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Patent # Description
US-1,039,6067 Semiconductor device having a load current component and a sensor component
A semiconductor device includes a semiconductor body having opposite first and second surfaces. The semiconductor body includes a load current component having...
US-1,039,6018 Multi-phase half bridge driver package and methods of manufacture
A semiconductor package includes a plurality of half bridge assemblies each including a metal lead, a first power transistor die attached to a first side of the...
US-1,039,6015 Die attach methods and semiconductor devices manufactured based on such methods
A semiconductor device includes a carrier, a semiconductor die and a die attach material arranged between the carrier and the semiconductor die. A fillet height...
US-1,039,6007 Semiconductor package with plateable encapsulant and a method for manufacturing the same
A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so...
US-1,039,5729 Method of operating a memory unit sector
Disclosed is a memory unit that includes a sector of memory cells. The sector includes a first memory cell configured to selectively take on a state...
US-1,039,5157 Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for...
A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free...
US-1,039,5063 Zero detection circuit and masked boolean or circuit
A zero detection circuit includes a chain of masked OR circuits. Each masked OR circuit includes data inputs. Each data input is configured to receive a...
US-1,039,4640 Requirement runtime monitor using temporal logic or a regular expression
A hardware monitor may receive information that identifies a requirement for a system. The requirement may be associated with operation of the system during a...
US-1,039,4542 Low-power device recovery using a backup firmware image
Some examples described herein may involve receiving, via a wireless transmission, a firmware code update that is to be installed in a main memory of the...
US-1,039,3697 Apparatus for analyzing ion kinetics in dielectrics
An apparatus for analyzing ion kinetics in a dielectric probe structure includes an ion reservoir abutting the dielectric probe structure and configured to...
US-1,039,3658 Gas analysis apparatus
An analysis apparatus includes a gas chamber for receiving a gas to be analyzed, a source to emit radiation into the chamber. The radiation is to selectively...
US-1,039,3606 Dynamic pressure sensor
According to various embodiments, a dynamic pressure sensor includes a substrate, a reference volume formed in the substrate, a deflectable membrane sealing the...
US-1,039,3555 Calibration of an angle sensor without a need for regular rotation
A device may obtain raw sensor data, collected by a sensing device, including a set of signal values and a set of temperature values corresponding to the set of...
US-1,038,9346 Source/sink unit charge/discharge circuit with fast switching devices
A circuit may include a switching element configured to draw a positive current from a source/sink unit when the switching element is turned on, the source/sink...
US-1,038,9275 Converter with ZVS
A method of operating a converter includes a transformer having a first winding and a second winding; a first full-bridge coupled to the first winding of the...
US-1,038,9242 Voltage and current sensing calibration for switching voltage regulators
A voltage regulator includes a power stage electrically coupled to an input voltage terminal, a controller for controlling the power stage and a shunt resistor...
US-1,038,9233 Switched mode power supply with PFC burst mode control
A method of operating a power supply having a PFC stage and an LLC converter coupled to the PFC stage includes: operating the PFC stage in CCM in a steady-state...
US-1,038,8782 Scalable current sense transistor
A semiconductor device includes a main transistor and a sense transistor. The main transistor is disposed in a semiconductor body and includes a plurality of...
US-1,038,8736 Methods of forming substrate structures and semiconductor components
In an embodiment, a method includes forming an intentionally doped superlattice laminate on a support substrate, forming a Group III nitride-based device having...
US-1,038,8734 Insulated gate bipolar transistor device having a fin structure
A transistor device includes a first silicon nanowire array-MOSFET and a second silicon nanowire array-MOSFET integrated with a bulk drift region. The first...
US-1,038,8722 Power semiconductor device termination structure
A power semiconductor device is disclosed. In one example, the device comprises: a semiconductor body comprising a drift region, the drift region having dopants...
US-1,038,8610 Electronic chip inspection by backside illumination
An apparatus for inspecting a plurality of electronic chips singularized from a wafer, wherein the apparatus comprises an electromagnetic radiation source...
US-1,038,8591 Method of forming a reliable and robust electrical contact
According to an embodiment of a method for fabricating a trench field-effect transistor (trench FET), the method includes: the method includes: patterning a...
US-1,038,6255 Pressure sensor device and manufacturing method
A manufacturing method includes providing a semiconductor substrate having a pressure sensor structure; and forming, during a BEOL process ...
US-1,038,6250 Detection compensation of mechanical stresses
A carrier of an electronic circuit, the carrier including a first sensor for determining a first signal based on a sum of a first normal stress component and a...
US-1,038,5891 Magnetic sensor arrangement for determining a position of an actuator
A magnetic sensor arrangement for determining a position of an actuator may include a magnetic sensor to determine the position of the actuator, where the...
US-1,038,4934 MEMS device and method of manufacturing a MEMS device
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a...
US-1,038,4496 Configuration data storage for a tire pressure sensor
A tire pressure sensor of a vehicle having a receiver configured to receive, from an Electronic Control Unit (ECU) mounted in the vehicle and having...
US-1,038,2736 Two frequency time-of-flight three-dimensional image sensor and method of measuring object depth
A three-dimensional image system includes a modulator configured to generate a first and a second modulation signal having a predetermined frequency difference,...
US-1,038,2073 Analog RF pre-distorter and non-linear splitter
An RF transmitter arrangement using analog pre-distortion is disclosed. The arrangement includes lower bandwidth circuitry, an analog pre-distorter, and a...
US-1,038,2024 Systems and methods having omnipolar comparators for magnetic switches
An omnipolar magnetic sensor system includes an input stage and a behavior component. The input stage is configured to receive a source signal and to...
US-1,038,1823 Device with power switch
A device comprises a solid-state power switch and a control configured to operate the power switch if at least one of a plurality of fault conditions of the...
US-1,038,1821 Power switch device
Power switch devices and methods are provided where an undervoltage event in a supply voltage is detected. Information regarding the undervoltage event is...
US-1,038,1477 Power transistor having perpendicularly-arranged field plates and method of manufacturing the same
A semiconductor device in a semiconductor substrate having a first main surface includes a transistor array and a termination region. The transistor array...
US-1,038,1475 Semiconductor device comprising a transistor cell including a source contact in a trench, method for...
A semiconductor device and a method of manufacturing the same is provided. The semiconductor device including a transistor cell in a semiconductor substrate...
US-1,038,1467 Semiconductor device with separation regions
According to an embodiment of a semiconductor device, the device includes first and second trenches formed in a semiconductor body and an electrode disposed in...
US-1,038,0477 Chip card and method of forming a chip card
A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna...
US-1,037,9530 Signal protocol fault detection system and method
In systems, such as sensor systems, an output signal of the system (e.g. output of the sensor corresponding to a sensed characteristic) can be generated and...
US-1,037,9221 Apparatus for determining distance information, time of flight light source and a docking station
An apparatus for determining distance information. The apparatus includes a control module configured to control a transmission of a request signal by a...
US-1,037,8969 Temperature sensor
Methods and devices are provided where a first current and a second current are provided selectively to a semiconductor component, and times for charging a...
US-1,037,7626 Apparatus with a high heat capacity and method for producing the same
The present disclosure relates to an apparatus comprising a substrate, wherein a MEMS module is arranged on a first side of the substrate, the output signal...
US-1,037,5776 Modulated quasi-resonant peak-current-mode control
Driver circuitry is configured to generate a control signal for a switching device that controls supply of load current to a load. The driver circuitry includes...
US-1,037,4508 Capacitor discharging
An example method includes storing a peak voltage level, a valley voltage level, and a frequency of a signal that corresponds to an alternating current (AC)...
US-1,037,4078 Semiconductor devices and a method for forming a semiconductor device
A semiconductor device includes a plurality of striped-shaped trenches extending into a semiconductor substrate. At least one trench of a first group of...
US-1,037,4068 Tunnel field effect transistors
Tunnel field effect devices and methods of fabricating tunnel field effect devices are described. In one embodiment, the semiconductor device includes a first...
US-1,037,4056 Latch-up resistant transistor
Disclosed is a method for producing a transistor device and a transistor device. The method includes: forming a source region of a first doping type in a body...
US-1,037,4032 Field-effect semiconductor device having N and P-doped pillar regions
A semiconductor device includes a semiconductor body having first and second opposite sides, a drift region, a body layer at the second side, and a field-stop...
US-1,037,3897 Semiconductor devices with improved thermal and electrical performance
A device may include a carrier, a semiconductor chip arranged over a first surface of the carrier, and an encapsulation body comprising six side surfaces and...
US-1,037,3895 Semiconductor device having die pads with exposed surfaces
A semiconductor device includes a first lead frame, a second lead frame, a first semiconductor chip, and an encapsulation material. The first lead frame...
US-1,037,3890 Cooling techniques for semiconductor package
In some examples, a device includes a high-side switch, a first high-side conductive element electrically connected to a first load terminal of the high-side...
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