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Patent # Description
US-9,377,800 Voltage regulating circuit
In various embodiments, a circuit is provided including a supply terminal, a logic circuit, an inverter and a control transistor which may include a body...
US-9,377,511 Coverage enhancement and power aware clock system for structural delay-fault test
Methods and devices applying to a clock system of scan circuits to enhance the test coverage for structural delay-fault tests are provided. According to an...
US-9,377,502 Testing of semiconductor devices and devices, and designs thereof
In accordance with an embodiment of the present invention, a method of testing a plurality of semiconductor devices includes applying a stress voltage having a...
US-9,376,314 Method for manufacturing a micromechanical system
A method for manufacturing a micromechanical system includes forming in a Front-End-of-Line (FEOL) process transistors in a transistor region; after the...
US-9,374,174 Pulse width modulated (PWM) sensor interface using a terminated symmetrical physical layer
A device, such as a transceiver or a sensor, is provided. An interface circuit of the device terminates a signal line with an impedance matching an impedance of...
US-9,374,081 Method for driving a load
An electronic switch includes a load path connected in series with the load and a drive terminal for receiving a drive signal. The electronic switch is operable...
US-9,374,042 System and method for a low noise amplifier
An embodiment described herein includes a low noise amplifier (LNA) including a plurality of separate input terminals, a plurality of transistors, and an output...
US-9,373,717 Stress-inducing structures, methods, and materials
Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a...
US-9,373,710 Insulated gate bipolar transistor
A semiconductor component is described herein. In accordance with one example of the invention, the semiconductor component includes a semiconductor body, which...
US-9,373,700 Field plate trench transistor and method for producing it
A field plate trench transistor having a semiconductor body. In one embodiment the semiconductor has a trench structure and an electrode structure embedded in...
US-9,373,692 Method for forming a semiconductor device with an integrated poly-diode
A method for forming a field effect power semiconductor device includes providing a semiconductor body comprising a main horizontal surface and a conductive...
US-9,373,688 Normally-off high electron mobility transistors
A normally-off transistor includes a first region of III-V semiconductor material, a second region of III-V semiconductor material on the first region, a third...
US-9,373,609 Bump package and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a...
US-9,373,596 Passivated copper chip pads
A structure and method of forming passivated copper chip pads is described. In various embodiments, the invention describes a substrate that includes active...
US-9,373,577 Hybrid semiconductor package
A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the...
US-9,373,566 High power electronic component with multiple leadframes
In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a...
US-9,373,563 Semiconductor assembly having a housing
A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides...
US-9,372,212 Circuits and methods for measuring a current
A circuit is provided, including a first resistor, a second resistor which may have an adjustable resistance, and a control unit. The control unit may be...
US-9,370,113 Power semiconductor module with current sensor
A power semiconductor module includes a power electronics substrate having a first surface, a second surface opposite the first surface, a first longitudinal...
US-9,370,069 Multi-function pin for light emitting diode (LED) driver
Techniques are described for a multi-function pin of a light emitting diode (LED) driver. The techniques utilize this multi-function pin for switching current...
US-9,369,314 Generation of Manchester-decoded binary values
A method for generating Manchester-decoded binary values is disclosed, in which a signal having signal edges is first of all read in. A first sequence of...
US-9,369,120 Detector circuit, transponder and method for detecting signal amplitudes
A transponder circuit for receiving and processing an ASK signal having modulated communication information is provided. The transponder circuit includes a data...
US-9,368,654 Photodetector and method for manufacturing the same
A photodetector includes a substrate and an insulating arrangement formed in the substrate. The insulating arrangement electrically insulates a confined region...
US-9,368,617 Superjunction device and semiconductor structure comprising the same
The present disclosure relates to a superjunction device and a semiconductor structure having the same. The superjunction device includes a body region of a...
US-9,368,573 Methods for manufacturing a semiconductor device
In various embodiments, a method for manufacturing a semiconductor device is provided. The method for manufacturing a semiconductor device may include forming a...
US-9,368,447 Electronic device and method for production
An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or...
US-9,368,436 Source down semiconductor devices and methods of formation thereof
A method for forming a semiconductor device includes forming device regions in a semiconductor substrate having a first side and a second side. The device...
US-9,368,435 Electronic component
In an embodiment, an electronic component includes a dielectric layer, a semiconductor device embedded in the dielectric layer, an electrically conductive...
US-9,368,434 Electronic component
In an embodiment, an electronic component includes a housing, a die pad having a first surface and a second surface opposing the first surface, a first high...
US-9,368,408 Method of manufacturing a semiconductor device with buried channel/body zone and semiconductor device
A semiconductor device includes a source zone of a first conductivity type formed in a first electrode fin that extends from a first surface into a...
US-9,366,733 Sensor package and method for producing a sensor package having alignment marks or structures
Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first...
US-9,366,700 Current sensor
A current sensor includes a conductive element, and at least two magnetic field sensors arranged on the conductive element and configured to sense a magnetic...
US-9,366,593 Pressure sensor package with integrated sealing
A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side...
US-9,363,609 Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and...
Embodiments show a method for fabricating a cavity structure, a semiconductor structure, a cavity structure for a semiconductor device and a semiconductor...
US-9,362,953 Efficient error correction of multi-bit errors
A circuitry for error correction includes a plurality of subcircuits for determining intermediate values Zw.sub.0, Zw.sub.1, Zw.sub.2, Zw.sub.3 to be used as...
US-9,362,950 High performance CRC calculation with small footprint
A cyclic redundancy check (CRC) can be determined with fewer resources within a communication system. A CRC interface component is configured to receive an...
US-9,362,905 Composite semiconductor device with turn-on prevention control
There are disclosed herein various implementations of composite III-nitride semiconductor devices having turn-on prevention control. In one exemplary...
US-9,362,853 Plate, transducer and methods for making and operating a transducer
A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a...
US-9,362,498 Method of forming a memory and method of forming a memory array
A method of forming a memory includes forming a first electrode and a second electrode within a first layer over a semiconductor substrate, forming a...
US-9,362,371 Method for producing a controllable semiconductor component having a plurality of trenches
A method of producing a controllable semiconductor component includes providing a semiconductor body with a top side and a bottom side, and forming a first...
US-9,362,349 Semiconductor device with charge carrier lifetime reduction means
A semiconductor device includes a cell region having at least one device cell, wherein the at least one device cell includes a first device region of a first...
US-9,362,267 Group III-V and group IV composite switch
In one implementation, a group III-V and group IV composite switch includes a group IV transistor in a lower active die, the group IV transistor having a source...
US-9,362,240 Electronic device
An electronic device includes multiple semiconductor chips in a single housing. Such semiconductor chips may comprise different semiconductor materials, for...
US-9,362,221 Surface mountable power components
According to an exemplary implementation, a power component includes a component substrate and a power semiconductor device electrically and mechanically...
US-9,362,216 Conductive pads and methods of formation thereof
In one embodiment, a device includes a first conductive pad disposed over a substrate, and a etch stop layer disposed over a top surface of the first conductive...
US-9,362,215 Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a U-phase output node situated on a first leadframe island of a...
US-9,362,193 Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for...
A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation...
US-9,362,191 Encapsulated semiconductor device
A semiconductor device includes a carrier and a semiconductor chip disposed over the carrier. The semiconductor chip has a first surface and a second surface...
US-9,362,187 Chip package having terminal pads of different form factors
A chip package includes an integrated circuit chip. A first group of terminal pads of the chip package is electrically connected to the integrated circuit chip...
US-9,362,127 Method for processing a workpiece by forming a pourous metal layer
A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first...
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