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Semiconductor device and RC-IGBT with zones directly adjoining a rear side
A semiconductor device includes a drift zone of a first conductivity type in a semiconductor body. Controllable cells are configured to form a conductive...
Method for protecting a semiconductor device against degradation and a
method for manufacturing a semiconductor...
A method for protecting a semiconductor device against degradation of its electrical characteristics is provided. The method includes providing a semiconductor...
Semiconductor device and substrate with chalcogen doped region
A semiconductor substrate includes a first side and a second side opposite the first side. A semiconductor material extends between the first and second sides...
Die arrangements containing an inductor coil and methods of manufacturing
a die arrangement containing an...
In various embodiments, a die arrangement may be provided. The die arrangement may include a die, at least one bond pad, at least one redistribution trace...
Semiconductor module with a semiconductor chip and a passive component and
method for producing the same
A semiconductor module includes a semiconductor chip and a passive discrete component. The semiconductor chip includes on its top side and/or on the back side...
A two-stage protection device for an electronic component protects against transient disturbances. The electronic component may be a semiconductor component,...
Method of manufacturing a chip package, chip package, method of
manufacturing a chip assembly and chip assembly
A method of manufacturing a chip package is provided. The method may include electrically contacting at least one first chip, the first chip including a first...
Method for producing a semiconductor module arrangement
A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a...
Nanotube structure based metal damascene process
In various embodiments a method for manufacturing a metallization layer on a substrate is provided, wherein the method may include forming a plurality of groups...
Semiconductor structure and method for making same
One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a substrate; forming a dielectric layer over the...
Cable quality detection and power consumer devices
In one embodiment, a method includes receiving power at a power consumer device coupled to a power provider device by a cable. The received power is supplied at...
System and device for determining electric voltages
A method and to a system can be used for measuring electric voltages in batteries with a number of battery cells. A measuring circuit includes at least one...
Film-covered open-cavity sensor package
Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are...
Insulated gate bipolar transistor
A semiconductor device is disclosed. One embodiment provides a cell area and a junction termination area at a first side of a semiconductor zone of a first...
Molded semiconductor package with pluggable lead
A semiconductor package includes a semiconductor die having a plurality of terminals, a molding compound encapsulating the semiconductor die, and a pluggable...
Bias field generator including a body having two body parts and holding a
packaged magnetic sensor
A device is disclosed. In one embodiment the device comprises a bias field generator configured to provide a magnetic bias field for a magnetic sensor, the bias...
Integrated circuit and method for manufacturing the same
An integrated circuit comprising at least one signal path which is adapted to route at least one signal from an origin to a target block, said signal path...
Operation scheme for non-volatile memory
A method of operating an integrated circuit includes determining at least one characteristic of at least one memory cell and conducting an operation for the at...
Regulation of a load current-to-sensing current ratio in a current sensing
This disclosure describes techniques for regulating a k.sub.ILIS factor (i.e., a load current-to-sensing current ratio) of a current sensing power...
Compensating slowly varying if DC offsets in receivers
The present disclosure relate to a receiver system that removes unwanted signal components from a received signal based upon signal information from previous...
Hall sensor arrangement for the redundant measurement of a magnetic field
In various embodiments, a Hall sensor arrangement for the redundant measurement of a magnetic field may include a first Hall sensor on a top side of a first...
Device having a plurality of driver circuits to provide a current to a
plurality of loads and method of...
In various embodiments, a device is provided. The device includes a substrate having a first side and a second side opposite the first side. The substrate...
Feedforward circuit for fast analog dimming in LED drivers
Methods, devices, and circuits are disclosed delivering a first level of output current to one or more loads in a buck-boost converter comprising an inductor....
Micro electrical mechanical system with bending deflection of backplate
A micro electrical mechanical system includes a membrane structure and a backplate structure. The backplate structure includes a backplate material and at least...
Micromechanical digital loudspeaker
A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced...
Sensor interface with variable control coefficients
The present disclosure is directed towards a sensor interface module that delivers a supply voltage to a plurality of sensors, and which exchanges data signals...
LDO with distributed output device
At least one implementation relates to a method that includes receiving a bias voltage provided by a low-dropout voltage regulator (LDO) error amplifier;...
Circuit arrangement and method for evaluating a signal
Circuit arrangement including an interface, a protection circuit and a measurement circuit. The interface is configured to receive a signal. The protection...
A memory includes a first electrode and a second electrode formed within a first layer and includes a third electrode and a fourth electrode formed within a...
Optoelectronic transmission system and method
An optoelectronic transmission system has a photoemitter semiconductor component and a photodetector semiconductor component. The photoemitter semiconductor...
Charge-compensation semiconductor device
An active area of a semiconductor body includes a first charge-compensation structure having spaced apart n-type pillar regions, and an n-type first field-stop...
A transistor device includes a heterostructure body having a source, a drain spaced apart from the source and a two-dimensional charge carrier gas channel...
Semiconductor device and method for forming a semiconductor device
A semiconductor device includes an insulated gate bipolar transistor (IGBT) arrangement. The IGBT arrangement includes a first configuration region of...
Chip to package interface
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip disposed within an encapsulant, and a first...
A multi-chip module and method is disclosed. One embodiment provides an electronic module having a first metal structure and a second metal structure. A first...
Semiconductor dies having opposing sides with different reflectivity
A method of processing semiconductor dies is provided. Each semiconductor die has a first side with one or more terminals, a second side opposite the first side...
Module including a discrete device mounted on a DCB substrate
A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip...
Semiconductor power device having a heat sink
A semiconductor device includes an electrically conducting carrier having a mounting surface. The semiconductor device further includes a metal block having a...
Power semiconductor assembly and module
A method and apparatus for assembling a power semiconductor is provided. A device includes a printed circuit board, a heat sink, and a semiconductor chip...
Package-in-packages and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a leadframe having a plurality of leads and a die paddle and a...
Chip comprising a backside metal stack
A method for manufacturing a plurality of chips comprises the step of providing a wafer comprising a plurality of chip areas separated by one or more dicing...
Monitor structures and methods of formation thereof
In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a...
Packages for multiple semiconductor chips
In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first...
Method for fabricating a plurality of semiconductor devices
A number of semiconductor chips each include a first main face and a second main face opposite to the first main face. A first encapsulation layer is applied...
Circuit arrangement and method for operating a circuit arrangement
A circuit arrangement is provided, including a storage circuit and an output circuit. The storage circuit is configured to provide a first output signal and a...
Dual access for single port cache
A method and system for accessing a single port multi-way cache includes an address multiplexer that simultaneously addresses a set of data and a set of program...
Apparatus providing an output voltage
Apparatuses and methods are provided where a predefined voltage may be applied in a feedback circuit of a voltage regulator, the feedback circuit coupling and...
XMR sensors with high shape anisotropy
Embodiments relate to xMR sensors having very high shape anisotropy. Embodiments also relate to novel structuring processes of xMR stacks to achieve very high...
Test board and test system
The test board includes at least one first interface configured to electrically connect the test board with a test controller, at least one second interface...
Etching apparatus and method
An etchant is supplied to a workpiece. Furthermore, the workpiece is irradiated with spatially modulated light to adjust a temperature profile of said workpiece...