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Circuit with a plurality of bipolar transistors and method for controlling
such a circuit
A circuit includes a bipolar transistor circuit including a first node, a second node, and a plurality of bipolar transistors coupled in parallel between the...
Wien-bridge oscillator and circuit arrangement for regulating a detuning
An oscillator circuit includes a Wien-bridge oscillator. A non-detuned oscillating signal and a detuned oscillating signal are tapped from the Wien-bridge...
Rectifier with auxiliary voltage output
A rectifier includes two input paths configured to receive an alternating input voltage, two output paths configured to provide a direct output voltage, and an...
System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes receiving power from an input node via a first transistor,...
Chip package with isolated pin, isolated pad or isolated chip carrier and
method of making the same
A chip package with isolated pin, isolated pad or isolated chip carrier and a method of making the same are disclosed. In one embodiment a chip package includes...
Semiconductor device and method for manufacturing a semiconductor device
A semiconductor device is at least partially formed in a semiconductor substrate, the substrate including first and second opposing main surfaces. The...
Semiconductor device and reverse conducting insulated gate bipolar
transistor with isolated source zones
A semiconductor device includes a semiconductor mesa with at least one body zone forming first pn junctions with source zones and a second pn junction with a...
Semiconductor switching device with different local cell geometry
A semiconductor device includes a semiconductor substrate having an outer rim, a plurality of switchable cells defining an active area, and an edge termination...
Magnetoresistive sensor module with a structured metal sheet for
illumination and method for manufacturing the same
In the method of manufacturing a magnetoresistive sensor module, at first a composite arrangement out of a semiconductor substrate and a metal-insulator...
Functionalised redistribution layer
An electronic device which comprises at least one interconnect, a semiconductor chip comprising at least one electric chip pad, an encapsulant structure...
Method of processing a carrier with alignment marks
A method for processing a carrier may include forming at least one recess structure at least one of over and in the carrier; and annealing the at least one...
Feature patterning methods and structures thereof
Methods of patterning features, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a method of...
Methods for manufacturing a chip package
A method for manufacturing a chip package is provided. The method including: arranging a plurality of dies over a carrier; depositing encapsulation material...
Chip arrangement with low temperature co-fired ceramic and a method for
forming a chip arrangement with low...
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an...
Semiconductor structure and method for making same
One or more embodiments relate to a method for forming a semiconductor structure, comprising: providing a workpiece; forming a dielectric barrier layer over the...
Electronic device and method for fabricating an electronic device
An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate...
Integrated test circuit and method for manufacturing an integrated test
An integrated test circuit, including a plurality of test structure elements, wherein each test structure element includes at least a supply line and a test...
Methods of manufacturing a MEMS device having a backplate with elongated
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate...
Frequency ramp generation in PLL based RF frontend
An RF transceiver circuit is disclosed herein. In accordance with one example of the disclosure the RF transceiver circuit includes a phase-locked-loop (PLL)...
Semiconductor device with vertical transistor channels and a compensation
A semiconductor device includes transistor cells with vertical channels perpendicular to a first surface of a semiconductor portion. A buried compensation...
Semiconductor device including a trench in a semiconductor substrate and
method of manufacturing a...
A semiconductor device includes a semiconductor substrate. A first trench extends into or through the semiconductor substrate from a first side. A semiconductor...
Semiconductor device and super junction semiconductor device having
A semiconductor device includes semiconductor mesas of a first conductivity type extending between a first surface and a bottom plane of a semiconductor...
Semiconductor component having a transition region
A semiconductor component is disclosed. One embodiment provides a semiconductor component including a semiconductor body having a cell array region with...
Semiconductor structure and a method for processing a carrier
According to various embodiments, a semiconductor structure may include: a first source/drain region and a second source/drain region; a body region disposed...
Integrated circuit arrangement comprising a field effect transistor,
especially a tunnel field effect transistor
Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor. An explanation is given of, inter alia, tunnel...
Efficient high voltage switching circuits and monolithic integration of
A high voltage switching circuit includes first and second group III-V transistors, the second group III-V transistor having a greater breakdown voltage than...
Compound structure and method for forming a compound structure
A compound structure including a carrier wafer and at least one semiconductor piece bonded onto the carrier wafer by a bonding material obtained by a...
Semiconductor module having deflecting conductive layer over a spacer
A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to...
Chip arrangement, and method for forming a chip arrangement
A chip arrangement may include: a chip including a plurality of electrical nets, wherein each electrical net includes at least one bonding pad; and a plurality...
Molded flip-clip semiconductor package
A molded flip-chip semiconductor package includes a leadframe having opposing first and second main surfaces, a first metallization on the first main surface, a...
Semiconductor device, wafer assembly and methods of manufacturing wafer
assemblies and semiconductor devices
A cavity is formed in a working surface of a substrate in which a semiconductor element is formed. A glass piece formed from a glass material is bonded to the...
Separation of chips on a substrate
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is...
Ion implantation at high temperature surface equilibrium conditions
There are disclosed herein various implementations of a method and system for ion implantation at high temperature surface equilibrium conditions. The method...
Method of manufacturing a semiconductor device including a stress relief
A method of manufacturing a semiconductor device includes providing a layered structure having a hard dielectric layer containing a first dielectric material...
Method for forming a semiconductor device
A method for forming a semiconductor device includes carrying out an anodic oxidation of a surface region of a semiconductor substrate to form an oxide layer at...
Test system for semiconductor array
In accordance with an embodiment, an integrated circuit includes a plurality of devices on the integrated circuit. Each device includes a driving circuit, an...
Circuit and method for a circuit
A circuit comprises a transmitter to provide a transmit signal. The circuit also comprises a coupler element to receive the transmit signal at an input port, to...
System and method for adjusting the sensitivity of a capacitive signal
In accordance with an embodiment, a system for amplifying a signal provided by a capacitive signal source includes an impedance converter having an input node...
Method for actuating the switching transistors of a rectifier
The invention relates to a method for actuating the switching transistors of a rectifier which is provided for converting the phase voltages that are provided...
Reverse conducting IGBT
A semiconductor device includes a first emitter region of a first conductivity type, a second emitter region of a second conductivity type complementary to the...
Power semiconductor module, method for producing a power semiconductor
module, and semiconductor chip
In a power semiconductor module, a copper-containing first soldering partner, a connection layer, and a copper-containing second soldering partner are arranged...
Explosion-protected semiconductor module
A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing...
Method for producing a conductor line
A method for producing a rounded conductor line of a semiconductor component is disclosed. In that method, a partially completed semiconductor component is...
Impedance transformation with transistor circuits
In one implementation, an apparatus may include a first negative channel metal oxide semiconductor (NMOS) transistor circuit coupled to a first voltage source,...
Micro mechanical structure and method for fabricating the same
A micro mechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure includes a functional region...
Packaged MEMS device and method of calibrating a packaged MEMS device
A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS...
Methods, devices and systems are disclosed where to generate a pulse a data line is actively driven to a first voltage followed by actively driving the data...
Bootstrap circuitry for an IGBT
A bootstrap circuit provides a gate-emitter voltage to the high-side IGBT of a half-bridge IGBT arrangement. The bootstrap circuit includes a buck-boost circuit...
Embodiments relate to MEMS resonator structures and methods that enable application of a maximum available on-chip voltage. In an embodiment, a MEMS resonator...
Circuit for providing negative voltages with selectable charge pump or
buck-boost operating mode
Circuits, arrangements and systems may provide for configuring a portion of an integrated circuit to receive an electrical component, and configuring the...