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Patent # Description
US-9,207,693 Method and apparatus for compensating PVT variations
A method and device for compensating PVT (process, voltage temperature) variations are disclosed. In some embodiments an integrated circuit includes a buffer...
US-9,207,683 Flow meter device and method of operation
A flow meter device is coupled to at least one sensor that measures a flow speed and provides status signals from which the flow speed can be determined. The...
US-9,207,292 Magnetoresistive device and method for manufacturing the same
A magnetoresistive device includes a carrier, an xMR-sensor, a magnetic layer formed above an active xMR-region of the xMR-sensor and an insulating layer...
US-9,207,291 XMR angle sensors
Embodiments relate to xMR sensors, sensor elements and structures, and methods. In an embodiment, a sensor element comprises a non-elongated xMR structure; and...
US-9,207,256 Auto-calibration of acceleration sensors
Representative implementations of devices and techniques provide calibration for a sensor. The calibration includes adapting an output signal of the sensor...
US-9,204,543 Integrated IC package
An Integrated Circuit (IC) package comprises a package comprising a first set of pads having a pinout that is compatible with a chip core of a product family. A...
US-9,203,451 System and method for an RF receiver
In accordance with an embodiment, a radio-frequency (RF) front-end for a radio configured to receive an RF signal at a first frequency includes an antenna port...
US-9,203,437 Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
A circuitry is proposed for the correction of errors in a possibly erroneous binary word v'=v'.sub.1, . . . , v'.sub.n relative to a codeword v=v.sub.1, . . . ,...
US-9,203,394 Integrated magnetic field sensor-controlled switch devices
Embodiments relate to integrated magnetic field sensor-controlled switch devices, such as transistors, current sources, and power switches, among others. In an...
US-9,203,363 Chopped circuit with AC and DC ripple error feedback loops
The present disclosure relate to a sensor system having a low offset error. In some embodiments, the sensor system comprises a sensor configured to generate a...
US-9,203,311 Buck-boost converter with active output voltage discharge
Methods, devices, and integrated circuits are disclosed for applying an active output voltage discharge for a buck-boost converter. One example is directed to a...
US-9,202,910 Lateral power semiconductor device and method for manufacturing a lateral power semiconductor device
A lateral power semiconductor device includes a semiconductor body having a first surface and a second opposite surface, a first main electrode, a second main...
US-9,202,909 Power MOSFET semiconductor
A semiconductor device includes a source metallization, a source region of a first conductivity type in contact with the source metallization, a body region of...
US-9,202,882 Semiconductor device with a thick bottom field plate trench having a single dielectric and angled sidewalls
Disclosed is a power device, such as a power MOSFET device and a method for fabricating same. The device includes a field plate trench. The field plate trench...
US-9,202,881 Semiconductor component with dynamic behavior
One embodiment provides a semiconductor component including a semiconductor body having a first side and a second side and a drift zone; a first semiconductor...
US-9,202,832 Integrated circuit arrangements
An integrated circuit arrangement is provided, including a transistor including a gate region; and a wavelength conversion element, wherein the wavelength...
US-9,202,815 Method for processing a carrier, a carrier, and a split gate field effect transistor structure
According to various embodiments, a method for processing a carrier may include: doping a carrier with fluorine such that a first surface region of the carrier...
US-9,202,811 Cascode circuit integration of group III-N and group IV devices
In an exemplary implementation, an integrated assembly includes a printed circuit board, and a depletion mode III-Nitride transistor die and a group IV...
US-9,202,800 Methods for producing a bond and a semiconductor module
A pressure chamber has first and second housing elements and first and second chamber regions. The pressure chamber is loaded with a first part, a second part,...
US-9,202,760 Semiconductor devices and structures
Devices, semiconductor structures and methods are provided, where a substrate is around a semiconductor device is biased via a resistive element.
US-9,202,753 Semiconductor devices and methods of producing these
A method includes applying a reinforcing wafer to a semiconductor wafer, thereby forming a composite wafer. Further the method includes dividing the composite...
US-9,202,710 Method for defining a separating structure within a semiconductor device
A method includes depositing a material layer over a semiconductor substrate and using a first mask in a first exposure/patterning process to pattern the...
US-9,202,687 Fabrication of III-nitride layers
A method that includes implantation of dopants while a III-nitride body is being grown on a substrate, and an apparatus for the practice of the method.
US-9,202,543 System and methods using a multiplexed reference for sense amplifiers
A sense amplifier system includes a first path, a second path, a memory cell, a first reference cell, a second reference cell, and a switch component. The...
US-9,202,538 Wordline activation
Methods and devices are disclosed where a voltage on a wordline is changed from a first voltage to a second voltage via a plurality of intermediate voltages.
US-9,202,161 Transponder inlay for a document for personal identification and a method for producing a transponder inlay
A transponder inlay for a document for personal identification having a transponder substrate, for arrangement of a transponder unit comprising a chip and an...
US-9,201,719 Method and system for timeout monitoring
Embodiments relate to systems and methods for timeout monitoring of concurrent commands or parallel communication channels comprising assigning or de-assigning...
US-9,201,435 System and method for a power supply
In accordance with an embodiment, a method of controlling a power supply node includes measuring a voltage of the power supply node, determining a first current...
US-9,201,123 Magnetic sensor device and a method for fabricating the same
A magnetic sensor device includes a plurality of electrical wires, a magnetic sensor chip, and a magnet. The magnet is formed from a material composition of a...
US-9,201,007 Device for determination of gas concentration
A device can be used for establishing gas concentrations in an examination volume. A radiation source is configured to generate an electromagnetic beam. A beam...
US-9,200,924 Magnetic out-of-axis angle sensing principle
The present disclosure relates to a magnetic angle sensor module having first magnetic polewheel comprising a first number of poles and a second magnetic...
US-9,197,453 Transmitter circuit and method for operating thereof
In various embodiments a transmitter circuit may include a first circuit configured to transmit data in a first data transmission mode, a second circuit...
US-9,197,291 Circuit arrangement and method for bidirectional data transmission
A transformer arrangement for signal transmission is provided, the transformer arrangement having at least one transformer with a primary coil and a secondary...
US-9,197,131 Voltage sensing in a voltage converter
A method for sensing an output voltage in a voltage converter includes at least one switching element and a transformer. A voltage is sampled across an...
US-9,197,061 Electrostatic discharge clamping devices with tracing circuitry
Techniques and architectures corresponding to electrostatic discharge clamping circuits with tracing circuitry are described.
US-9,196,693 Method of manufacturing a semiconductor device having a buried field plate
A method of manufacturing a semiconductor device includes forming a first compound semiconductor material on a semiconductor substrate and forming a second...
US-9,196,688 Delamination and crack prevention in III-nitride wafers
In an exemplary implementation, a method includes growing a III-Nitride body over a group IV substrate in a semiconductor wafer. The method includes forming at...
US-9,196,675 Capacitor and method of forming a capacitor
A method for manufacturing a semiconductor device and a semiconductor device are disclosed. The method comprises forming a trench in a substrate, partially...
US-9,196,670 Through substrate features in semiconductor substrates
Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a...
US-9,196,577 Semiconductor packaging arrangement
A semiconductor packaging arrangement includes a transistor device including a first side including a source electrode and a gate electrode, a die pad having a...
US-9,196,568 Arrangement and method for manufacturing the same
An arrangement is provided. The arrangement may include: a die including at least one electronic component and a first terminal on a first side of the die and a...
US-9,196,562 Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic...
A semiconductor arrangement includes a silicon body having a top surface and a bottom surface, and a thick metal layer arranged on the top surface of the...
US-9,196,560 Semiconductor device having a locally reinforced metallization structure and method for manufacturing thereof
A method for forming a semiconductor device includes providing a semiconductor substrate having a first area and a second area. A first metal layer structure is...
US-9,196,554 Electronic component, arrangement and method
An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive...
US-9,196,535 Method and apparatus for separating semiconductor devices from a wafer
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor...
US-9,196,521 Adjustable pick-up head and method for manufacturing a device
An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up...
US-9,196,510 Semiconductor package comprising two semiconductor modules and laterally extending connectors
A semiconductor package includes a mold body having a first main face, a second main face opposite to the first main face and side faces connecting the first...
US-9,196,320 Method, apparatus and device for data processing
An embodiment relates to a method for data processing and comprises determining an electrical variable for each cell of a data bit, transforming each electrical...
US-9,195,857 Computational system
A computational system is configured to protect against integrity violation. The computational system includes a processing unit and a critical resource, the...
US-9,195,251 Controlled power factor correction circuit
In various embodiments a circuit arrangement is provided which may include: a first AC input node and a second AC input node; a first electronic switching...
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