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Semiconductor device with a field ring edge termination structure and a
separation trench arranged between...
A semiconductor device has a semiconductor body with bottom and top sides and a lateral surface. An active semiconductor region is formed in the semiconductor...
Method for manufacturing a semiconductor device, and semiconductor device
According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at...
Semiconductor package having a baseplate with a die attach region and a
A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal and a second terminal...
Package with terminal pins with lateral reversal point and laterally
exposed free end
A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124),...
Method for processing a semiconductor workpiece with metallization
A method for processing a semiconductor workpiece is provided, which may include: providing a semiconductor workpiece including a metallization layer stack...
Method for producing a semiconductor
A method for producing a semiconductor is disclosed, the method having: providing a semiconductor body having a first side and a second side; forming an n-doped...
Some embodiments of the present disclosure relates to an automotive control unit (ACU) able to communicate with sensors using a plurality of different...
Digital switching converter control
A control circuit can control the operation of a switching converter to provide a regulated load current to a load. The switching converter includes an inductor...
System and method for a phase detector
In accordance with an embodiment, a method of detecting a phase difference between a first signal and a second signal include latching a state of the first...
Chip package including a microphone structure and a method of
manufacturing the same
In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a...
Semiconductor device and method of manufacturing a semiconductor device
with lateral FET cells and field plates
A method of manufacturing a semiconductor device includes providing dielectric stripe structures extending from a first surface into a semiconductor substrate...
Method for manufacturing a semiconductor device with step-shaped edge
A method for manufacturing a semiconductor device includes providing a semiconductor substrate having first and second sides, laterally spaced semiconductor...
Semiconductor device and manufacturing method
A semiconductor device includes a trench extending into a semiconductor body from a first surface. At least one of a ternary carbide and a ternary nitride is in...
Method of manufacturing a gate trench with thick bottom oxide
An insulated gate trench is manufactured by forming a first dielectric layer on a semiconductor substrate, forming a hardmask on the first dielectric layer and...
A semiconductor device includes an active area having a source and a gate. A gate metal contact is deposited above and forms an electrical contact with the gate...
Semiconductor component and method for producing it
A semiconductor component having differently structured cell regions, and a method for producing it. For this purpose, the semiconductor component includes a...
Leadless semiconductor package with optical inspection feature
A semiconductor package includes a plurality of bond pads having a first side and a second side opposing the first side, a coating covering the first side of...
Method of fabricating a semiconductor device with encapsulant
A method of fabricating a semiconductor device and semiconductor device is provided. The method provides a first layer. The first layer includes through-holes....
Semiconductor device and method for producing the same
A power semiconductor device includes a semiconductor body, having an active zone and a high voltage peripheral zone laterally adjacent to each other, the high...
Vertical hall sensor with series-connected hall effect regions
A vertical Hall sensor includes first and second vertical Hall effect regions formed in a semiconductor substrate and of the same doping type, with first and...
Switching regulator cycle-by-cycle current estimation
A switching regulator includes an output phase having a high-side transistor and a low-side transistor operable to switch on and off at different periods...
MEMS device and method of making a MEMS device
A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a...
Circuit, electric power train and method for charging a battery
A circuit is provided, including a battery, an omnipolar switch, a switching element, a DC-intermediate circuit and a current supplying circuit. The omnipolar...
Half bridge flyback and forward
A circuit includes a transformer having a first winding and a second winding, an input connected to a first terminal of the first winding, a first power...
System and method for a switchable capacitance
In accordance with an embodiment, a switchable capacitance circuit includes a plurality of capacitance-switch cells that each has a first semiconductor...
System and method for a diagnostic circuit
According to an embodiment, a diagnostic circuit is configured to be coupled to an output terminal of a switching circuit and to a sense terminal of a sense...
System and method for a programmable voltage source
In accordance with an embodiment, a method of operating a charge pump includes providing a first programmable voltage to a plurality of clock generators having...
Enhancement mode device
An enhancement mode device includes a floating gate structure. The floating gate structure includes a first bottom dielectric layer, a second bottom dielectric...
Charge compensation structure and manufacturing therefor
A charge-compensation semiconductor device includes a semiconductor body including a first surface, a second surface arranged opposite to the first surface, an...
Composite semiconductor device with a SOI substrate having an integrated
There are disclosed herein various implementations of composite semiconductor devices. In one implementation, such a composite semiconductor device includes a...
High voltage durability III-nitride device
A high voltage durability III-nitride semiconductor device comprises a support substrate including a first silicon body, an insulator body over the first...
Semiconductor device with a shielding structure
A semiconductor device has a semiconductor body including opposing bottom and top sides, a surface surrounding the semiconductor body, an active semiconductor...
Semiconductor device comprising contact trenches
One embodiment of a semiconductor device includes a semiconductor body with a first side and a second side opposite to the first side. The semiconductor device...
Multi-transistor exposed conductive clip for semiconductor packages
One exemplary disclosed embodiment comprises a semiconductor package including multiple transistors coupled to an exposed conductive clip. A driver integrated...
Semiconductor packages and methods of forming the same
In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate...
Memory timing circuit
A memory circuit including a memory cell configured to provide a charge, voltage, or current to an associated bit-line; a sense amplifier configured to sense...
Compatible network node, in particular, for can bus systems
A network node is provided, including a device, in particular, an error detection logic, which is deactivated if it is detected that a signal according to a...
Method and device for radar applications
A device for radar applications includes a computing engine, a radar acquisition unit connected to the computing engine, a timer unit connected to the computing...
Sensor device and sensor arrangement
A vertical Hall sensor structure according to an embodiment includes a Hall effect region arranged between a first interface and a second interface of the Hall...
Die, chip, method for driving a die or a chip and method for manufacturing
a die or a chip
In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output...
Propagation delay compensation for floating buck light emitting diode
Devices, systems, and methods for improving a current spread of a light emitting diode (LED). Some aspects including a peak detector and a variable gain...
Feed forward double-sampling modulator
Representative implementations of devices and techniques provide analog to digital conversion of an analog input. A multistage modulator using a feed-forward...
Junction field effect transistor with vertical PN junction
An embodiment relates to a JFET with a channel region and a gate region forming a pn junction. Between a source region and a drain region in a semiconductor...
Semiconductor device having buried gate electrode structures
A semiconductor device includes first and second gate electrode structures and a connection plug. The first gate electrode structure is buried in a...
Gate overvoltage protection for compound semiconductor transistors
A transistor device includes a compound semiconductor body, a drain disposed in the compound semiconductor body and a source disposed in the compound...
Transistor and tunable inductance
According to a first aspect embodiments provide a transistor including at least one gate region between at least one drain region and at least one source...
Electronic device and method for fabricating an electronic device
An embodiment electronic device comprises a semiconductor chip including a first main face, a second main face and side faces each connecting the first main...
Semiconductor package with multi-level die block
A semiconductor package includes a block having a first side, a second side opposite the first side and a recessed region extending from the second side toward...
Power module with cooling structure on bonding substrate for cooling an
attached semiconductor chip
According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive...
Removable indicator structure in electronic chips of a common substrate
for process adjustment
A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises...