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Deep gate trench IGBT
There are disclosed herein various implementations of an insulated-gate bipolar transistor (IGBT) with buried depletion electrode. Such an IGBT may include a...
Semiconductor device with a field plate trench having a thick bottom
Disclosed is a power device, such as a power MOSFET, and methods for fabricating same. The device includes a field plate trench. The device further includes...
Semiconductor device and method of making same
A semiconductor device and method of making a semiconductor device are disclosed. A semiconductor body, a floating gate poly and a source/drain region are...
Method for fabricating a power semiconductor package including vertically
stacked driver IC
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the...
Method for manufacturing a semiconductor chip with each contact pad having
a pad cell associated therewith
Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of...
Vias and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor device includes a first metal line disposed in a first insulating layer, and a via...
Bias field generation for a magneto sensor
Embodiments related to the generation of magnetic bias fields for magnetic sensing are described and depicted. In one embodiment, a sensor includes at least one...
System using shunt circuits to selectively bypass open loads
According to an exemplary embodiment, a shunt circuit includes a floating shunt switch configured to bypass at least one load, for example at least one LED,...
Integrated hall-controlled switch devices
Embodiments relate to Hall-controlled switch devices. In an embodiment, a Hall switch and a load switch are integrated in a single integrated circuit device....
A two-transistor flyback converter includes a transformer having a primary side and a secondary side, a first transistor connected between an input voltage...
A semiconductor device includes at least two device cells integrated in a semiconductor body. Each device cell includes a drift region, a source region, a drain...
Semiconductor switching devices with different local transconductance
A semiconductor device includes a semiconductor substrate having an outer rim, a plurality of switchable cells defining an active area, and an edge termination...
Semiconductor device with an array of lamellas and a
A semiconductor device includes a silicon substrate layer with a decoupling region. The decoupling region of the silicon substrate layer comprises an array of...
Field-effect semiconductor device and manufacturing therefor
A power semiconductor device includes a semiconductor body having a first surface and including an active area including n-type semiconductor regions and p-type...
Semiconductor device with a field ring edge termination structure and a
separation trench arranged between...
A semiconductor device has a semiconductor body with bottom and top sides and a lateral surface. An active semiconductor region is formed in the semiconductor...
Method for manufacturing a semiconductor device, and semiconductor device
According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at...
Semiconductor package having a baseplate with a die attach region and a
A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal and a second terminal...
Package with terminal pins with lateral reversal point and laterally
exposed free end
A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124),...
Method for processing a semiconductor workpiece with metallization
A method for processing a semiconductor workpiece is provided, which may include: providing a semiconductor workpiece including a metallization layer stack...
Method for producing a semiconductor
A method for producing a semiconductor is disclosed, the method having: providing a semiconductor body having a first side and a second side; forming an n-doped...
Some embodiments of the present disclosure relates to an automotive control unit (ACU) able to communicate with sensors using a plurality of different...
Digital switching converter control
A control circuit can control the operation of a switching converter to provide a regulated load current to a load. The switching converter includes an inductor...
System and method for a phase detector
In accordance with an embodiment, a method of detecting a phase difference between a first signal and a second signal include latching a state of the first...
Chip package including a microphone structure and a method of
manufacturing the same
In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a...
Semiconductor device and method of manufacturing a semiconductor device
with lateral FET cells and field plates
A method of manufacturing a semiconductor device includes providing dielectric stripe structures extending from a first surface into a semiconductor substrate...
Method for manufacturing a semiconductor device with step-shaped edge
A method for manufacturing a semiconductor device includes providing a semiconductor substrate having first and second sides, laterally spaced semiconductor...
Semiconductor device and manufacturing method
A semiconductor device includes a trench extending into a semiconductor body from a first surface. At least one of a ternary carbide and a ternary nitride is in...
Method of manufacturing a gate trench with thick bottom oxide
An insulated gate trench is manufactured by forming a first dielectric layer on a semiconductor substrate, forming a hardmask on the first dielectric layer and...
A semiconductor device includes an active area having a source and a gate. A gate metal contact is deposited above and forms an electrical contact with the gate...
Semiconductor component and method for producing it
A semiconductor component having differently structured cell regions, and a method for producing it. For this purpose, the semiconductor component includes a...
Leadless semiconductor package with optical inspection feature
A semiconductor package includes a plurality of bond pads having a first side and a second side opposing the first side, a coating covering the first side of...
Method of fabricating a semiconductor device with encapsulant
A method of fabricating a semiconductor device and semiconductor device is provided. The method provides a first layer. The first layer includes through-holes....
Semiconductor device and method for producing the same
A power semiconductor device includes a semiconductor body, having an active zone and a high voltage peripheral zone laterally adjacent to each other, the high...
Vertical hall sensor with series-connected hall effect regions
A vertical Hall sensor includes first and second vertical Hall effect regions formed in a semiconductor substrate and of the same doping type, with first and...
Switching regulator cycle-by-cycle current estimation
A switching regulator includes an output phase having a high-side transistor and a low-side transistor operable to switch on and off at different periods...
MEMS device and method of making a MEMS device
A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a...
Circuit, electric power train and method for charging a battery
A circuit is provided, including a battery, an omnipolar switch, a switching element, a DC-intermediate circuit and a current supplying circuit. The omnipolar...
Half bridge flyback and forward
A circuit includes a transformer having a first winding and a second winding, an input connected to a first terminal of the first winding, a first power...
System and method for a switchable capacitance
In accordance with an embodiment, a switchable capacitance circuit includes a plurality of capacitance-switch cells that each has a first semiconductor...
System and method for a diagnostic circuit
According to an embodiment, a diagnostic circuit is configured to be coupled to an output terminal of a switching circuit and to a sense terminal of a sense...
System and method for a programmable voltage source
In accordance with an embodiment, a method of operating a charge pump includes providing a first programmable voltage to a plurality of clock generators having...
Enhancement mode device
An enhancement mode device includes a floating gate structure. The floating gate structure includes a first bottom dielectric layer, a second bottom dielectric...
Charge compensation structure and manufacturing therefor
A charge-compensation semiconductor device includes a semiconductor body including a first surface, a second surface arranged opposite to the first surface, an...
Composite semiconductor device with a SOI substrate having an integrated
There are disclosed herein various implementations of composite semiconductor devices. In one implementation, such a composite semiconductor device includes a...
High voltage durability III-nitride device
A high voltage durability III-nitride semiconductor device comprises a support substrate including a first silicon body, an insulator body over the first...
Semiconductor device with a shielding structure
A semiconductor device has a semiconductor body including opposing bottom and top sides, a surface surrounding the semiconductor body, an active semiconductor...
Semiconductor device comprising contact trenches
One embodiment of a semiconductor device includes a semiconductor body with a first side and a second side opposite to the first side. The semiconductor device...
Multi-transistor exposed conductive clip for semiconductor packages
One exemplary disclosed embodiment comprises a semiconductor package including multiple transistors coupled to an exposed conductive clip. A driver integrated...
Semiconductor packages and methods of forming the same
In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate...
Memory timing circuit
A memory circuit including a memory cell configured to provide a charge, voltage, or current to an associated bit-line; a sense amplifier configured to sense...