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High frequency oscillator with spread spectrum clock generation
Devices, systems, and methods for spread spectrum clock generation are disclosed. The devices, systems, and methods generate a clock signal at a frequency and...
Electronic ballast with power factor correction
According to an exemplary implementation, an electronic ballast includes an input filter coupled to a resonant tank. The resonant tank is configured to generate...
XMR-sensor and method for manufacturing the XMR-sensor
An XMR-sensor and method for manufacturing the XMR-Sensor are provided. The XMR-sensor includes a substrate, a first contact, a second contact and an...
System that obtains a switching point with the encoder in a static
A system including an encoder, multiple sensing elements and control logic. The encoder has a pole pitch and is configured to rotate in a direction of rotation....
Multiphase digital current mode controller with dynamic current allocation
A multiphase switching regulator includes a power stage with at least a first phase and a second phase for supplying power to a load through inductors coupling...
Magnetoresistive devices and methods for manufacturing magnetoresistive
A magnetoresistive device includes a substrate and an electrically insulating layer arranged over the substrate. The magnetoresistive device further includes a...
Field-effect transistor with local source/drain insulation and associated
method of production
A method for fabricating a field-effect transistor with local source/drain insulation. The method includes forming and patterning a gate stack with a gate layer...
IGBT with emitter electrode electrically connected with impurity zone
A semiconductor device includes a semiconductor body including a drift zone of a first conductivity type, an emitter region of a second, complementary...
Current sense amplifier with replica bias scheme
Some embodiments of the present disclosure relate to a sense amplifier architecture that facilitates fast and accurate read operations. The sense amplifier...
Sonic sensors and packages
Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one...
LED driver with compensation of thermally induced color drift
A circuit arrangement includes a number of light emitting diodes emitting light of different colors arranged adjacent to each other for additive color mixing to...
A method is disclosed. An analog signal is sampled to form a sample value using a sample and hold circuit. The sample value is converted to form a first digital...
System and method for low distortion capacitive signal source amplifier
According to an embodiment, a method includes amplifying a signal provided by a capacitive signal source to form an amplified signal, detecting a peak voltage...
Turbo circuit for providing voltage regulation and related method
According to one embodiment, a turbo circuit for increasing an output of a voltage regulator having a several power stages includes an activation sub-circuit...
System for balancing current supplied to a load
A system for balancing current supplied by a plurality of regulators coupled to a load includes circuitry operable to measure an average load current supplied...
Programmable gate III-nitride power transistor
A III-nitride semiconductor device which includes a charged floating gate electrode.
Bipolar transistor and a method for manufacturing a bipolar transistor
A bipolar transistor includes a semiconductor structure including an emitter area, a base area and a collector area. The emitter area is electrically connected...
Power semiconductor device with oscillation prevention
There are disclosed herein various implementations of composite semiconductor devices with active oscillation control. In one exemplary implementation, a...
Integrated circuit package and packaging methods
An integrated circuit package includes a package module formed from successive build-up layers which define circuit interconnections, a cavity formed on a...
Method for producing a semiconductor device
A method for producing a semiconductor device having a sidewall insulation includes providing a semiconductor body having a first side and a second side lying...
Wafer, a method for processing a wafer, and a method for processing a
According to various embodiments, a method for processing a wafer may include: forming at least one hollow chamber and a support structure within the wafer, the...
Transmitter circuit and method for operating thereof
In various embodiments a transmitter circuit may include a first circuit configured to transmit data in a first data transmission mode, a second circuit...
Methods and appliances for forwarding communication between external
appliances and secure elements using an...
A method for controlling the flow of data in a near field communication appliance having a plurality of secure elements is provided. The method includes...
Method of operating a reverse conducting IGBT
According to an embodiment of a method, a semiconductor device is operated in a reverse biased unipolar mode before operating the semiconductor device in an...
Circuit with a plurality of bipolar transistors and method for controlling
such a circuit
A circuit includes a bipolar transistor circuit including a first node, a second node, and a plurality of bipolar transistors coupled in parallel between the...
Wien-bridge oscillator and circuit arrangement for regulating a detuning
An oscillator circuit includes a Wien-bridge oscillator. A non-detuned oscillating signal and a detuned oscillating signal are tapped from the Wien-bridge...
Rectifier with auxiliary voltage output
A rectifier includes two input paths configured to receive an alternating input voltage, two output paths configured to provide a direct output voltage, and an...
System and method for a switched-mode power supply
In accordance with an embodiment, a method of operating a switched-mode power supply includes receiving power from an input node via a first transistor,...
Chip package with isolated pin, isolated pad or isolated chip carrier and
method of making the same
A chip package with isolated pin, isolated pad or isolated chip carrier and a method of making the same are disclosed. In one embodiment a chip package includes...
Semiconductor device and method for manufacturing a semiconductor device
A semiconductor device is at least partially formed in a semiconductor substrate, the substrate including first and second opposing main surfaces. The...
Semiconductor device and reverse conducting insulated gate bipolar
transistor with isolated source zones
A semiconductor device includes a semiconductor mesa with at least one body zone forming first pn junctions with source zones and a second pn junction with a...
Semiconductor switching device with different local cell geometry
A semiconductor device includes a semiconductor substrate having an outer rim, a plurality of switchable cells defining an active area, and an edge termination...
Magnetoresistive sensor module with a structured metal sheet for
illumination and method for manufacturing the same
In the method of manufacturing a magnetoresistive sensor module, at first a composite arrangement out of a semiconductor substrate and a metal-insulator...
Functionalised redistribution layer
An electronic device which comprises at least one interconnect, a semiconductor chip comprising at least one electric chip pad, an encapsulant structure...
Method of processing a carrier with alignment marks
A method for processing a carrier may include forming at least one recess structure at least one of over and in the carrier; and annealing the at least one...
Feature patterning methods and structures thereof
Methods of patterning features, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a method of...
Methods for manufacturing a chip package
A method for manufacturing a chip package is provided. The method including: arranging a plurality of dies over a carrier; depositing encapsulation material...
Chip arrangement with low temperature co-fired ceramic and a method for
forming a chip arrangement with low...
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an...
Semiconductor structure and method for making same
One or more embodiments relate to a method for forming a semiconductor structure, comprising: providing a workpiece; forming a dielectric barrier layer over the...
Electronic device and method for fabricating an electronic device
An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate...
Integrated test circuit and method for manufacturing an integrated test
An integrated test circuit, including a plurality of test structure elements, wherein each test structure element includes at least a supply line and a test...
Methods of manufacturing a MEMS device having a backplate with elongated
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate...
Frequency ramp generation in PLL based RF frontend
An RF transceiver circuit is disclosed herein. In accordance with one example of the disclosure the RF transceiver circuit includes a phase-locked-loop (PLL)...
Semiconductor device with vertical transistor channels and a compensation
A semiconductor device includes transistor cells with vertical channels perpendicular to a first surface of a semiconductor portion. A buried compensation...
Semiconductor device including a trench in a semiconductor substrate and
method of manufacturing a...
A semiconductor device includes a semiconductor substrate. A first trench extends into or through the semiconductor substrate from a first side. A semiconductor...
Semiconductor device and super junction semiconductor device having
A semiconductor device includes semiconductor mesas of a first conductivity type extending between a first surface and a bottom plane of a semiconductor...
Semiconductor component having a transition region
A semiconductor component is disclosed. One embodiment provides a semiconductor component including a semiconductor body having a cell array region with...
Semiconductor structure and a method for processing a carrier
According to various embodiments, a semiconductor structure may include: a first source/drain region and a second source/drain region; a body region disposed...
Integrated circuit arrangement comprising a field effect transistor,
especially a tunnel field effect transistor
Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor. An explanation is given of, inter alia, tunnel...
Efficient high voltage switching circuits and monolithic integration of
A high voltage switching circuit includes first and second group III-V transistors, the second group III-V transistor having a greater breakdown voltage than...