Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching: infineon





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-9,231,565 Circuit with a plurality of bipolar transistors and method for controlling such a circuit
A circuit includes a bipolar transistor circuit including a first node, a second node, and a plurality of bipolar transistors coupled in parallel between the...
US-9,231,520 Wien-bridge oscillator and circuit arrangement for regulating a detuning
An oscillator circuit includes a Wien-bridge oscillator. A non-detuned oscillating signal and a detuned oscillating signal are tapped from the Wien-bridge...
US-9,231,493 Rectifier with auxiliary voltage output
A rectifier includes two input paths configured to receive an alternating input voltage, two output paths configured to provide a direct output voltage, and an...
US-9,231,472 System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes receiving power from an input node via a first transistor,...
US-9,231,118 Chip package with isolated pin, isolated pad or isolated chip carrier and method of making the same
A chip package with isolated pin, isolated pad or isolated chip carrier and a method of making the same are disclosed. In one embodiment a chip package includes...
US-9,231,100 Semiconductor device and method for manufacturing a semiconductor device
A semiconductor device is at least partially formed in a semiconductor substrate, the substrate including first and second opposing main surfaces. The...
US-9,231,091 Semiconductor device and reverse conducting insulated gate bipolar transistor with isolated source zones
A semiconductor device includes a semiconductor mesa with at least one body zone forming first pn junctions with source zones and a second pn junction with a...
US-9,231,049 Semiconductor switching device with different local cell geometry
A semiconductor device includes a semiconductor substrate having an outer rim, a plurality of switchable cells defining an active area, and an edge termination...
US-9,231,026 Magnetoresistive sensor module with a structured metal sheet for illumination and method for manufacturing the same
In the method of manufacturing a magnetoresistive sensor module, at first a composite arrangement out of a semiconductor substrate and a metal-insulator...
US-9,230,926 Functionalised redistribution layer
An electronic device which comprises at least one interconnect, a semiconductor chip comprising at least one electric chip pad, an encapsulant structure...
US-9,230,917 Method of processing a carrier with alignment marks
A method for processing a carrier may include forming at least one recess structure at least one of over and in the carrier; and annealing the at least one...
US-9,230,906 Feature patterning methods and structures thereof
Methods of patterning features, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a method of...
US-9,230,894 Methods for manufacturing a chip package
A method for manufacturing a chip package is provided. The method including: arranging a plurality of dies over a carrier; depositing encapsulation material...
US-9,230,889 Chip arrangement with low temperature co-fired ceramic and a method for forming a chip arrangement with low...
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an...
US-9,230,885 Semiconductor structure and method for making same
One or more embodiments relate to a method for forming a semiconductor structure, comprising: providing a workpiece; forming a dielectric barrier layer over the...
US-9,230,880 Electronic device and method for fabricating an electronic device
An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate...
US-9,230,870 Integrated test circuit and method for manufacturing an integrated test circuit
An integrated test circuit, including a plurality of test structure elements, wherein each test structure element includes at least a supply line and a test...
US-9,227,843 Methods of manufacturing a MEMS device having a backplate with elongated protrusions
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate...
US-9,219,487 Frequency ramp generation in PLL based RF frontend
An RF transceiver circuit is disclosed herein. In accordance with one example of the disclosure the RF transceiver circuit includes a phase-locked-loop (PLL)...
US-9,219,149 Semiconductor device with vertical transistor channels and a compensation structure
A semiconductor device includes transistor cells with vertical channels perpendicular to a first surface of a semiconductor portion. A buried compensation...
US-9,219,144 Semiconductor device including a trench in a semiconductor substrate and method of manufacturing a...
A semiconductor device includes a semiconductor substrate. A first trench extends into or through the semiconductor substrate from a first side. A semiconductor...
US-9,219,143 Semiconductor device and super junction semiconductor device having semiconductor mesas
A semiconductor device includes semiconductor mesas of a first conductivity type extending between a first surface and a bottom plane of a semiconductor...
US-9,219,121 Semiconductor component having a transition region
A semiconductor component is disclosed. One embodiment provides a semiconductor component including a semiconductor body having a cell array region with...
US-9,219,117 Semiconductor structure and a method for processing a carrier
According to various embodiments, a semiconductor structure may include: a first source/drain region and a second source/drain region; a body region disposed...
US-9,219,063 Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor. An explanation is given of, inter alia, tunnel...
US-9,219,058 Efficient high voltage switching circuits and monolithic integration of same
A high voltage switching circuit includes first and second group III-V transistors, the second group III-V transistor having a greater breakdown voltage than...
US-9,219,049 Compound structure and method for forming a compound structure
A compound structure including a carrier wafer and at least one semiconductor piece bonded onto the carrier wafer by a bonding material obtained by a...
US-9,219,034 Semiconductor module having deflecting conductive layer over a spacer structure
A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to...
US-9,219,031 Chip arrangement, and method for forming a chip arrangement
A chip arrangement may include: a chip including a plurality of electrical nets, wherein each electrical net includes at least one bonding pad; and a plurality...
US-9,219,025 Molded flip-clip semiconductor package
A molded flip-chip semiconductor package includes a leadframe having opposing first and second main surfaces, a first metallization on the first main surface, a...
US-9,219,020 Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices
A cavity is formed in a working surface of a substrate in which a semiconductor element is formed. A glass piece formed from a glass material is bonded to the...
US-9,219,011 Separation of chips on a substrate
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is...
US-9,218,991 Ion implantation at high temperature surface equilibrium conditions
There are disclosed herein various implementations of a method and system for ion implantation at high temperature surface equilibrium conditions. The method...
US-9,218,960 Method of manufacturing a semiconductor device including a stress relief layer
A method of manufacturing a semiconductor device includes providing a layered structure having a hard dielectric layer containing a first dielectric material...
US-9,218,958 Method for forming a semiconductor device
A method for forming a semiconductor device includes carrying out an anodic oxidation of a surface region of a semiconductor substrate to form an oxide layer at...
US-9,218,756 Test system for semiconductor array
In accordance with an embodiment, an integrated circuit includes a plurality of devices on the integrated circuit. Each device includes a driving circuit, an...
US-9,214,978 Circuit and method for a circuit
A circuit comprises a transmitter to provide a transmit signal. The circuit also comprises a coupler element to receive the transmit signal at an input port, to...
US-9,214,911 System and method for adjusting the sensitivity of a capacitive signal source
In accordance with an embodiment, a system for amplifying a signal provided by a capacitive signal source includes an impedance converter having an input node...
US-9,214,872 Method for actuating the switching transistors of a rectifier
The invention relates to a method for actuating the switching transistors of a rectifier which is provided for converting the phase voltages that are provided...
US-9,214,521 Reverse conducting IGBT
A semiconductor device includes a first emitter region of a first conductivity type, a second emitter region of a second conductivity type complementary to the...
US-9,214,442 Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
In a power semiconductor module, a copper-containing first soldering partner, a connection layer, and a copper-containing second soldering partner are arranged...
US-9,214,432 Explosion-protected semiconductor module
A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing...
US-9,214,424 Method for producing a conductor line
A method for producing a rounded conductor line of a semiconductor component is disclosed. In that method, a partially completed semiconductor component is...
US-9,213,350 Impedance transformation with transistor circuits
In one implementation, an apparatus may include a first negative channel metal oxide semiconductor (NMOS) transistor circuit coupled to a first voltage source,...
US-9,212,045 Micro mechanical structure and method for fabricating the same
A micro mechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure includes a functional region...
US-9,210,516 Packaged MEMS device and method of calibrating a packaged MEMS device
A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS...
US-9,210,015 Edge-based communication
Methods, devices and systems are disclosed where to generate a pulse a data line is actively driven to a first voltage followed by actively driving the data...
US-9,209,793 Bootstrap circuitry for an IGBT
A bootstrap circuit provides a gate-emitter voltage to the high-side IGBT of a half-bridge IGBT arrangement. The bootstrap circuit includes a buck-boost circuit...
US-9,209,778 Microelectromechanical resonators
Embodiments relate to MEMS resonator structures and methods that enable application of a maximum available on-chip voltage. In an embodiment, a MEMS resonator...
US-9,209,680 Circuit for providing negative voltages with selectable charge pump or buck-boost operating mode
Circuits, arrangements and systems may provide for configuring a portion of an integrated circuit to receive an electrical component, and configuring the...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.