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Patent # Description
US-9,202,811 Cascode circuit integration of group III-N and group IV devices
In an exemplary implementation, an integrated assembly includes a printed circuit board, and a depletion mode III-Nitride transistor die and a group IV...
US-9,202,800 Methods for producing a bond and a semiconductor module
A pressure chamber has first and second housing elements and first and second chamber regions. The pressure chamber is loaded with a first part, a second part,...
US-9,202,760 Semiconductor devices and structures
Devices, semiconductor structures and methods are provided, where a substrate is around a semiconductor device is biased via a resistive element.
US-9,202,753 Semiconductor devices and methods of producing these
A method includes applying a reinforcing wafer to a semiconductor wafer, thereby forming a composite wafer. Further the method includes dividing the composite...
US-9,202,710 Method for defining a separating structure within a semiconductor device
A method includes depositing a material layer over a semiconductor substrate and using a first mask in a first exposure/patterning process to pattern the...
US-9,202,687 Fabrication of III-nitride layers
A method that includes implantation of dopants while a III-nitride body is being grown on a substrate, and an apparatus for the practice of the method.
US-9,202,543 System and methods using a multiplexed reference for sense amplifiers
A sense amplifier system includes a first path, a second path, a memory cell, a first reference cell, a second reference cell, and a switch component. The...
US-9,202,538 Wordline activation
Methods and devices are disclosed where a voltage on a wordline is changed from a first voltage to a second voltage via a plurality of intermediate voltages.
US-9,202,161 Transponder inlay for a document for personal identification and a method for producing a transponder inlay
A transponder inlay for a document for personal identification having a transponder substrate, for arrangement of a transponder unit comprising a chip and an...
US-9,201,719 Method and system for timeout monitoring
Embodiments relate to systems and methods for timeout monitoring of concurrent commands or parallel communication channels comprising assigning or de-assigning...
US-9,201,435 System and method for a power supply
In accordance with an embodiment, a method of controlling a power supply node includes measuring a voltage of the power supply node, determining a first current...
US-9,201,123 Magnetic sensor device and a method for fabricating the same
A magnetic sensor device includes a plurality of electrical wires, a magnetic sensor chip, and a magnet. The magnet is formed from a material composition of a...
US-9,201,007 Device for determination of gas concentration
A device can be used for establishing gas concentrations in an examination volume. A radiation source is configured to generate an electromagnetic beam. A beam...
US-9,200,924 Magnetic out-of-axis angle sensing principle
The present disclosure relates to a magnetic angle sensor module having first magnetic polewheel comprising a first number of poles and a second magnetic...
US-9,197,453 Transmitter circuit and method for operating thereof
In various embodiments a transmitter circuit may include a first circuit configured to transmit data in a first data transmission mode, a second circuit...
US-9,197,291 Circuit arrangement and method for bidirectional data transmission
A transformer arrangement for signal transmission is provided, the transformer arrangement having at least one transformer with a primary coil and a secondary...
US-9,197,131 Voltage sensing in a voltage converter
A method for sensing an output voltage in a voltage converter includes at least one switching element and a transformer. A voltage is sampled across an...
US-9,197,061 Electrostatic discharge clamping devices with tracing circuitry
Techniques and architectures corresponding to electrostatic discharge clamping circuits with tracing circuitry are described.
US-9,196,693 Method of manufacturing a semiconductor device having a buried field plate
A method of manufacturing a semiconductor device includes forming a first compound semiconductor material on a semiconductor substrate and forming a second...
US-9,196,688 Delamination and crack prevention in III-nitride wafers
In an exemplary implementation, a method includes growing a III-Nitride body over a group IV substrate in a semiconductor wafer. The method includes forming at...
US-9,196,675 Capacitor and method of forming a capacitor
A method for manufacturing a semiconductor device and a semiconductor device are disclosed. The method comprises forming a trench in a substrate, partially...
US-9,196,670 Through substrate features in semiconductor substrates
Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a...
US-9,196,577 Semiconductor packaging arrangement
A semiconductor packaging arrangement includes a transistor device including a first side including a source electrode and a gate electrode, a die pad having a...
US-9,196,568 Arrangement and method for manufacturing the same
An arrangement is provided. The arrangement may include: a die including at least one electronic component and a first terminal on a first side of the die and a...
US-9,196,562 Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic...
A semiconductor arrangement includes a silicon body having a top surface and a bottom surface, and a thick metal layer arranged on the top surface of the...
US-9,196,560 Semiconductor device having a locally reinforced metallization structure and method for manufacturing thereof
A method for forming a semiconductor device includes providing a semiconductor substrate having a first area and a second area. A first metal layer structure is...
US-9,196,554 Electronic component, arrangement and method
An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive...
US-9,196,535 Method and apparatus for separating semiconductor devices from a wafer
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor...
US-9,196,521 Adjustable pick-up head and method for manufacturing a device
An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up...
US-9,196,510 Semiconductor package comprising two semiconductor modules and laterally extending connectors
A semiconductor package includes a mold body having a first main face, a second main face opposite to the first main face and side faces connecting the first...
US-9,196,320 Method, apparatus and device for data processing
An embodiment relates to a method for data processing and comprises determining an electrical variable for each cell of a data bit, transforming each electrical...
US-9,195,857 Computational system
A computational system is configured to protect against integrity violation. The computational system includes a processing unit and a critical resource, the...
US-9,195,251 Controlled power factor correction circuit
In various embodiments a circuit arrangement is provided which may include: a first AC input node and a second AC input node; a first electronic switching...
US-9,195,248 Fast transient response voltage regulator
Techniques are described for adjusting an amount of current flowing through a first and second transistor of a voltage regulator connected to an output of a...
US-9,195,142 Lithography masks, systems, and manufacturing methods
Lithography masks, lithography systems, methods of manufacturing lithography masks, methods of altering material layers of semiconductor devices, and methods of...
US-9,194,036 Plasma vapor deposition
A plasma vapor deposition system is described for forming a feature on a semiconductor wafer. The plasma vapor deposition comprises a primary target electrode...
US-9,193,027 Retainer ring
A retainer ring is provided for use in conjunction with Chemical Mechanical Polishing apparatus which polishing is used to polish a substrate. Particularly, the...
US-9,190,903 System and method for a controlled feedback charge pump
According to various embodiments, a circuit includes a charge pump and a feedback circuit. The charge pump includes a first input, a second input configured to...
US-9,190,900 Active power factor corrector circuit
In accordance with an embodiment, an electronic device includes a controller configured to be coupled to a first switch of a power factor corrector. The...
US-9,190,540 Photo cell devices for phase-sensitive detection of light signals
Embodiments relate to photo cell devices. In one embodiment, a trench-based photo cells provides very fast capture of photo-generated charge carriers,...
US-9,190,511 Semiconductor component with a drift region and a drift control region
A semiconductor component with a drift region and a drift control region. One embodiment includes a semiconductor body having a drift region of a first...
US-9,190,480 Method and contact structure for coupling a doped body region to a trench electrode of a semiconductor device
A semiconductor body has a first surface, a second opposing surface, an edge, an active device region, and an edge termination region. A trench extends from the...
US-9,190,389 Chip package with passives
A chip package device includes an electrically conducting chip carrier, at least one semiconductor chip attached to the electrically conducting chip carrier,...
US-9,190,383 Semiconductor package including a power stage and integrated output inductor
In one implementation, a power semiconductor package includes a conductive carrier including a switch node segment and a power output segment. The power...
US-9,190,382 Method for producing a semiconductor module by using an adhesion carrier
A method for producing a semiconductor module includes providing an adhesion carrier and a plurality of circuit carriers. The adhesion carrier has an adhesive...
US-9,190,364 Die and chip
A die according to an embodiment includes a contact pad configured to provide an electrical contact to a circuit element included in the die, a lateral edge...
US-9,190,322 Method for producing a copper layer on a semiconductor body using a printing process
A method for producing a metal layer on a wafer is described. In one embodiment the method comprises providing a semiconductor wafer including a coating,...
US-9,190,149 Method and system for switchable erase or write operations in nonvolatile memory
Embodiments relate to systems and methods including a step of switching between two or more erase operations and/or two or more write operations for erasing of...
US-9,188,645 System and method for testing a circuit
In an embodiment, a device comprises a circuit with at least one circuit element; measurement circuitry capable to test a state of the at least one circuit...
US-9,188,625 Semiconductor device test structures and methods
Semiconductor device test structures and methods are disclosed. In a preferred embodiment, a test structure includes a feed line disposed in a first conductive...
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