At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Transistor with elevated drain termination
According to an exemplary implementation, a transistor includes drain finger electrodes interdigitated with source finger electrodes. The transistor also...
Semiconductor device with a semiconductor body containing hydrogen-related
A semiconductor device includes a semiconductor body with parallel first and second surfaces and containing hydrogen-related donors. A concentration profile of...
Group III-V device with a selectively modified impurity concentration
There are disclosed herein various implementations of a semiconductor structure and method. The semiconductor structure comprises a substrate, a transition body...
Semiconductor device and method of forming a semiconductor device
A semiconductor device is provided, which may include: a well of a first conductivity type located within a substrate of a second conductivity type; a well...
Integrated transistor structure having a power transistor and a bipolar
An integrated transistor structure includes an epitaxial layer on a semiconductor substrate, a power transistor formed in a first region of the epitaxial layer...
Power package with integrated magnetic field sensor
A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a...
Magnetic shielding of perpendicular STT-MRAM
A memory having an array of perpendicular spin-transfer torque (STT) magnetic random access memory (MRAM) cells, wherein each cell has a magnetic layer stack. A...
Semiconductor package with integrated die paddles for power stage
In one implementation, a semiconductor package includes a first conductive carrier including a first die paddle of the semiconductor package, and a control...
Plastic cooler for semiconductor modules
A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a...
Device and accessory pairing
A device authenticates accessories by detecting that an accessory is attached to the device, determining a unique identification (ID) for the accessory,...
Maximization of target signal and elimination of backbias component for a
differential upright position sensor
Embodiments relate to sensor device configurations. In one embodiment, a sensor device comprises a bias magnet, a field sensor die, a first set of one or more...
Method of forming a protective coating for a packaged semiconductor device
A first semiconductor substrate having at least one integrated semiconductor device is provided. A lift-off layer is formed on a main surface of the first...
Electronic device, a method for manufacturing an electronic device, and a
method for operating an electronic device
According to various embodiments, an electronic device may include a carrier including at least a first region and a second region being laterally adjacent to...
System and method for a switch having a normally-on transistor and a
In accordance with an embodiment, a circuit includes a first driver having a first output configured to be coupled to a control node of a normally-off...
Protected switching element
A circuit is suggested comprising an electronic switching element, a logic unit coupled to control the electronic switching element, and a counter unit coupled...
System and method for a switch driver
In accordance with an embodiment, switch driver includes a first switch driver configured to be coupled to a control node of a first switch, a second driver...
Magnetizing current based control of resonant converters
A resonant converter is described that includes at least one power switch. The at least one power switch is characterized by a non-linearity coefficient that is...
Methods and apparatus for a power supply
Methods and apparatus for a power supply according various aspects of the present invention operate in conjunction with a voltage converter for converting an...
Integrated circuit including sensor having injection molded magnetic
An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
Arrangement and method for determining the spatial direction of radiation
The present disclosure relates to an optical receiver. The optical receiver has a first photosensor and a second photosensor disposed within a substrate. The...
Strained semiconductor device and method of making the same
In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate...
Semiconductor component with dynamic behavior
One embodiment provides a semiconductor component including a semiconductor body having a first side and a second side and a drift zone; a first semiconductor...
Patterned back-barrier for III-nitride semiconductor devices
A compound semiconductor device includes a III-nitride buffer and a III-nitride barrier on the III-nitride buffer. The III-nitride barrier has a different band...
Chip and an electronic device
A method for processing a carrier accordance with various embodiments may include: forming a structure over the carrier, the structure including at least two...
Semiconductor arrangement with active drift zone
A semiconductor device arrangement includes a semiconductor layer and at least one series circuit with a first semiconductor device and a plurality of n second...
An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip...
Wafer scale package for high power devices
A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper...
Semiconductor arrangement, method for producing a semiconductor module,
method for producing a semiconductor...
A semiconductor arrangement includes upper and lower contact plates and basic chip assemblies. Each chip assembly has a semiconductor chip having a...
In an embodiment, an electronic component includes a dielectric core layer having a first major surface, a semiconductor die embedded in the dielectric core...
Passive component as thermal capacitance and heat sink
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board...
Semiconductor package having a multi-layered base
A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic case, a conductive base coupled to the...
Method for postdoping a semiconductor wafer
A method for treating a semiconductor wafer having a basic doping is disclosed. The method includes determining a doping concentration of the basic doping, and...
Laser thermal annealing of deep doped region using structured
A semiconductor body having a first surface is provided. A deep doped region of the semiconductor body is formed using masked ion implantation to implant dopant...
Method for forming a semiconductor device
A method for forming a semiconductor device includes carrying out an anodic oxidation of a surface region of a semiconductor substrate to form an oxide layer at...
Method and apparatus for controlling current in an array cell
A method and an apparatus for controlling current in an array cell is disclosed. The method includes applying a supply voltage to a first access point of a...
Relay attack prevention using RSSIPPLX
The disclosed invention relates to a passive keyless entry receiver system having an application controller that is activated upon receipt of an entire payload...
System and method to store data in an adjustably partitionable memory
The disclosure relates to an electronic memory system, and more specifically, to a system for storing data in an adjustably partitionable memory array, and a...
Sensor interface systems and methods
A sensor interface system includes a system bus, a bus master and a sensor. The bus master is coupled to the system bus. The bus master is configured to provide...
Electronic circuit and method for providing a clock signal
According to an embodiment, an electronic circuit is described comprising a processing circuit, a power supply configured to supply power to the processing...
Bias drift compensation
Representative implementations of devices and techniques provide detection of a voltage drift of an electrical component or system. A detection circuit detects...
Sonic sensors and packages
Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one...
Current sensor device
A current sensor device for sensing a measuring current includes a semiconductor chip having a magnetic field sensitive element. The current sensor device...
Gate stack for normally-off compound semiconductor transistor
A normally-off compound semiconductor transistor includes a heterostructure body and a gate stack on the heterostructure body. The heterostructure body includes...
Semiconductor device and insulated gate bipolar transistor with barrier
A semiconductor device includes a semiconductor mesa which is formed between cell trench structures extending from a first surface into a semiconductor body....
Semiconductor component with an emitter control electrode
A semiconductor component includes a first emitter zone of a first conductivity type, a second emitter zone of a second conductivity type, a first base zone...
Semiconductor device and method
In an embodiment, a semiconductor device includes a High Electron Mobility Transistor (HEMT) including a floating gate. The floating gate includes two or more...
In an embodiment, an electronic component includes a dielectric layer having a first surface and a second surface, one or more semiconductor dies embedded in...
Method for use in manufacturing a semiconductor device die
In one embodiment, a wafer includes a number of die areas each including a semiconductor device and dedicated to become a separate die. The die areas are...
Method for processing a wafer and method for dicing a wafer
In various embodiments, a method for processing a wafer may include: providing a wafer having at least one die region and at least one metallization disposed...
Contacts for semiconductor devices and methods of forming thereof
A method for a method of forming a semiconductor device includes providing a semiconductor substrate having a bottom surface opposite a top surface with...