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Patent # Description
US-9,816,881 Single diaphragm transducer structure
A transducer structure including a carrier with an opening and a suspended structure mounted on the carrier which extends at least partially over the opening in...
US-9,816,838 Magnetoresistive angle sensor with linear sensor elements
A magnetic sensor may comprise a first linear output sensing element configured to sense a first component of an external magnetic field associated with a first...
US-9,812,979 Estimation of transformer leakage inductance and associated delay in voltage converters
A time delay through a voltage converter, including a transformer therein, must be known or estimated in order to optimally control the voltage converter. For...
US-9,812,971 Transformer flux estimation and limiting in isolated DC-DC voltage converters
A switching voltage converter using an isolated topology includes a transformer for coupling power from an input source to an output load. The transformer must...
US-9,812,636 Integrated circuit including sensor having injection molded magnetic material
An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
US-9,812,563 Transistor with field electrodes and improved avalanche breakdown behavior
A transistor cell includes, in a semiconductor body, a drift region of a first doping type, a source region of the first doping type, a body region of a second...
US-9,812,538 Buried bus and related method
A semiconductor structure includes a semiconductor substrate having a gate electrode in a gate trench, a buried bus in the semiconductor substrate, the buried...
US-9,812,535 Method for manufacturing a semiconductor device and power semiconductor device
A method for manufacturing a semiconductor device includes: providing a semiconductor substrate having a first side; forming a trench in the semiconductor...
US-9,812,523 Capacitance structure
A capacitance structure includes a first input terminal configured to input a first input signal, a first output terminal configured to output the first output...
US-9,812,496 Magnetoresistive sensor module and method for manufacturing the same
In the method of manufacturing a magnetoresistive sensor module, at first a composite arrangement out of a semiconductor substrate and a metal-insulator...
US-9,812,438 Avalanche diode having an enhanced defect concentration level and method of making the same
The invention relates to an avalanche diode that can be employed as an ESD protection device. An avalanche ignition region is formed at the p-n junction of the...
US-9,812,383 Power converter package using driver IC
A dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control...
US-9,812,376 Electrically conductive element, power semiconductor device having an electrically conductive element and...
An electrically conductive element includes an electrically conductive material and a plurality of inclusions of a phase change material. The phase change...
US-9,812,373 Semiconductor package with top side cooling heat sink thermal pathway
An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the...
US-9,812,369 BiMOS device with a fully self-aligned emitter-silicon and method for manufacturing the same
A method comprises providing a substrate of a first conductive type and a layer stack arranged on the substrate. The layer stack comprises a first isolation...
US-9,811,695 Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip...
In various embodiments, a chip card arrangement for carrying out contactless interaction with an external apparatus is provided. The chip card arrangement may...
US-9,809,877 Ion implantation apparatus with ion beam directing unit
An ion implantation apparatus includes an ion beam directing unit, a substrate support, and a controller. The controller is configured to effect a relative...
US-9,809,444 System and method for a differential comb drive MEMS
According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure...
US-9,806,881 Cryptographic processor, method for implementing a cryptographic processor and key generation circuit
A cryptographic processor is described comprising a processing circuit configured to perform a round function of an iterated cryptographic algorithm, a...
US-9,806,687 System and method for signal amplification using a resistance network
A signal amplification method includes receiving, from a capacitive sensor, a first input signal by a first control terminal of a first transistor, and a second...
US-9,806,621 Method and apparatus for phase alignment in semi-resonant power converters
Each phase of a multi-phase voltage converter includes a power stage, passive circuit, synchronous rectification (SR) switch, and control circuit. Each passive...
US-9,806,188 Method for producing a controllable semiconductor component having trenches with different widths and depths
A controllable semiconductor component is produced by providing a semiconductor body with a top side and a bottom side, and forming a first trench protruding...
US-9,806,187 Method for manufacturing a semiconductor device
A method for forming a semiconductor device is provided. The method includes providing a semiconductor body with a horizontal surface. An epitaxy hard mask is...
US-9,806,056 Method of packaging integrated circuits
Integrated circuits are packaged by placing a plurality of semiconductor dies on a support substrate, each one of the semiconductor dies having a plurality of...
US-9,806,043 Method of manufacturing molded semiconductor packages having an optical inspection feature
A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main...
US-9,806,041 Method for processing an electronic component and an electronic component
According to various embodiments, a method for processing an electronic component including at least one electrically conductive contact region may include:...
US-9,806,029 Transistor arrangement with semiconductor chips between two substrates
An electronic device comprising a first substrate, a second substrate, a first semiconductor chip comprising a transistor, comprising a first mounting surface...
US-9,806,008 Clip based semiconductor package for increasing exposed leads
A semiconductor package includes a leadframe having a clip foot portion, the clip foot portion having a first tie bar, a conductive clip situated over the...
US-9,805,771 Determining a state of a cell structure
A method is suggested for determining a state of a cell structure, wherein the cell structure includes several memory cells, the method includes: (i) detecting...
US-9,805,525 Apparatus and a method for providing an error signal for a control unit
An apparatus for providing an error signal for a control unit, the error signal indicating a malfunction of a sensor unit. The apparatus includes an input...
US-9,800,252 Methods and devices for storing parameters
Methods and devices are provided in which a first parameter partial value (p1) is stored in a first memory (12) and a second parameter partial value (p2) is...
US-9,800,236 Integrated analog delay line of a pulse-width modulator
A pulse width modulation (PWM) system comprises an analog component and a digital component. The analog component introduces an offset (i.e., a time delay) to...
US-9,800,150 Digital controller for switched capacitor DC-DC converter
Representative implementations of techniques and/or devices provide control of switching characteristics in a switched capacitor dc-dc converter. In various...
US-9,800,133 Active common mode cancellation
In some examples, a circuit is configured to generate a first signal based at least in part on an input signal, wherein the first signal comprises a common mode...
US-9,799,762 Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device comprises a transistor formed in a semiconductor substrate having a first main surface. The transistor includes a source region, a drain...
US-9,799,738 Semiconductor device with field electrode and contact structure
A semiconductor device includes a field electrode structure with a field electrode and a field dielectric surrounding the field electrode. A semiconductor body...
US-9,799,729 Method of manufacturing a semiconductor device with field electrode structures, gate structures and auxiliary...
A method of manufacturing a semiconductor device includes: forming field electrode structures extending in a direction vertical to a first surface in a...
US-9,799,725 IGBT having a deep superjunction structure
There are disclosed herein various implementations of an insulated-gate bipolar transistor (IGBT) having a deep superjunction structure. Such an IGBT includes a...
US-9,799,643 Gate voltage control for III-nitride transistors
A semiconductor die includes a III-nitride semiconductor substrate, a power HEMT (high-electron-mobility transistor) disposed in the III-nitride semiconductor...
US-9,799,623 Semiconductor package with conductive clip
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can,...
US-9,799,586 Dual power converter package
A dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control...
US-9,799,583 Semiconductor devices and methods of formation thereof
In one embodiment, a semiconductor device includes a first contact pad disposed at a top side of a workpiece, a second contact pad disposed at the top side of...
US-9,799,579 Semiconductor substrate-on-semiconductor substrate package and method of manufacturing the same
A semiconductor assembly includes a first semiconductor substrate having a first main surface and a second main surface and a second semiconductor substrate...
US-9,799,521 Semiconductor device having areas with different conductivity types and different doping
A semiconductor device includes a semiconductor substrate. The semiconductor substrate includes a plurality of first doping regions of a first doping structure...
US-9,799,505 Method and a processing device for processing at least one carrier
According to various embodiments, a method may include: filling a chamber and a tube coupled to the chamber with a first liquid, the tube extending upwards from...
US-9,794,665 System and method for a transducer interface
According to an embodiment, an interface circuit includes a current replicator and a receiver. The current replicator includes a power terminal coupled to a...
US-9,793,890 System and method for a switch transistor driver
In accordance with an embodiment, a method of driving a switching transistor includes receiving an activation signal for the switching transistor and generating...
US-9,793,889 Semiconductor device including a circuit to compensate for parasitic inductance
A semiconductor device includes a first transistor, a second transistor coupled in parallel with the first transistor, and a first parasitic inductance between...
US-9,793,809 Safety crowbar for voltage converters
In one example, a circuit includes a first voltage converter and a second voltage converter. The first voltage converter is configured to convert a first...
US-9,793,803 Power converter circuit
A power converter circuit includes an input and an output. A supply circuit is configured to receive an input signal from the input and to generate a number of...
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