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Patent # Description
US-9,397,517 Cable compensation by zero-crossing compensation current and resistor
Methods, devices, and circuits are disclosed delivering a first level of output voltage to a rechargeable battery from a battery charger, the rechargeable...
US-9,397,212 Power converter package including top-drain configured power FET
In one implementation, a semiconductor package includes a top-drain vertical FET in a first active die, a source of the top-drain vertical FET situated on a...
US-9,397,208 Compound semiconductor device
A semiconductor device includes a first compound semiconductor material and a second compound semiconductor material on the first compound semiconductor...
US-9,397,092 Semiconductor device in a semiconductor substrate and method of manufacturing a semiconductor device in a...
A semiconductor device in a semiconductor substrate includes a trench in a first main surface of the semiconductor substrate. The trench includes a first trench...
US-9,397,091 Semiconductor component arrangement comprising a trench transistor
A semiconductor component arrangement method includes producing a trench transistor structure including at least one trench disposed in the semiconductor body...
US-9,397,089 Group III-V HEMT having a selectably floating substrate
There are disclosed herein various implementations of a group III-V high electron mobility transistor (HEMT) having a selectably floating substrate. Such a...
US-9,397,055 Processing of thick metal pads
In an embodiment of the present invention, a method of forming a semiconductor device includes providing a semiconductor substrate including a first chip region...
US-9,397,022 Semiconductor device having a locally reinforced metallization structure
A semiconductor device includes a semiconductor substrate having a first side, at least a first area formed in the semiconductor substrate, at least a second...
US-9,397,018 Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for...
A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation...
US-9,396,997 Method for producing a semiconductor component with insulated semiconductor mesas
A method for producing a semiconductor component is provided. The method includes providing a semiconductor body with a first surface and a second surface...
US-9,395,423 Current sensors, systems and methods for sensing current in a conductor
Embodiments relate to magnetic current sensors. In various embodiments, a current sensor can include a simple conductor having a constant cross-sectional...
US-9,395,404 Method for testing semiconductor chips or semiconductor chip modules
A semiconductor chip panel includes a plurality of semiconductor chips embedded in an encapsulation material. At least part of the semiconductor chips comprise...
US-9,391,604 Methods for monitoring functionality of a switch and driver units for switches
A gate driver unit includes an input stage, an output stage, a read/write interface, and a monitoring stage. The input stage is configured to receive control...
US-9,391,532 System and method for a switched-mode power converter
In accordance with an embodiment, a power converter includes an H-bridge switching arrangement, a transformer having a primary winding coupled to an output of...
US-9,391,263 Semiconductor devices having insulating substrates and methods of formation thereof
In one embodiment, a semiconductor device includes a glass substrate, a semiconductor substrate disposed on the glass substrate, and a magnetic sensor disposed...
US-9,391,192 Field effect semiconductor component and method for producing it
What is provided is a field effect component including a semiconductor body, which extends in an edge zone from a rear side as far as a top side and which...
US-9,391,191 Trench FET having merged gate dielectric
In one implementation, a trench field-effect transistor (trench FET) includes a semiconductor substrate having a drain region, a drift zone over the drain...
US-9,391,185 III-nitride power semiconductor device
A III-nitride power semiconductor device that includes a two dimensional electron gas having a reduced charge region under the gate thereof.
US-9,391,154 Method of manufacturing a device by locally heating one or more metalization layers and by means of selective...
A method of manufacturing a device comprises depositing one or more metallization layers to a substrate, locally heating an area of the one or more...
US-9,391,149 Semiconductor device with self-charging field electrodes
A semiconductor device includes a drift region of a first doping type, a junction between the drift region and a device region, and a field electrode structure...
US-9,391,004 Power semiconductor package with conductive clip and related method
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can,...
US-9,391,003 Semiconductor package with conductive clip
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can,...
US-9,390,975 Methods for producing a tunnel field-effect transistor
A method for producing a tunnel field-effect transistor is disclosed. Connection regions of different doping types are produced by means of self-aligning...
US-9,390,973 On-chip RF shields with backside redistribution lines
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes...
US-9,390,944 Electrical connectivity for circuit applications
According to example configurations herein, a leadframe includes a first conductive strip, a second conductive strip, and a third conductive strip disposed...
US-9,390,883 Implantation apparatus with ion beam directing unit, semiconductor device and method of manufacturing
An ion implantation apparatus includes an ion beam directing unit, a substrate support, and a controller. The controller is configured to effect a relative...
US-9,389,999 System and method for emulating an EEPROM in a non-volatile memory device
The invention relates to an electronic memory system, and more specifically, to a system for emulating an electrically erasable programmable read only memory in...
US-9,389,284 Spinning current hall sensor with residual offset calibration signal
A spinning current Hall sensor configured to provide a sequence of input signals in response to a bias current being applied to a sequence of terminals of Hall...
US-9,389,247 Current sensors
Embodiments relate to magnetic field current sensors having sensor elements for sensing at least two magnetic field components, for example Bx and By. The...
US-9,389,200 Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect...
A sensor device according to an embodiment includes a semiconductor substrate including a plurality of channels, the channels connecting a cavity and a...
US-9,389,098 System that obtains a switching point with the encoder in a static position
A system including an encoder, multiple sensing elements and control logic. The encoder has a pole pitch and is configured to rotate in a direction of rotation....
US-9,387,797 Direction indicator circuit for controlling a direction indicator in a vehicle
A direction indicator circuit for controlling a direction indicator in a vehicle is provided. The direction indicator circuit may include a first terminal for...
US-9,387,613 Semiconductor formation arrangement
A semiconductor package formation arrangement includes a mold housing with an interior cavity having top, bottom and first and second end sides. A gate for...
US-9,385,839 Network retransmission protocols using a proxy node
One embodiment relates to a device. The device includes reception circuitry adapted to receive a data unit from a first node of a network and a confirmation...
US-9,385,726 Chip and method for manufacturing a chip
According to one embodiment, a chip is described comprising a plurality of supply lines delimiting a plurality of cell areas and a gate comprising a first...
US-9,385,700 Clock monitoring for sequential logic circuits
A monitor circuit for monitoring a clock signal is described. In accordance with one example of the disclosure, the monitor circuit includes a pulse generator...
US-9,385,609 Analog current estimation and digital estimation correction for a multiphase buck converter
A phase current estimator for a switching power converter includes analog circuitry for generating a phase current estimate error by comparing a phase current...
US-9,385,599 Converter circuit and method for converting an input voltage to an output voltage using a white noise generator
A converter circuit is described comprising a switch circuit configured to provide an output voltage, a control circuit comprising an analog control portion and...
US-9,385,228 Semiconductor device with cell trench structures and contacts and method of manufacturing a semiconductor device
A semiconductor mesa is formed in a semiconductor layer between a first cell trench structure and a second cell trench structure extending from a first surface...
US-9,385,222 Semiconductor device with insert structure at a rear side and method of manufacturing
A cavity is formed in a first semiconductor layer that is formed on a semiconducting base layer. The cavity extends from a process surface of the first...
US-9,385,181 Semiconductor diode and method of manufacturing a semiconductor diode
A semiconductor diode includes a semiconductor body having opposite first and second sides. A first and a second semiconductor region are consecutively arranged...
US-9,385,119 Semiconductor arrangement with a load, a sense and a start-up transistor
A semiconductor arrangement includes a semiconductor body with a first active region, a second active region and an isolation region arranged between the first...
US-9,385,111 Electronic component with electronic chip between redistribution structure and mounting structure
An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive...
US-9,385,107 Multichip device including a substrate
A device includes a substrate including an electrically insulating core, a first electrically conductive material arranged over a first main surface of the...
US-9,385,075 Glass carrier with embedded semiconductor device and metal layers on the top surface
A device includes a semiconductor material having a first main surface, an opposite surface opposite to the first main surface and a side surface extending from...
US-9,385,059 Overmolded substrate-chip arrangement with heat sink
An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system...
US-9,385,031 Method for providing a self-aligned pad protection in a semiconductor device
According to one embodiment, a method for processing a semiconductor device is provided including forming a final metal layer forming a passivation layer over...
US-9,385,008 Semiconductor component of semiconductor chip size with flip-chip-like external contacts
A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the...
US-9,384,983 Method of manufacturing a vertical semiconductor device
A method for producing a vertical semiconductor device includes providing a semiconductor substrate having a first surface and comprising an n-doped first...
US-9,384,960 Method of manufacturing a semiconductor device with a continuous silicate glass structure
A method of manufacturing a semiconductor device includes forming a continuous silicate glass structure over a first surface of a semiconductor body, including...
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