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Patent # Description
US-1,022,8403 Sensor device, evaluation device and corresponding systems and methods
Various devices, systems and methods are disclosed where a noise signal component of a sensor signal is used to obtain information about a sensor device. A...
US-1,022,8294 System and method for temperature sensing
A method includes post processing a plurality of temperature sensors grouped into a plurality of sets. For each set of the plurality of sets, a post-processing...
US-1,022,5202 Communication systems and methods having reduced frame duration
A transmitter arrangement using randomization is disclosed. The arrangement includes one or more randomizers, a measure component and a frame select component....
US-1,022,4885 Differential logic with low voltage supply
In accordance with an embodiment, a method includes receiving a first differential logic signal using a first branch of a circuit that extends from a voltage...
US-1,022,4812 Sensing network mismatch compensation for switching voltage regulator with input voltage and current sensing
A voltage regulator includes a power stage configured to produce an output voltage from an input voltage at an input voltage terminal, a shunt resistor...
US-1,022,4806 Power converter with selective transformer winding input
Circuits and methods are provided for supplying power to a transformer of a switching DC/DC voltage converter within a power converter. The power converter...
US-1,022,2234 Rotation sensor
A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnet is positioned on an end face of...
US-1,021,9343 Pulse modulation for isolated auxiliary voltage and dimming signal transfer over single opto-isolator
In an example, a controller that controls one or more light-emitting diodes (LEDs), wherein the controller is configured to receive an output voltage from a...
US-1,021,8407 Radio frequency system and method for wearable device
A radio frequency (RF) system includes an RF integrated circuit (IC) die. The RF IC die includes a first transmit circuit, a second transmit circuit, a first...
US-1,021,8377 Gain calibration for ADC with external reference
Representative implementations of devices and techniques provide gain calibration for analog to digital conversion of time-discrete analog inputs. An adjustable...
US-1,021,8370 Temperature reference gain correction for analog-to-digital converter
Systems, methods, and circuitries are provided to control a gain setting in an analog-to-digital converter (ADC) that converts an analog signal to a digital...
US-1,021,8278 Isolated DC-DC voltage converters
A switching voltage converter using an isolated topology includes a transformer for coupling power from an input source to an output load. The transformer must...
US-1,021,7837 Method of manufacturing a semiconductor device having electrode trenches, isolated source zones and separation...
A semiconductor device includes a semiconductor mesa having source zones and at least one body zone forming first pn junctions with the source zones and a...
US-1,021,7830 Semiconductor device having trenches with enlarged width regions
A semiconductor device includes a plurality of trenches extending into a semiconductor substrate. Each trench comprises a plurality of enlarged width regions...
US-1,021,7812 Silicon-on-insulator chip having multiple crystal orientations
A silicon-on-insulator device having multiple crystal orientations is disclosed. In one embodiment, the silicon-on-insulator device includes a substrate layer,...
US-1,021,7695 Connector block with two sorts of through connections, and electronic device comprising a connector block
An electronic device comprising a semiconductor package having a first main surface region and a second main surface region and comprising a semiconductor chip...
US-1,021,7688 Electronic component having a heat-sink thermally coupled to a heat-spreader
An electronic component includes one or more semiconductor dice embedded in a first dielectric layer, a heat-spreader embedded in a second dielectric layer and...
US-1,021,7644 Production of adhesion structures in dielectric layers using photoprocess technology and devices incorporating...
In various aspects of the disclosure, a semiconductor device including at least one semiconductor die; a dielectric layer adjoining the semiconductor die;...
US-1,021,7638 Method for removing crystal originated particles from a crystalline silicon body using an etch process
A method for removing crystal originated particles from a crystalline silicon body having opposite first and second surfaces includes: increasing a surface area...
US-1,021,7636 Method of manufacturing a silicon carbide semiconductor device by removing amorphized portions
A trench is formed that extends from a main surface into a crystalline silicon carbide semiconductor layer. A mask is formed that includes a mask opening...
US-1,021,6929 Chip and method for detecting a change of a stored data vector
A chip is provided having processing circuits, each processing circuit configured to process a data vector to be stored according to a multiplication of the...
US-1,021,6678 Serial peripheral interface daisy chain communication with an in-frame response
In one example, a master device connected in a serial-peripheral interface (SPI) daisy chain configuration with a plurality of servant devices, wherein the...
US-1,021,6573 Method of operating a memory device
In various embodiments, a method of correcting and/or detecting an error in a memory device is provided. The method may include, in a first operations mode,...
US-1,021,5795 Three level gate monitoring
A method of monitoring a gate of a transistor includes monitoring a gate voltage of the transistor; measuring a first time difference between when a gate...
US-1,021,5691 Radar spectroscopy based gas sensor
A gas sensor includes a transmitter that may transmit a first radar signal, associated with a resonance peak corresponding to a first gas, through a space...
US-1,021,5593 Magnetic sensor
A sensor system for detecting a characteristic of a target object is described. The sensor system can include a sensor, such as a magnetic sensor, configured to...
US-1,021,5589 IO matching current modulated output for sensors
A sensor system enables a direct communication from a current modulated two-wire sensor or a speed sensor module to a TTL or CMOS processor. A magnetic speed...
US-1,021,4413 Micro-electro-mechanical system sensor devices
A MEMS sensor device includes an electrically conductive membrane and an electrically conductive closed loop structure. The closed loop structure is arranged in...
US-1,021,1737 Control of switching regulator
In some examples, a device includes control circuitry configured to receive a first input signal, receive a second input signal, and cause gate driver circuitry...
US-1,021,1329 Charge trapping prevention III-Nitride transistor
There are disclosed herein various implementations of a charge trapping prevention III-Nitride transistor. Such a transistor may be a III-Nitride high electron...
US-1,021,1325 Semiconductor device including undulated profile of net doping in a drift zone
A semiconductor device includes a semiconductor body having opposite first and second sides. The semiconductor device further includes a drift zone in the...
US-1,021,1306 Semiconductor device with diode region and trench gate structure
A semiconductor device includes a semiconductor body formed from a semiconductor material with a band-gap of at least 2.0 eV, the semiconductor body having a...
US-1,021,1300 Method of forming a semiconductor device
According to an embodiment of a method of forming a semiconductor device, a semiconductor layer including a first dopant species of a first conductivity type...
US-1,021,1158 Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an...
A power semiconductor module includes a direct copper bonded (DCB) substrate having a ceramic substrate, a first copper metallization bonded to a first main...
US-1,021,1133 Package with interconnections having different melting temperatures
A package comprising at least one electronic chip, a first heat removal body on which the at least one electronic chip is mounted by a first interconnection, a...
US-1,021,1057 Transistor component with reduced short-circuit current
A transistor component includes in a semiconductor body a source zone and a drift zone of a first conduction type, and a body zone of a second conduction type...
US-1,020,9212 Sensor arrangement for particle analysis and a method for particle analysis
According to various embodiments, a sensor arrangement for particle analysis may include: a base electrode configured to generate an electrical field for...
US-1,020,6286 Embedding into printed circuit board with drilling
In one example, a method includes drilling a cavity into each contact pad of one or more contact pads of a first printed circuit board to form one or more...
US-1,020,6279 Substrate and multiple substrate, and method for producing thereof
A substrate includes a ceramic layer, a metal layer fixed in a planar manner on a surface side of the ceramic layer and a cutout arranged in an edge region of...
US-1,020,6252 Driving several light sources
According to an example, a device is provided for driving several light sources, wherein the device is arranged to sense a supply signal and apply a phase shift...
US-1,020,6231 Tire pressure monitoring system (TPMS) module, system and method of acknowledging data transmissions for TPMS
A tire pressure monitoring system (TPMS) and TPMS sensor module are provide. The TPMS sensor module includes a pressure sensor configured to measure an internal...
US-1,020,5932 Imaging circuits and a method for operating an imaging circuit
An imaging circuit includes a first vertical trench gate and a neighboring second vertical trench gate. The imaging circuit includes a gate control circuit. The...
US-1,020,5541 Integrated RF circuit with phase-noise test capability
An integrated circuit is described herein. According to one or more embodiments, the integrated circuit includes a local oscillator with a voltage-controlled...
US-1,020,5422 System and method for a voltage controlled oscillator
In accordance with an embodiment, a voltage controlled oscillator (VCO) includes a VCO core having a plurality of transistors and a varactor circuit that has a...
US-1,020,5380 Power converter with tank circuit and over-voltage protection
In one implementation, a power converter with over-voltage protection includes a power switch coupled to a power supply through a tank circuit, and a control...
US-1,020,5032 Semiconductor structure and method for making same
One or more embodiments relate to a method of forming a semiconductor structure, comprising: providing a semiconductor substrate; forming an opening within the...
US-1,020,5019 Semiconductor device having a fin at a side of a semiconductor body
One embodiment of a semiconductor device includes a fin at a first side of a semiconductor body, a body region of a second conductivity type in at least a part...
US-1,020,5016 Method for manufacturing an integrated circuit including a lateral trench transistor and a logic circuit element
A method of forming an integrated circuit includes forming gate trenches in the first main surface of a semiconductor substrate, the gate trenches being formed...
US-1,020,5015 Reduced gate charge field-effect transistor
In one implementation, a reduced gate charge field-effect transistor (FET) includes a drift region situated over a drain, a body situated over the drift region,...
US-1,020,5011 Method for forming a semiconductor device with implanted chalcogen atoms
Some embodiments relate to a method for forming a semiconductor device. The method includes forming a source region of a field effect transistor structure in a...
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