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Patent # Description
US-9,197,291 Circuit arrangement and method for bidirectional data transmission
A transformer arrangement for signal transmission is provided, the transformer arrangement having at least one transformer with a primary coil and a secondary...
US-9,197,131 Voltage sensing in a voltage converter
A method for sensing an output voltage in a voltage converter includes at least one switching element and a transformer. A voltage is sampled across an...
US-9,197,061 Electrostatic discharge clamping devices with tracing circuitry
Techniques and architectures corresponding to electrostatic discharge clamping circuits with tracing circuitry are described.
US-9,196,693 Method of manufacturing a semiconductor device having a buried field plate
A method of manufacturing a semiconductor device includes forming a first compound semiconductor material on a semiconductor substrate and forming a second...
US-9,196,688 Delamination and crack prevention in III-nitride wafers
In an exemplary implementation, a method includes growing a III-Nitride body over a group IV substrate in a semiconductor wafer. The method includes forming at...
US-9,196,675 Capacitor and method of forming a capacitor
A method for manufacturing a semiconductor device and a semiconductor device are disclosed. The method comprises forming a trench in a substrate, partially...
US-9,196,670 Through substrate features in semiconductor substrates
Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a...
US-9,196,577 Semiconductor packaging arrangement
A semiconductor packaging arrangement includes a transistor device including a first side including a source electrode and a gate electrode, a die pad having a...
US-9,196,568 Arrangement and method for manufacturing the same
An arrangement is provided. The arrangement may include: a die including at least one electronic component and a first terminal on a first side of the die and a...
US-9,196,562 Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic...
A semiconductor arrangement includes a silicon body having a top surface and a bottom surface, and a thick metal layer arranged on the top surface of the...
US-9,196,560 Semiconductor device having a locally reinforced metallization structure and method for manufacturing thereof
A method for forming a semiconductor device includes providing a semiconductor substrate having a first area and a second area. A first metal layer structure is...
US-9,196,554 Electronic component, arrangement and method
An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive...
US-9,196,535 Method and apparatus for separating semiconductor devices from a wafer
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor...
US-9,196,521 Adjustable pick-up head and method for manufacturing a device
An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up...
US-9,196,510 Semiconductor package comprising two semiconductor modules and laterally extending connectors
A semiconductor package includes a mold body having a first main face, a second main face opposite to the first main face and side faces connecting the first...
US-9,196,320 Method, apparatus and device for data processing
An embodiment relates to a method for data processing and comprises determining an electrical variable for each cell of a data bit, transforming each electrical...
US-9,195,857 Computational system
A computational system is configured to protect against integrity violation. The computational system includes a processing unit and a critical resource, the...
US-9,195,251 Controlled power factor correction circuit
In various embodiments a circuit arrangement is provided which may include: a first AC input node and a second AC input node; a first electronic switching...
US-9,195,248 Fast transient response voltage regulator
Techniques are described for adjusting an amount of current flowing through a first and second transistor of a voltage regulator connected to an output of a...
US-9,195,142 Lithography masks, systems, and manufacturing methods
Lithography masks, lithography systems, methods of manufacturing lithography masks, methods of altering material layers of semiconductor devices, and methods of...
US-9,194,036 Plasma vapor deposition
A plasma vapor deposition system is described for forming a feature on a semiconductor wafer. The plasma vapor deposition comprises a primary target electrode...
US-9,193,027 Retainer ring
A retainer ring is provided for use in conjunction with Chemical Mechanical Polishing apparatus which polishing is used to polish a substrate. Particularly, the...
US-9,190,903 System and method for a controlled feedback charge pump
According to various embodiments, a circuit includes a charge pump and a feedback circuit. The charge pump includes a first input, a second input configured to...
US-9,190,900 Active power factor corrector circuit
In accordance with an embodiment, an electronic device includes a controller configured to be coupled to a first switch of a power factor corrector. The...
US-9,190,540 Photo cell devices for phase-sensitive detection of light signals
Embodiments relate to photo cell devices. In one embodiment, a trench-based photo cells provides very fast capture of photo-generated charge carriers,...
US-9,190,511 Semiconductor component with a drift region and a drift control region
A semiconductor component with a drift region and a drift control region. One embodiment includes a semiconductor body having a drift region of a first...
US-9,190,480 Method and contact structure for coupling a doped body region to a trench electrode of a semiconductor device
A semiconductor body has a first surface, a second opposing surface, an edge, an active device region, and an edge termination region. A trench extends from the...
US-9,190,389 Chip package with passives
A chip package device includes an electrically conducting chip carrier, at least one semiconductor chip attached to the electrically conducting chip carrier,...
US-9,190,383 Semiconductor package including a power stage and integrated output inductor
In one implementation, a power semiconductor package includes a conductive carrier including a switch node segment and a power output segment. The power...
US-9,190,382 Method for producing a semiconductor module by using an adhesion carrier
A method for producing a semiconductor module includes providing an adhesion carrier and a plurality of circuit carriers. The adhesion carrier has an adhesive...
US-9,190,364 Die and chip
A die according to an embodiment includes a contact pad configured to provide an electrical contact to a circuit element included in the die, a lateral edge...
US-9,190,322 Method for producing a copper layer on a semiconductor body using a printing process
A method for producing a metal layer on a wafer is described. In one embodiment the method comprises providing a semiconductor wafer including a coating,...
US-9,190,149 Method and system for switchable erase or write operations in nonvolatile memory
Embodiments relate to systems and methods including a step of switching between two or more erase operations and/or two or more write operations for erasing of...
US-9,188,645 System and method for testing a circuit
In an embodiment, a device comprises a circuit with at least one circuit element; measurement circuitry capable to test a state of the at least one circuit...
US-9,188,625 Semiconductor device test structures and methods
Semiconductor device test structures and methods are disclosed. In a preferred embodiment, a test structure includes a feed line disposed in a first conductive...
US-9,185,762 Time of flight illumination circuit
Some aspects of the present disclosure provide system and method of operation of a driving circuit for a light emitting element in a Time-of-Flight (ToF)...
US-9,185,656 System including receiver front ends
An integrated circuit chip includes an output node, receiver front ends, and control logic. The receiver front ends are configured to receive an input signal....
US-9,184,744 Gate signal generation with adaptive signal profiles
A gate signal is generated by summation of multiple signal profiles. The gate signal is applied to a switching device to switch the switching device between an...
US-9,184,722 Adjustable impedance matching network
An impedance matching network includes a first terminal, a second terminal, and a reference potential terminal. The impedance matching network further includes...
US-9,184,284 Method for operating field-effect transistor, field-effect transistor and circuit configuration
A method for operating a field-effect transistor having a source terminal, a drain terminal, a gate terminal, a drift region and a dielectric region adjoining...
US-9,184,281 Method for manufacturing a vertical semiconductor device and vertical semiconductor device
Producing a vertical semiconductor device includes: providing a semiconductor wafer including a first semiconductor layer of a first conductivity type, a second...
US-9,184,277 Super junction semiconductor device comprising a cell area and an edge area
A super junction semiconductor device may include one or more doped zones in a cell area. A drift layer is provided between a doped layer of a first...
US-9,184,255 Diode with controllable breakdown voltage
Disclosed is a diode. An embodiment of the diode includes a semiconductor body, a first emitter region of a first conductivity type, a second emitter region of...
US-9,184,243 Monolithic composite III-nitride transistor with high voltage group IV enable switch
There are disclosed herein various implementations of a monolithically integrated component. In one exemplary implementation, such a monolithically integrated...
US-9,184,066 Chip arrangements and methods for manufacturing a chip arrangement
A chip arrangement is provided, the chip arrangement including: a carrier; a chip disposed over the carrier, the chip including one or more contact pads,...
US-9,183,977 Method for fabricating a coil by way of a rounded trench
A method for manufacturing an electronic device and an electronic device are disclosed. In an embodiment the method comprises forming an opening in an isolation...
US-9,183,413 Method and system for controlling a device
A system and method for controlling a device. Data that was encrypted using a first encryption scheme is decrypted, then re-encrypted using a second encryption...
US-9,182,305 Pressure monitoring circuits and methods
A pressure monitoring device comprises an analog-to-digital converter (ADC) to receive an analog signal and to convert the analog signal to a digital signal....
US-9,181,080 MEMS microphone with low pressure region between diaphragm and counter electrode
A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter...
US-9,180,743 Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
Embodiments can provide a system, a wheel localizer, a wheel localization device, a method or a computer program for locating a position of wheel and/or for...
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