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Patent # Description
US-9,293,524 Semiconductor device with a field ring edge termination structure and a separation trench arranged between...
A semiconductor device has a semiconductor body with bottom and top sides and a lateral surface. An active semiconductor region is formed in the semiconductor...
US-9,293,409 Method for manufacturing a semiconductor device, and semiconductor device
According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at...
US-9,293,407 Semiconductor package having a baseplate with a die attach region and a peripheral region
A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal and a second terminal...
US-9,293,400 Package with terminal pins with lateral reversal point and laterally exposed free end
A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124),...
US-9,293,371 Method for processing a semiconductor workpiece with metallization
A method for processing a semiconductor workpiece is provided, which may include: providing a semiconductor workpiece including a metallization layer stack...
US-9,293,330 Method for producing a semiconductor
A method for producing a semiconductor is disclosed, the method having: providing a semiconductor body having a first side and a second side; forming an n-doped...
US-9,292,409 Sensor interfaces
Some embodiments of the present disclosure relates to an automotive control unit (ACU) able to communicate with sensors using a plurality of different...
US-9,292,028 Digital switching converter control
A control circuit can control the operation of a switching converter to provide a regulated load current to a load. The switching converter includes an inductor...
US-9,291,653 System and method for a phase detector
In accordance with an embodiment, a method of detecting a phase difference between a first signal and a second signal include latching a state of the first...
US-9,290,379 Chip package including a microphone structure and a method of manufacturing the same
In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a...
US-9,287,404 Semiconductor device and method of manufacturing a semiconductor device with lateral FET cells and field plates
A method of manufacturing a semiconductor device includes providing dielectric stripe structures extending from a first surface into a semiconductor substrate...
US-9,287,383 Method for manufacturing a semiconductor device with step-shaped edge termination
A method for manufacturing a semiconductor device includes providing a semiconductor substrate having first and second sides, laterally spaced semiconductor...
US-9,287,377 Semiconductor device and manufacturing method
A semiconductor device includes a trench extending into a semiconductor body from a first surface. At least one of a ternary carbide and a ternary nitride is in...
US-9,287,376 Method of manufacturing a gate trench with thick bottom oxide
An insulated gate trench is manufactured by forming a first dielectric layer on a semiconductor substrate, forming a hardmask on the first dielectric layer and...
US-9,287,373 Semiconductor device
A semiconductor device includes an active area having a source and a gate. A gate metal contact is deposited above and forms an electrical contact with the gate...
US-9,287,354 Semiconductor component and method for producing it
A semiconductor component having differently structured cell regions, and a method for producing it. For this purpose, the semiconductor component includes a...
US-9,287,238 Leadless semiconductor package with optical inspection feature
A semiconductor package includes a plurality of bond pads having a first side and a second side opposing the first side, a coating covering the first side of...
US-9,287,206 Method of fabricating a semiconductor device with encapsulant
A method of fabricating a semiconductor device and semiconductor device is provided. The method provides a first layer. The first layer includes through-holes....
US-9,287,165 Semiconductor device and method for producing the same
A power semiconductor device includes a semiconductor body, having an active zone and a high voltage peripheral zone laterally adjacent to each other, the high...
US-9,285,439 Vertical hall sensor with series-connected hall effect regions
A vertical Hall sensor includes first and second vertical Hall effect regions formed in a semiconductor substrate and of the same doping type, with first and...
US-9,285,399 Switching regulator cycle-by-cycle current estimation
A switching regulator includes an output phase having a high-side transistor and a low-side transistor operable to switch on and off at different periods...
US-9,284,184 MEMS device and method of making a MEMS device
A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a...
US-9,283,864 Circuit, electric power train and method for charging a battery
A circuit is provided, including a battery, an omnipolar switch, a switching element, a DC-intermediate circuit and a current supplying circuit. The omnipolar...
US-9,281,813 Half bridge flyback and forward
A circuit includes a transformer having a first winding and a second winding, an input connected to a first terminal of the first winding, a first power...
US-9,281,802 System and method for a switchable capacitance
In accordance with an embodiment, a switchable capacitance circuit includes a plurality of capacitance-switch cells that each has a first semiconductor...
US-9,281,746 System and method for a diagnostic circuit
According to an embodiment, a diagnostic circuit is configured to be coupled to an output terminal of a switching circuit and to a sense terminal of a sense...
US-9,281,744 System and method for a programmable voltage source
In accordance with an embodiment, a method of operating a charge pump includes providing a first programmable voltage to a plurality of clock generators having...
US-9,281,413 Enhancement mode device
An enhancement mode device includes a floating gate structure. The floating gate structure includes a first bottom dielectric layer, a second bottom dielectric...
US-9,281,392 Charge compensation structure and manufacturing therefor
A charge-compensation semiconductor device includes a semiconductor body including a first surface, a second surface arranged opposite to the first surface, an...
US-9,281,388 Composite semiconductor device with a SOI substrate having an integrated diode
There are disclosed herein various implementations of composite semiconductor devices. In one implementation, such a composite semiconductor device includes a...
US-9,281,387 High voltage durability III-nitride device
A high voltage durability III-nitride semiconductor device comprises a support substrate including a first silicon body, an insulator body over the first...
US-9,281,360 Semiconductor device with a shielding structure
A semiconductor device has a semiconductor body including opposing bottom and top sides, a surface surrounding the semiconductor body, an active semiconductor...
US-9,281,359 Semiconductor device comprising contact trenches
One embodiment of a semiconductor device includes a semiconductor body with a first side and a second side opposite to the first side. The semiconductor device...
US-9,281,306 Multi-transistor exposed conductive clip for semiconductor packages
One exemplary disclosed embodiment comprises a semiconductor package including multiple transistors coupled to an exposed conductive clip. A driver integrated...
US-9,281,260 Semiconductor packages and methods of forming the same
In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate...
US-9,281,032 Memory timing circuit
A memory circuit including a memory cell configured to provide a charge, voltage, or current to an associated bit-line; a sense amplifier configured to sense...
US-9,280,501 Compatible network node, in particular, for can bus systems
A network node is provided, including a device, in particular, an error detection logic, which is deactivated if it is detected that a signal according to a...
US-9,279,883 Method and device for radar applications
A device for radar applications includes a computing engine, a radar acquisition unit connected to the computing engine, a timer unit connected to the computing...
US-9,279,864 Sensor device and sensor arrangement
A vertical Hall sensor structure according to an embodiment includes a Hall effect region arranged between a first interface and a second interface of the Hall...
US-9,279,856 Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output...
US-9,277,606 Propagation delay compensation for floating buck light emitting diode (LED) driver
Devices, systems, and methods for improving a current spread of a light emitting diode (LED). Some aspects including a peak detector and a variable gain...
US-9,276,604 Feed forward double-sampling modulator
Representative implementations of devices and techniques provide analog to digital conversion of an analog input. A multistage modulator using a feed-forward...
US-9,276,135 Junction field effect transistor with vertical PN junction
An embodiment relates to a JFET with a channel region and a gate region forming a pn junction. Between a source region and a drain region in a semiconductor...
US-9,276,107 Semiconductor device having buried gate electrode structures
A semiconductor device includes first and second gate electrode structures and a connection plug. The first gate electrode structure is buried in a...
US-9,276,097 Gate overvoltage protection for compound semiconductor transistors
A transistor device includes a compound semiconductor body, a drain disposed in the compound semiconductor body and a source disposed in the compound...
US-9,275,986 Transistor and tunable inductance
According to a first aspect embodiments provide a transistor including at least one gate region between at least one drain region and at least one source...
US-9,275,973 Electronic device and method for fabricating an electronic device
An embodiment electronic device comprises a semiconductor chip including a first main face, a second main face and side faces each connecting the first main...
US-9,275,944 Semiconductor package with multi-level die block
A semiconductor package includes a block having a first side, a second side opposite the first side and a recessed region extending from the second side toward...
US-9,275,926 Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive...
US-9,275,916 Removable indicator structure in electronic chips of a common substrate for process adjustment
A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises...
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