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Patent # Description
US-1,024,9219 Chip and method for operating a processing circuit
According to one embodiment, a processing circuit is described including a first input path and a second input path, a processing element configured to receive...
US-1,024,8595 Virtual machine monitor interrupt support for computer processing unit (CPU)
An interrupt interface of a central processing unit (CPU) comprises a bus with a plurality of interfaces to various components of the CPU. These components can...
US-1,024,7788 Resistive element
A resistive element includes a resistive region in a semiconductor substrate, a first contact structure and a second contact structure. The semiconductor...
US-1,024,7671 Photonic crystal sensor structure and a method for manufacturing the same
A sensor and methods of making a sensor are disclosed. The sensor may include a substrate including an opening, an optical source disposed in the substrate and...
US-1,024,7604 Spectrometer, method for manufacturing a spectrometer, and method for operating a spectrometer
In various embodiments a spectrometer is provided. The spectrometer may include a first mirror unit which is semitransparent for electromagnetic radiation of at...
US-1,024,6782 Methods for etching a workpiece, an apparatus configured to etch a workpiece, and a non-transitory computer...
A method for etching a workpiece may be provided, which may include: determining a plurality of reference etch profiles for a plurality of positions of an...
US-1,024,6325 MEMS device and method for manufacturing a MEMS device
A method for producing a MEMS device comprises forming a semiconductor layer stack, the semiconductor layer stack comprising at least a first monocrystalline...
US-1,024,4316 System and method for a pumping speaker
According to an embodiment, a method of operating a speaker with an acoustic pump includes generating a carrier signal having a first frequency by exciting the...
US-1,024,4315 Circuit arrangement with an optimized frequency response and method for calibrating a circuit arrangement
In various embodiments, a circuit arrangement includes a calibration filter set up to receive a signal based on a first signal and to provide a calibrated...
US-1,024,3724 Sensor subassembly and method for sending a data signal
A sensor device includes a memory circuit and a transmission circuit. The transmission circuit sends a first data signal to an external receiver in a first...
US-1,024,3553 System and method for a switch transistor driver
In accordance with an embodiment, a method of driving a switching transistor includes receiving an activation signal for the switching transistor and generating...
US-1,024,3460 Method and apparatus for dynamic voltage transition control in semi-resonant and resonant converters
A voltage converter includes a power stage coupled to a power source, a passive circuit coupling the power stage to an output capacitor, a synchronous...
US-1,024,3071 Transistor with field electrode
Disclosed is a transistor device and a method for producing thereof. The transistor device includes at least one transistor cell, wherein the at least one...
US-1,024,3066 Producing a semiconductor device by epitaxial growth
A method of producing a semiconductor device is presented. The method comprises: providing a semiconductor substrate having a surface; epitaxially growing,...
US-1,024,3051 Transistor device with a field electrode that includes two layers
Disclosed is a transistor device and a method for producing a transistor device. The transistor device includes: a source region, a drift region, and a body...
US-1,024,2969 Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating...
A semiconductor package includes a first semiconductor module including a plurality of semiconductor transistor chips and a first encapsulation layer disposed...
US-1,024,2938 Integrated shunt in circuit package
The disclosure is directed to a circuit on a substrate, such as a leadframe package, that includes shunt to measure current. The shunt is an arched conductor...
US-1,024,2932 LDMOS transistor and method
In an embodiment, a semiconductor device includes a semiconductor substrate having a front surface, a LDMOS transistor arranged in the front surface of the...
US-1,024,2922 Circuit and method for internally assessing dielectric reliability of a semiconductor technology
A semiconductor wafer includes dielectric regions of different thicknesses, some of the dielectric regions being thinner and other ones of the dielectric...
US-1,024,2840 Energy filter for processing a power semiconductor device
A method of producing an implantation ion energy filter, suitable for processing a power semiconductor device. In one example, the method includes creating a...
US-1,024,2262 Dynamic adjustment of imaging parameters
Representative implementations of devices and techniques provide adjustable parameters for imaging devices and systems. Dynamic adjustments to one or more...
US-1,024,1391 Method for processing a carrier, a carrier, an electronic device and a lithographic mask
Various embodiments provide a method for processing a carrier, the method including changing the three-dimensional structure of a mask layer arranged over the...
US-1,024,1088 Photo-acoustic gas sensor module having light emitter and detector units
A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition...
US-1,023,7940 Thermal protection for light emitting devices
A device for thermal protection is described. The device may be configured to determine current temperature information for a set of light emitting diodes...
US-1,023,7670 Micromechanical digital loudspeaker
A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced...
US-1,023,7534 Imaging device and a method for producing a three-dimensional image of an object
An imaging device includes an image sensor circuit including a pixel element. The pixel element is configured to receive during a first receiving time interval...
US-1,023,6916 Method and decoder for determining an error vector for a data word according to a Reed-Muller code
A method for determining an error vector for a data word according to a Reed-Muller Code includes determining the syndrome of the error vector according to the...
US-1,023,6866 Pulse width modulation signal frequency generation
A timer including a Pulse Width Modulation (PWM) signal generator configured to generate, based on a clock, a PWM signal having a first frequency resolution; a...
US-1,023,6833 RF amplifier with dual frequency response capacitor
An RF package includes a metal flange, an RF input lead, an RF output lead, and an electrically conductive die attach area. An RF transistor that is configured...
US-1,023,6765 Switched-capacitor circuit and method of operating a switched-capacitor circuit
A switched-capacitor circuit is described herein. In accordance with one exemplary embodiment the switched-capacitor circuit includes a first input node and a...
US-1,023,6352 Method for manufacturing a semiconductor device
A method for manufacturing a semiconductor device includes: providing a semiconductor substrate having a first side; forming a trench in the semiconductor...
US-1,023,6351 Power semiconductor device trench having field plate and gate electrode
A method of processing a power semiconductor device includes: providing a semiconductor body with a trench extending into the semiconductor body along an...
US-1,023,6265 Semiconductor chip and method for forming a chip pad
A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, the...
US-1,023,6258 Method of manufacturing a semiconductor device with epitaxial layers and an alignment mark
An alignment mark in a process surface of a semiconductor layer includes a groove with a minimum width of at least 100 .mu.m and a vertical extension in a range...
US-1,023,6246 Semiconductor devices and methods for forming a semiconductor device
A semiconductor device includes a crack propagation prevention structure. The crack propagation prevention structure is located at an edge region of a wiring...
US-1,023,6204 Semiconductor processing system
The semiconductor processing system includes a reactor chamber that has an upper wall and a lower wall. A hold member is disposed in the reactor chamber to hold...
US-1,023,6041 Determining a state of a memory cell
A method is suggested for determining a state of a memory cell via a sense amplifier the method including applying a first signal to the sense amplifier;...
US-1,023,5543 Booster antenna structure for a chip card
A booster antenna structure for a chip card. The booster antenna structure includes a first electrical circuit, which forms a first resonant circuit, a second...
US-1,023,1061 Sound transducer with housing and MEMS structure
A sound transducer includes a housing with a sound port and a MEMS structure disposed in an interior space of the housing. The MEMS structure and the sound port...
US-1,023,0380 Phase-locked loop
Phase-locked loop devices are provided where a correction factor is determined based on a correlation using a linear controller.
US-1,023,0336 RF power detector circuits
A radio frequency (RF) power detector includes a first circuit having a first rectifying diode with a first terminal coupled to a first power supply voltage...
US-1,022,9990 Semiconductor device having a desaturation channel structure for desaturating a charge carrier concentration in...
A semiconductor device includes a first IGBT cell having a second-type doped drift zone and a desaturation semiconductor structure for desaturating a charge...
US-1,022,9891 Chip embedding package with solderable electric contact
A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the...
US-1,022,9885 Method of galvanic plating assisted by a current distribution layer
The method comprises providing a plurality of electronic devices, embedding the electronic devices in an encapsulation layer, forming vias into the...
US-1,022,9870 Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with...
An assembled semiconductor device and a method of making an assembled semiconductor device are disclosed. In one embodiment the assembled device includes a...
US-1,022,9805 Detection of dependent failures
Devices and methods are provided which facilitate detecting of a disturbance parameter being outside a predetermined range. Such disturbance parameter may for...
US-1,022,9802 Driver circuit with current feedback
A circuit arrangement is described herein. In accordance with one exemplary embodiment, the circuit arrangement includes at least one output channel configured...
US-1,022,9352 Chip arrangement and method for checking whether a chip is arranged in an intended chip carrier
One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent...
US-1,022,8945 Circuitry and method for instruction stream protection
A circuitry is provided. The circuitry comprises a signature memory having stored thereon a plurality of stored signatures. Moreover, the circuitry comprises a...
US-1,022,8414 Capacitive sensor testing
Sensor devices and methods are provided where a test signal is applied to a capacitive sensor. Furthermore, a bias voltage is applied to the capacitive sensor...
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