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Patent # Description
US-9,153,706 Film-covered open-cavity sensor package
Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are...
US-9,153,674 Insulated gate bipolar transistor
A semiconductor device is disclosed. One embodiment provides a cell area and a junction termination area at a first side of a semiconductor zone of a first...
US-9,153,518 Molded semiconductor package with pluggable lead
A semiconductor package includes a semiconductor die having a plurality of terminals, a molding compound encapsulating the semiconductor die, and a pluggable...
US-9,153,369 Bias field generator including a body having two body parts and holding a packaged magnetic sensor
A device is disclosed. In one embodiment the device comprises a bias field generator configured to provide a magnetic bias field for a magnetic sensor, the bias...
US-9,153,297 Integrated circuit and method for manufacturing the same
An integrated circuit comprising at least one signal path which is adapted to route at least one signal from an origin to a target block, said signal path...
US-9,153,293 Operation scheme for non-volatile memory
A method of operating an integrated circuit includes determining at least one characteristic of at least one memory cell and conducting an operation for the at...
US-9,152,163 Regulation of a load current-to-sensing current ratio in a current sensing power metal-oxide-semiconductor...
This disclosure describes techniques for regulating a k.sub.ILIS factor (i.e., a load current-to-sensing current ratio) of a current sensing power...
US-9,151,827 Compensating slowly varying if DC offsets in receivers
The present disclosure relate to a receiver system that removes unwanted signal components from a received signal based upon signal information from previous...
US-9,151,809 Hall sensor arrangement for the redundant measurement of a magnetic field
In various embodiments, a Hall sensor arrangement for the redundant measurement of a magnetic field may include a first Hall sensor on a top side of a first...
US-9,148,923 Device having a plurality of driver circuits to provide a current to a plurality of loads and method of...
In various embodiments, a device is provided. The device includes a substrate having a first side and a second side opposite the first side. The substrate...
US-9,148,918 Feedforward circuit for fast analog dimming in LED drivers
Methods, devices, and circuits are disclosed delivering a first level of output current to one or more loads in a buck-boost converter comprising an inductor....
US-9,148,726 Micro electrical mechanical system with bending deflection of backplate structure
A micro electrical mechanical system includes a membrane structure and a backplate structure. The backplate structure includes a backplate material and at least...
US-9,148,712 Micromechanical digital loudspeaker
A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced...
US-9,148,709 Sensor interface with variable control coefficients
The present disclosure is directed towards a sensor interface module that delivers a supply voltage to a plurality of sensors, and which exchanges data signals...
US-9,148,101 LDO with distributed output device
At least one implementation relates to a method that includes receiving a bias voltage provided by a low-dropout voltage regulator (LDO) error amplifier;...
US-9,148,012 Circuit arrangement and method for evaluating a signal
Circuit arrangement including an interface, a protection circuit and a measurement circuit. The interface is configured to receive a signal. The protection...
US-9,147,840 Memory
A memory includes a first electrode and a second electrode formed within a first layer and includes a third electrode and a fourth electrode formed within a...
US-9,147,782 Optoelectronic transmission system and method
An optoelectronic transmission system has a photoemitter semiconductor component and a photodetector semiconductor component. The photoemitter semiconductor...
US-9,147,763 Charge-compensation semiconductor device
An active area of a semiconductor body includes a first charge-compensation structure having spaced apart n-type pillar regions, and an n-type first field-stop...
US-9,147,740 Stress-controlled HEMT
A transistor device includes a heterostructure body having a source, a drain spaced apart from the source and a two-dimensional charge carrier gas channel...
US-9,147,727 Semiconductor device and method for forming a semiconductor device
A semiconductor device includes an insulated gate bipolar transistor (IGBT) arrangement. The IGBT arrangement includes a first configuration region of...
US-9,147,660 Chip to package interface
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip disposed within an encapsulant, and a first...
US-9,147,649 Multi-chip module
A multi-chip module and method is disclosed. One embodiment provides an electronic module having a first metal structure and a second metal structure. A first...
US-9,147,639 Semiconductor dies having opposing sides with different reflectivity
A method of processing semiconductor dies is provided. Each semiconductor die has a first side with one or more terminals, a second side opposite the first side...
US-9,147,637 Module including a discrete device mounted on a DCB substrate
A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip...
US-9,147,631 Semiconductor power device having a heat sink
A semiconductor device includes an electrically conducting carrier having a mounting surface. The semiconductor device further includes a metal block having a...
US-9,147,630 Power semiconductor assembly and module
A method and apparatus for assembling a power semiconductor is provided. A device includes a printed circuit board, a heat sink, and a semiconductor chip...
US-9,147,628 Package-in-packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a leadframe having a plurality of leads and a die paddle and a...
US-9,147,624 Chip comprising a backside metal stack
A method for manufacturing a plurality of chips comprises the step of providing a wafer comprising a plurality of chip areas separated by one or more dicing...
US-9,147,610 Monitor structures and methods of formation thereof
In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a...
US-9,147,600 Packages for multiple semiconductor chips
In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first...
US-9,147,585 Method for fabricating a plurality of semiconductor devices
A number of semiconductor chips each include a first main face and a second main face opposite to the first main face. A first encapsulation layer is applied...
US-9,147,448 Circuit arrangement and method for operating a circuit arrangement
A circuit arrangement is provided, including a storage circuit and an output circuit. The storage circuit is configured to provide a first output signal and a...
US-9,146,874 Dual access for single port cache
A method and system for accessing a single port multi-way cache includes an address multiplexer that simultaneously addresses a set of data and a set of program...
US-9,146,572 Apparatus providing an output voltage
Apparatuses and methods are provided where a predefined voltage may be applied in a feedback circuit of a voltage regulator, the feedback circuit coupling and...
US-9,146,287 XMR sensors with high shape anisotropy
Embodiments relate to xMR sensors having very high shape anisotropy. Embodiments also relate to novel structuring processes of xMR stacks to achieve very high...
US-9,146,277 Test board and test system
The test board includes at least one first interface configured to electrically connect the test board with a test controller, at least one second interface...
US-9,145,332 Etching apparatus and method
An etchant is supplied to a workpiece. Furthermore, the workpiece is irradiated with spatially modulated light to adjust a temperature profile of said workpiece...
US-9,145,292 Cavity structures for MEMS devices
Embodiments relate to MEMS devices, particularly MEMS devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular...
US-9,145,034 Indirect tire pressure monitoring systems and methods
Embodiments relate to indirect tire pressure monitoring systems (TPMSs) and methods that utilize anti-lock braking system (ABS) signals. In embodiments,...
US-9,143,876 Glitch detection and method for detecting a glitch
System and method for detecting a glitch is disclosed. An embodiment comprises increasing a bias voltage of a first capacitor, sampling an input signal of a...
US-9,143,123 RF switch, mobile communication device and method for switching an RF signal
An RF switch includes a switchable RF transistor. The switchable RF transistor includes a stripe of a plurality of adjacent RF transistor fingers and at least...
US-9,143,078 Power inverter including SiC JFETs
A power inverter includes a reference line operably provided with a reference potential and a supply line operably provided with a DC supply voltage with...
US-9,143,043 Multi-mode operation and control of a resonant converter
In accordance with an embodiment, a method of controlling a switched-mode power includes generating a feedback signal proportional to an output of the...
US-9,142,987 Battery module with converter and decoupling switch
A battery module and an arrangement including a number of battery modules connected in series are disclosed. An energy store has a positive and a negative...
US-9,142,739 Method and system for providing a reliable light emitting diode semiconductor device
A method and a system for a reliable LED semiconductor device are provided. In one embodiment, the device comprises a carrier, a light emitting diode disposed...
US-9,142,665 Semiconductor component with a semiconductor via
A method for producing a semiconductor component includes providing a semiconductor body with a first surface and a second surface opposite the first surface,...
US-9,142,655 Semiconductor device
A semiconductor device in a semiconductor substrate includes a first main surface and a transistor cell. The transistor cell includes a drift region of a first...
US-9,142,592 Integrated circuit including ESD device
An integrated circuit including ESD device is disclosed. One embodiment includes a semiconductor region being electrically isolated from adjacent semiconductor...
US-9,142,550 High-voltage cascaded diode with HEMT and monolithically integrated semiconductor diode
An embodiment of a cascaded diode having a breakdown voltage exceeding 300V includes an HEMT and a Si Schottky diode. The HEMT includes a gate, a drain, a...
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