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Semiconductor component with a front side and a back side metallization
layer and manufacturing method thereof
In various embodiments, a semiconductor component may include a semiconductor layer having a front side and a back side; at least one electronic element formed...
A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip...
Semiconductor component having a passivation layer and production method
A semiconductor component and a method for producing a semiconductor component are described. The semiconductor component includes a semiconductor body...
Inkjet printing in a peripheral region of a substrate
Methods, apparatuses and devices relate to inkjet printing a covering layer on at least a first side of a substrate in a peripheral region thereof are discussed.
Secure epass booklet based on double chip technology
A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first...
Signal generation for spectral measurements
Embodiments related to signal generation for spectral measurements are described and depicted. In one embodiment, a signal generator for a spectral measurement...
Angle measurement system including magnet with substantially square face
for through-shaft applications
To make the magnetic field lines straighter and more parallel to one another, the present disclosure makes use of substantially square magnets with...
Devices, chips and methods are provided which involve the use of either a first modulator path or a second modulator path depending on a level of a signal to be...
Method and system for compensating a delay mismatch between a first
measurement channel and a second...
A method and a system for compensating a delay mismatch between a first measurement channel and a second measurement channel is disclosed. A method for...
Driving an MOS transistor with constant precharging
A drive circuit may be configured to switch on an MOS transistor by precharging an input capacitance of the MOS transistor with a substantially constant amount...
Shutdown protection for bus line drivers
An electrical circuit for driving a bus is described that includes a plurality of branches coupled to at least one signal line at a termination of the bus and a...
Semiconductor component and method for producing a semiconductor component
A semiconductor component is produced by forming a trench in a semiconductor region. The trench has an upper trench region and a lower trench region. The upper...
Semiconductor device with an electrode buried in a cavity
A semiconductor device includes an active device region formed in an epitaxial layer disposed on a semiconductor substrate and a buried electrode disposed below...
Field plate trench transistor and method for producing it
A field plate trench transistor having a semiconductor body. In one embodiment the semiconductor has a trench structure and an electrode structure embedded in...
Method of making a semiconductor chip including identifying marks
A semiconductor chip includes a first mark for identifying a position of the chip within an exposure field. The semiconductor chip includes a first matrix in a...
Method for fabricating an electronic component
A carrier and a semiconductor chip are provided. A connection layer is applied to a first main face of the semiconductor chip. The connection layer includes a...
Packaged semiconductor device having an embedded system
Disclosed is a packaged device, comprising a carrier comprising a first carrier contact, a first electrical component having a first top surface and a first...
Semiconductor device and method for manufacturing a semiconductor device
A semiconductor device includes a semiconductor substrate including a main surface with a polygonal geometry and a main electric circuit manufactured within a...
Lead frame strips with support members
A lead frame strip includes a plurality of connected unit lead frames. Each unit lead frame has a die paddle for attaching to a semiconductor die, a tie bar...
Systems and methods for integrating bootstrap circuit elements in power
transistors and other devices
Embodiments relate to bootstrap circuits integrated with at least one other device, such as a power transistor or other semiconductor device. In embodiments,...
Method for forming a power semiconductor device
A method for forming a semiconductor device includes providing a semiconductor body which has a main surface and a first n-type semiconductor region, forming a...
Low noise semiconductor devices
Semiconductor devices may be configured to reduce noise in the devices. For example, a semiconductor device may be configured or made with a first doped region...
Chip arrangement, analysis apparatus, receiving container, and receiving
In various embodiments, a chip arrangement includes a first chip having a first antenna which is monolithically integrated in the first chip and is intended to...
Through bias pole for IGMR speed sensing
One embodiment relates to a sensing system that includes a magnetic encoder wheel having alternating pole magnetic domains along a circumference thereof. The...
Hall sensors and sensing methods
Embodiments relate to multi-terminal sensor devices and operating methods thereof that can reduce or eliminate offset error. In embodiments, sensor devices can...
System and method for testing a radio frequency integrated circuit
In an embodiment, a method of testing a radio frequency integrated circuit (RFIC) includes generating high frequency test signals using the on-chip test...
Adjustable impedance matching network
An adjustable impedance matching network includes a first terminal, a second terminal, a reference potential terminal, a transmission line transformer with a...
Timing monitor for PLL
Representative implementations of devices and techniques provide error detection for a phase-locked-loop (PLL) device. A timing monitor is arranged to count...
Lateral transistor component and method for producing same
A transistor component includes an active transistor region arranged in the semiconductor body. And insulation region surrounds the active transistor region in...
Circuit configured to adjust the activation state of transistors based on
Disclosed is a circuit arrangement, including a transistor component with a gate terminal, a control terminal, and a load path between a source and a drain...
IGBT with reduced feedback capacitance
An IGBT includes at least one first type transistor cell, including a base region, a first emitter region, a body region, and a second emitter region. The body...
Semiconductor device with charge compensation structure
A semiconductor device is provided. The semiconductor device includes a semiconductor body having a main surface. In a vertical cross-section which is...
Power semiconductor device with an edge termination region
A power semiconductor device includes a semiconductor substrate, an active device region disposed in the semiconductor substrate, an edge termination region...
Transistor cell array including semiconductor diode
One embodiment of a semiconductor device includes a dense trench transistor cell array. The dense trench transistor cell array includes a plurality of...
Method for separating a plurality of dies and a processing device for
separating a plurality of dies
A method for separating a plurality of dies is provided. The method may include: selectively removing one or more portions from a carrier including a plurality...
Alignment mark definer
An alignment mark definer is configured to provide a geometrical definition for an actual alignment structure to be formed at a temporary surface of a substrate...
Semiconductor device including a material to absorb thermal energy
A semiconductor device includes a semiconductor chip and a first material including molecules that are configured to absorb thermal energy by reversibly...
Semiconductor device comprising a fuse structure and a method for
manufacturing such semiconductor device
A semiconductor device comprises a semiconductor substrate, an anorganic isolation layer on the semiconductor substrate and a metallization layer on the...
Method for providing a self-aligned pad protection in a semiconductor
According to one embodiment, a method for processing a semiconductor device is provided including forming a final metal layer forming a passivation layer over...
Integrated circuit, a chip package and a method for manufacturing an
An integrated circuit is provided, the integrated circuit including: a carrier including at least one electronic component and at least one contact area...
Processor arrangements and a method for transmitting a data bit sequence
A processor arrangement is provided. The processor arrangement includes: a first processor; a plurality of second processors, each second processor including a...
The disclosure relates to methods and systems for trace solutions in a computer processing system. More specifically, the disclosure relates to methods and...
Magnetoresistive device and method for manufacturing the same
A magnetoresistive device includes a carrier, an xMR-sensor, a magnetic layer formed above an active xMR-region of the xMR-sensor and an insulating layer...
Apparatus having a back-bias magnet and a semiconductor chip element
An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic...
Systems and methods for offset reduction in sensor devices and systems
Embodiments relate to systems and methods for reducing errors in sensor devices and systems. In embodiments, the sensor devices comprise magnetic field sensor...
A MEMS device includes a fixed electrode and a movable electrode arranged isolated and spaced from the fixed electrode by a distance. The movable electrode is...
Direction indicator circuit for controlling a direction indicator in a
A direction indicator circuit for controlling a direction indicator may include: a first terminal for connecting to a supply voltage terminal; a second terminal...
System and method to address devices connected to a bus system
A system includes a bus system, such as a LIN bus system. A number of components are connected to the bus system. A first component of the components is...
Semiconductor device including short-circuit protection
A semiconductor device includes a load current path operable to carry a load current from a supply terminal having a supply voltage to an output circuit node....
Field effect transistor
In a method for fabricating a field effect transistor, a first source/drain region and a second source/drain region are formed in a substrate. A channel region...