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Patent # Description
US-9,240,800 System that obtains a switching point with the encoder in a static position
A system including an encoder, multiple sensing elements and control logic. The encoder has a pole pitch and is configured to rotate in a direction of rotation....
US-9,240,721 Multiphase digital current mode controller with dynamic current allocation
A multiphase switching regulator includes a power stage with at least a first phase and a second phase for supplying power to a load through inductors coupling...
US-9,240,546 Magnetoresistive devices and methods for manufacturing magnetoresistive devices
A magnetoresistive device includes a substrate and an electrically insulating layer arranged over the substrate. The magnetoresistive device further includes a...
US-9,240,462 Field-effect transistor with local source/drain insulation and associated method of production
A method for fabricating a field-effect transistor with local source/drain insulation. The method includes forming and patterning a gate stack with a gate layer...
US-9,240,450 IGBT with emitter electrode electrically connected with impurity zone
A semiconductor device includes a semiconductor body including a drift zone of a first conductivity type, an emitter region of a second, complementary...
US-9,240,225 Current sense amplifier with replica bias scheme
Some embodiments of the present disclosure relate to a sense amplifier architecture that facilitates fast and accurate read operations. The sense amplifier...
US-9,239,386 Sonic sensors and packages
Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one...
US-9,237,624 LED driver with compensation of thermally induced color drift
A circuit arrangement includes a number of light emitting diodes emitting light of different colors arranged adjacent to each other for additive color mixing to...
US-9,236,878 Analog-to-digital conversion
A method is disclosed. An analog signal is sampled to form a sample value using a sample and hold circuit. The sample value is converted to form a first digital...
US-9,236,837 System and method for low distortion capacitive signal source amplifier
According to an embodiment, a method includes amplifying a signal provided by a capacitive signal source to form an amplified signal, detecting a peak voltage...
US-9,236,802 Turbo circuit for providing voltage regulation and related method
According to one embodiment, a turbo circuit for increasing an output of a voltage regulator having a several power stages includes an activation sub-circuit...
US-9,236,800 System for balancing current supplied to a load
A system for balancing current supplied by a plurality of regulators coupled to a load includes circuitry operable to measure an average load current supplied...
US-9,236,462 Programmable gate III-nitride power transistor
A III-nitride semiconductor device which includes a charged floating gate electrode.
US-9,236,458 Bipolar transistor and a method for manufacturing a bipolar transistor
A bipolar transistor includes a semiconductor structure including an emitter area, a base area and a collector area. The emitter area is electrically connected...
US-9,236,376 Power semiconductor device with oscillation prevention
There are disclosed herein various implementations of composite semiconductor devices with active oscillation control. In one exemplary implementation, a...
US-9,236,362 Integrated circuit package and packaging methods
An integrated circuit package includes a package module formed from successive build-up layers which define circuit interconnections, a cavity formed on a...
US-9,236,290 Method for producing a semiconductor device
A method for producing a semiconductor device having a sidewall insulation includes providing a semiconductor body having a first side and a second side lying...
US-9,236,241 Wafer, a method for processing a wafer, and a method for processing a carrier
According to various embodiments, a method for processing a wafer may include: forming at least one hollow chamber and a support structure within the wafer, the...
US-9,231,789 Transmitter circuit and method for operating thereof
In various embodiments a transmitter circuit may include a first circuit configured to transmit data in a first data transmission mode, a second circuit...
US-9,231,661 Methods and appliances for forwarding communication between external appliances and secure elements using an...
A method for controlling the flow of data in a near field communication appliance having a plurality of secure elements is provided. The method includes...
US-9,231,581 Method of operating a reverse conducting IGBT
According to an embodiment of a method, a semiconductor device is operated in a reverse biased unipolar mode before operating the semiconductor device in an...
US-9,231,565 Circuit with a plurality of bipolar transistors and method for controlling such a circuit
A circuit includes a bipolar transistor circuit including a first node, a second node, and a plurality of bipolar transistors coupled in parallel between the...
US-9,231,520 Wien-bridge oscillator and circuit arrangement for regulating a detuning
An oscillator circuit includes a Wien-bridge oscillator. A non-detuned oscillating signal and a detuned oscillating signal are tapped from the Wien-bridge...
US-9,231,493 Rectifier with auxiliary voltage output
A rectifier includes two input paths configured to receive an alternating input voltage, two output paths configured to provide a direct output voltage, and an...
US-9,231,472 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes receiving power from an input node via a first transistor,...
US-9,231,118 Chip package with isolated pin, isolated pad or isolated chip carrier and method of making the same
A chip package with isolated pin, isolated pad or isolated chip carrier and a method of making the same are disclosed. In one embodiment a chip package includes...
US-9,231,100 Semiconductor device and method for manufacturing a semiconductor device
A semiconductor device is at least partially formed in a semiconductor substrate, the substrate including first and second opposing main surfaces. The...
US-9,231,091 Semiconductor device and reverse conducting insulated gate bipolar transistor with isolated source zones
A semiconductor device includes a semiconductor mesa with at least one body zone forming first pn junctions with source zones and a second pn junction with a...
US-9,231,049 Semiconductor switching device with different local cell geometry
A semiconductor device includes a semiconductor substrate having an outer rim, a plurality of switchable cells defining an active area, and an edge termination...
US-9,231,026 Magnetoresistive sensor module with a structured metal sheet for illumination and method for manufacturing the same
In the method of manufacturing a magnetoresistive sensor module, at first a composite arrangement out of a semiconductor substrate and a metal-insulator...
US-9,230,926 Functionalised redistribution layer
An electronic device which comprises at least one interconnect, a semiconductor chip comprising at least one electric chip pad, an encapsulant structure...
US-9,230,917 Method of processing a carrier with alignment marks
A method for processing a carrier may include forming at least one recess structure at least one of over and in the carrier; and annealing the at least one...
US-9,230,906 Feature patterning methods and structures thereof
Methods of patterning features, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a method of...
US-9,230,894 Methods for manufacturing a chip package
A method for manufacturing a chip package is provided. The method including: arranging a plurality of dies over a carrier; depositing encapsulation material...
US-9,230,889 Chip arrangement with low temperature co-fired ceramic and a method for forming a chip arrangement with low...
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an...
US-9,230,885 Semiconductor structure and method for making same
One or more embodiments relate to a method for forming a semiconductor structure, comprising: providing a workpiece; forming a dielectric barrier layer over the...
US-9,230,880 Electronic device and method for fabricating an electronic device
An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate...
US-9,230,870 Integrated test circuit and method for manufacturing an integrated test circuit
An integrated test circuit, including a plurality of test structure elements, wherein each test structure element includes at least a supply line and a test...
US-9,227,843 Methods of manufacturing a MEMS device having a backplate with elongated protrusions
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate...
US-9,219,487 Frequency ramp generation in PLL based RF frontend
An RF transceiver circuit is disclosed herein. In accordance with one example of the disclosure the RF transceiver circuit includes a phase-locked-loop (PLL)...
US-9,219,149 Semiconductor device with vertical transistor channels and a compensation structure
A semiconductor device includes transistor cells with vertical channels perpendicular to a first surface of a semiconductor portion. A buried compensation...
US-9,219,144 Semiconductor device including a trench in a semiconductor substrate and method of manufacturing a...
A semiconductor device includes a semiconductor substrate. A first trench extends into or through the semiconductor substrate from a first side. A semiconductor...
US-9,219,143 Semiconductor device and super junction semiconductor device having semiconductor mesas
A semiconductor device includes semiconductor mesas of a first conductivity type extending between a first surface and a bottom plane of a semiconductor...
US-9,219,121 Semiconductor component having a transition region
A semiconductor component is disclosed. One embodiment provides a semiconductor component including a semiconductor body having a cell array region with...
US-9,219,117 Semiconductor structure and a method for processing a carrier
According to various embodiments, a semiconductor structure may include: a first source/drain region and a second source/drain region; a body region disposed...
US-9,219,063 Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor. An explanation is given of, inter alia, tunnel...
US-9,219,058 Efficient high voltage switching circuits and monolithic integration of same
A high voltage switching circuit includes first and second group III-V transistors, the second group III-V transistor having a greater breakdown voltage than...
US-9,219,049 Compound structure and method for forming a compound structure
A compound structure including a carrier wafer and at least one semiconductor piece bonded onto the carrier wafer by a bonding material obtained by a...
US-9,219,034 Semiconductor module having deflecting conductive layer over a spacer structure
A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to...
US-9,219,031 Chip arrangement, and method for forming a chip arrangement
A chip arrangement may include: a chip including a plurality of electrical nets, wherein each electrical net includes at least one bonding pad; and a plurality...
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