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Semiconductor device including a polymer disposed on a carrier
In a method of manufacturing a semiconductor device, a first semiconductor element is mounted on a carrier. A b-stage curable polymer is deposited on the...
Metal deposition on substrates
Various techniques, methods, devices and apparatus are provided where an isolation layer is provided at a peripheral region of the substrate, and one or more...
Gallium nitride devices
Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some...
Etching device and a method for etching a material of a workpiece
An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the...
Power semiconductor device with a double metal contact
A power semiconductor device that includes a stack of a thin metal layer and a thick metal layer over the active region thereof, and a method for the...
Minimum magnetic field detection systems and methods in magnetoresistive
Embodiments relate to magnetoresistive sensors suitable for both angle and field strength sensing. A sensor can comprise two magnetoresistive (xMR) sensor...
Vertical hall effect-device
A vertical Hall effect device is provided and includes a Hall effect layer having a first, second, third, and fourth Hall effect region, which are at least...
Method, device and circuitry for detecting a failure on a differential bus
An exemplary embodiment relates to a method for detecting a failure on a differential bus. The method may include: determining an allowed voltage range of the...
Intelligent field shaping for magnetic speed sensors
The present disclosure provides for techniques to improve the sensitivity of magnetic sensor systems. One embodiment of a magnetic sensor system includes a...
Low viscosity polymeric printing solutions and electronic components
bearing polyimide based upon the low...
An electrical component that includes a substrate and a polymeric layer oriented in working relation with the substrate, the polymeric layer including a low...
Method for electrophoretically depositing a film on an electronic assembly
A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a...
Standby power for LED drivers
Methods, devices, and circuits are disclosed for regulating a first parameter of one or more LEDs. The methods, devices, and circuits further disclose...
Method and apparatus for signal transmission
A method for receiving signals includes detecting information signal pulses on a first signal transmission channel, generating an output signal dependent on the...
Apparatus and a method for handling a received signal, and a mixer unit
An apparatus for handling a received signal comprises a reception device, a mixer unit and a compensating unit. The reception unit can receive a received...
Reconfigurable multiphase power stage for switched mode chargers
Methods, devices, and integrated circuits are disclosed for providing a buck converter charger in a multiphase buck converter topology comprising at least a...
Switched-mode power converter with split partitioning
A power converter is described that includes components arranged within a first die and a second die of a single package. The first die includes one or more...
Vertical hall device with electrical 180 degree symmetry
A vertical Hall device indicative of a magnetic field parallel to a surface of a substrate comprises first, second, third and fourth terminals. The vertical...
III-Nitride device with solderable front metal
Some exemplary embodiments of a III-nitride power device including a HEMT with multiple interconnect metal layers and a solderable front metal structure using...
Integrated power device with III-nitride half bridges
A semiconductor device that includes a plurality of isolated half-bridges formed in a common semiconductor die.
Bipolar transistor structure and a method of manufacturing a bipolar
According to various embodiments, a bipolar transistor structure may include: a substrate; a collector region in the substrate; a base region disposed over the...
Semiconductor device with a charge carrier compensation structure and
method for the production of a...
A semiconductor device has a cell field with drift zones of a first type of conductivity and charge carrier compensation zones of a second type of conductivity...
Semiconductor device containing chalcogen atoms and method of
A semiconductor device includes a single crystalline semiconductor body with a first surface and a second surface parallel to the first surface. The...
A semiconductor component is disclosed. One embodiment provides a semiconductor body having a cell region with at least one zone of a first conduction type and...
Chip, chip arrangement and method for producing a chip
Various embodiments provide a chip. The chip has a carrier, an integrated circuit formed above the carrier, and an energy storage element. The energy storage...
III-nitride device and FET in a package
One exemplary disclosed embodiment comprises a three-terminal stacked-die package including a field effect transistor (PET), such as a silicon PET, stacked atop...
Semiconductor device having an identification mark
A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The...
Method for housing an electronic component in a device package and an
electronic component housed in the device...
A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a...
Semiconductor device and method for making same
One or more embodiments relate to a semiconductor device that includes: a conductive layer including a sidewall; a conductive capping layer disposed over the...
Method of manufacturing semiconductor devices including generating and
annealing radiation-induced crystal defects
The generation of auxiliary crystal defects is induced in a semiconductor substrate. Then the semiconductor substrate is pre-annealed at a temperature above a...
Method for processing an oxygen containing semiconductor body
A method for processing a semiconductor body is disclosed. In an embodiment, the method includes reducing an oxygen concentration in a silicon wafer in a first...
Power converter including integrated driver providing overcurrent
In one implementation, a power converter includes an output stage integrated circuit (IC) in a group III-V die including a depletion mode group III-V...
Integrated circuit including non-planar structure and waveguide
One embodiment provides an integrated circuit including a first non-planar structure and a waveguide configured to provide electromagnetic waves to the first...
Power source arrangement and method of diagnosing a power source
An embodiment method of diagnosing a power source arrangement includes a plurality of n power sources connected in series between output terminals, wherein...
Current sensor package, arrangement and system
Embodiments of the present invention provide a current sensor package for sensing a current flowing in a primary conductor of a substrate. The current sensor...
Sensor structure for sensing pressure waves and ambient pressure
In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive...
Semiconductor device and integrated apparatus comprising the same
The present disclosure provides a semiconductor device and an integrated apparatus having the same. The semiconductor device includes a substrate, a buffer...
Integrated circuit and method of manufacturing an integrated circuit
An integrated circuit includes a transistor in a semiconductor substrate having a main surface. The transistor includes a source region, a drain region, a...
Semiconductor device having areas with different conductivity types and
different doping concentrations
A semiconductor device includes a semiconductor substrate. The semiconductor substrate includes a plurality of first doping regions of a first doping structure...
A first semiconductor zone of a first conduction type is formed from a semiconductor base material doped with first and second dopants. The first and second...
High electron mobility transistor with RC network integrated into gate
A high electron mobility transistor includes a buffer region and a barrier region adjoining and extending along the buffer region, the buffer and barrier...
Device including a semiconductor chip and wires
A device includes a carrier, a first semiconductor chip arranged over the carrier and a first electrically conductive element arranged over the carrier. The...
Baseplate for an electronic module and method of manufacturing the same
Various embodiments provide a baseplate for an electronic module, wherein the baseplate comprises a conductive material; and a recess formed in one main surface...
Device and method for stopping etching process
A method for etching a layer assembly, the layer assembly including an intermediate layer sandwiched between an etch layer and a stop layer, the method...
Method and system for wafer level testing of semiconductor chips
A system and method for wafer level testing of semiconductor chips are provided. In one embodiment, the system comprises a plurality of semiconductor chips...
System and method for power supply testing
In one embodiment, a method of verifying a component coupled to an output of a power supply includes measuring a frequency response from a control input of the...
Electric component with an electrophoretically deposited film
A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component...
Vehicle voltage supply
One embodiment provides a vehicle voltage supply having a vehicle battery, a load with two voltage supply connections, a fuse in a path between the vehicle...
Dimmable LED power supply with power factor control
A dimmable LED power supply circuit arrangement is disclosed. The circuit arrangement includes a flyback converter coupled between an input for receiving a...
Trench connection between a transistor and a further component
A semiconductor component arrangement includes a semiconductor body, a transistor structure, a further component, and at least a first electrode structure. The...
Vertical transistor component
A vertical transistor component includes a semiconductor body with first and second surfaces, a drift region, and a source region and body region arranged...