiconductor arrangement
A semiconductor arrangement includes a first and second controllable vertical n-channel semiconductor chip. Each of the controllable vertical n-channel...
US-9,087,827 Mixed wire semiconductor lead frame package
One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A...
US-9,087,707 Semiconductor arrangement with a power transistor and a high voltage device integrated in a common...
A semiconductor arrangement includes a semiconductor body and a power transistor including a source region, a drain region, a body region and a drift region...
US-9,087,219 Circuit with a plurality of modes of operation
A circuit capable of being operated in a first and a second mode of operation comprises a storage location adapted to store at least a first state, a second...
US-9,087,192 Electronic circuit and method for monitoring a data processing
According to one embodiment, an electronic circuit is described comprising a processing circuit configured to perform a data processing including a plurality of...
US-9,086,705 Charge recovery in power converter driver stages
A power converter includes a first transistor operable to source current to a load when switched on, a second transistor operable to freewheel inductor current...
US-9,086,328 Apparatus and method for measuring local surface temperature of semiconductor device
An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a...
US-9,084,382 Method of embedding an electronic component into an aperture of a substrate
Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within...
US-9,083,362 Oscillator circuit
Devices are provided comprising oscillator circuits coupled to a supply voltage via an adjustable resistance. Corresponding methods to control adjustable...
US-9,083,308 MEMS device
System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure...
US-9,083,286 System and method for capacitive signal source amplifier
In accordance with an embodiment, a system for amplifying a signal provided by a capacitive signal source includes a first voltage follower device, a second...
US-9,083,243 Protection circuit for protecting a half-bridge circuit
The present invention relates to a protection circuit for protecting a half-bridge circuit. The protection circuit detects an incorrect response of the...
US-9,082,878 Method of fabricating a power semiconductor chip package
A device includes a vertical power semiconductor chip having an epitaxial layer and a bulk semiconductor layer. A first contact pad is arranged on a first main...
US-9,082,843 Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
A semiconductor body has a first side, second side, lateral edge, active area, edge termination between the active area and the lateral edge, and drift region...
US-9,082,813 Power device and a reverse conducting power IGBT
A semiconductor device is provided which includes a semiconductor body having a base region and a main horizontal surface, and a first electrode arranged on the...
US-9,082,773 Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
An integrated circuit including a semiconductor device has a power component including a plurality of trenches in a cell array, the plurality of trenches...
US-9,082,767 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
A embedded integrated circuit package is provided, the embedded integrated circuit package including: at least one chip arranged over a chip carrier, the at...
US-9,082,759 Semiconductor packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a die paddle, and an encapsulant disposed around the die paddle. The...
US-9,082,746 Method for forming self-aligned trench contacts of semiconductor components and a semiconductor component
A semiconductor body component has a first surface and is comprised of a first semiconductor material extending to the first surface. At least one trench...
US-9,082,741 Semiconductor device including first and second semiconductor materials
A semiconductor device includes a first semiconductor region including a first semiconductor material. The semiconductor device further includes a second...
US-9,082,737 System and method for an electronic package with a fail-open mechanism
A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on...
US-9,082,719 Method for removing a dielectric layer from a bottom of a trench
Embodiments provide a method for removing a dielectric layer from a bottom of a trench while maintaining the dielectric layer on sidewalls of the trench. The...
US-9,082,706 Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure
A semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure, and a method for producing the same is disclosed....
US-9,082,644 Method of manufacturing and testing a chip package
A method of producing and testing a chip package is described. The chip package to be produced includes a semiconductor chip containing an integrated circuit...
US-9,082,629 Semiconductor device and method for forming a semiconductor device
A semiconductor device includes an insulated gate bipolar transistor (IGBT) arrangement. The IGBT arrangement includes a carrier confinement reduction region...
US-9,082,626 Conductive pads and methods of formation thereof
In one embodiment, a device includes a first conductive pad disposed over a substrate, and a etch stop layer disposed over a top surface of the first conductive...
US-9,082,462 Methods and systems for addressing memory with variable density
Embodiments relate to systems and methods for simplified addressing of a memory device whose total memory capacity is extendible by an additional memory...
US-9,081,404 Voltage regulator having input stage and current mirror
A voltage regulator includes an output stage including a control terminal and a load path, with the load path coupled between the input terminal and the output...
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