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Optoelectronic module and method for its production
An optoelectronic module includes a transmitting and/or receiving element, a support on which the transmitting and/or receiving element is disposed, and a module...
A microrelay has a switching part which is pivotably suspended on a substrate and can be moved into two alternative switching states like a rocker, by...
Radio-frequency input stage
A radio-frequency input stage is specified and has a radio-frequency coupling element which couples an air interface to the inputs of parallel-connected...
RF power transistor with internal bias feed
Conventional broadband RF power amplifiers use a 1/4 wavelength transmission line to decouple the gate bias DC source from the gate circuitry and a second 1/4...
Controllable current source circuit and a phase locked loop equipped with
such a circuit
A controllable current source circuit and a phase locked loop contained such a circuit are disclosed. The current source circuit such a single switched driver...
Method and semiconductor component having a device for determining an
A method and a semiconductor component are described in which an internal voltage to be measured is divided via a matched voltage divider, and is passed to a...
Method and timing circuit for generating a switching or control signal
A method for generating a control signal after a predeterminable period of time is described. The method includes applying a voltage to an inductor at a...
Component for forming vertically standing waves of a wavelength
A component has a piezoelectric layer, which is arranged between a first lower electrode and a first upper electrode and also a second lower electrode and a...
Semiconductor component and method of producing it
A semiconductor component includes a first layer and at least one adjacent semiconductor layer or metallic layer, which forms a rectifying junction with the...
Integrated semiconductor circuit having contact points and configuration
having at least two such circuits
For a selection of semiconductor chips stacked on top of one another, the invention includes leading through selection contact points of one chip on a rear side...
Semiconductor memory cell
A semiconductor memory cell is formed in a substrate and includes a capacitor, a transistor, and an electrical contact. The transistor includes a doped region...
Liner with poor step coverage to improve contact resistance in W contacts
A method of filling a damascene structure with liner and W characterized by improved resistance and resistance spread and adequate adhesion comprising: a given...
Method for producing cavities with submicrometer patterns in a
semiconductor device using a freezing process liquid
A method for producing cavities, which are patterned in submicrometer dimensions, in a cavity layer of a semiconductor device, is described. In the method, a...
Method for fabricating a trench capacitor for a semiconductor memory
A method for fabricating a trench capacitor for a semiconductor memory includes forming a masking layer in a trench that is disposed in a substrate....
Non-volatile memory cell and fabrication method
Memory cell transistors with back-channel isolation are produced without using an SOI substrate. With the word line stack acting as a mask, the semiconductor...
Semiconductor device with deep trench isolation and method of manufacturing
A semiconductor device and method of making the same is provided having enhanced isolation between the bit line contact and the gate region of the semiconductor...
Method of patterning capacitors and capacitors made thereby
A method of forming a ferroelectric capacitor, in particular for use in a FeRAM or high-k DRAM application, and a capacitor made by the method. The method...
Electrooptical transmitting/receiving module, and method for producing the
An electrooptical transmitting and/or receiving module has a lead frame and an optoelectronic transducer mounted thereon. The lead frame and the optoelectronic...
Conveying element and conveyor means for conveying wafer receptacles, and
A conveyor element (10) for conveying wafer receptacles between a conveyor (12) and a loading station (11) of a manufacturing system in the semiconductor...
Pressure sensor and process for producing the pressure sensor
The invention relates to a pressure sensor with an MEM structure (micro electro mechanical structure), which has a hollow housing in which a semiconductor chip...
Leadframe-based optoelectronic bidirectional transmitting and receiving
The transceiver module has the transmitter and receiver mounted on one side of a leadframe above light passage openings formed therein. A beam deflection...
DDR memory and storage method
The invention relates to a DDR memory and to a storage method for storing data in a DDR memory having a plurality of memory cells which each have a prescribed...
2T2C signal margin test mode using resistive element
The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality...
Integrated dynamic memory and operating method
An integrated dynamic memory includes a memory cell array having memory cells for storing a charge corresponding to an information bit. The memory cell array has...
Variable capacitances for memory cells within a cell group
A memory chain with capacitors having different capacitances, depending on the location of the memory cell within the chain, is described. Varying the...
Total error multiplier for optimizing read/write channel
A method and apparatus to optimize a bit error rate for a partial response, maximum likelihood ("PRML") read/write channel is disclosed. A channel margining...
Circuit for an electronic semiconductor module
It is an aim to reduce an area required on a chip for interconnects which cross a spine center. The circuit has n inputs, which are disposed on one side of the...
Semiconductor package and method
A semiconductor packaging arrangement, or module, includes a printed circuit board having an electrical interconnect thereon and a semiconductor package mounted...
FBEOL process for Cu metallizations free from Al-wirebond pads
A process of making an interconnection structure of Cu FBEOL semiconductor devices that does not rely upon Al-wirebond pads which require additional patterning...
Memory element and method for fabricating a memory element
A memory element with organic material comprises two metallized layers, arranged one on top of the other, with first lines and second lines which are arranged to...
Method for fabricating a barrier layer
A method of fabricating a barrier layer includes oxidizing a silicon-containing substrate to form a substrate oxide layer on the surface of the substrate,...
Method of patterning ferroelectric layers
A method for structuring ferroelectric layers on semiconductor substrates retains or regenerates the adherence and breakdown voltage resistance of the...
Method for determining and removing phase conflicts on alternating phase
A photoresist layer on a substrate wafer is exposed in first sections with a first exposure radiation and in second sections with a second exposure radiation...
Electro-optical module with a housing
The electro-optical module has a housing in which a supporting plate provided with at least one optical element, electric circuit elements, and electric...
An electro-optical module includes a connector and a module body having an electro-optical converter. The connector accommodates one end of a fiber optic...
Integrated circuit having a self-test device for carrying out a self-test
of the integrated circuit
An integrated circuit includes a self-test device which is provided for executing a self-test of the integrated circuit and which has a control output. A program...
Receiving device for angle-modulated signals
A receiving device for angle-modulated signals performs the channel selection in a digital manner rather than an analog manner. A receive signal is preferably...
Method for on-chip testing of memory cells of an integrated memory circuit
A method for on-chip testing of memory cells of a cell array of an integrated memory circuit includes writing different data patterns to memory cells and reading...
Semiconductor memory with a signal path
A semiconductor memory has a data signal path and a control device in order to supply functional elements of the data signal path with control signals....
Method and circuit configuration for generating a data strobe signal for
very fast semiconductor memory systems
A method is provided for generating a data strobe signal in order to transmit the latter through a signal line with tristate behavior from/to a semiconductor...
An integrated memory having a memory cell array has a control circuit for controlling a memory access for reading out or writing a data signal of one of the...
Enhanced overlay measurement marks for overlay alignment and exposure tool
In an overlay measurement mark comprising an inner box and an outer box located at a predetermined area on a mask through which patterns are formed on a...
Output driver circuit and method for adjusting a driver device
An output driver circuit includes a delay device disposed between a signal input and a driver device. The input signal to the driver device can be delayed by a...
Method for switching from a first operating condition of an integrated
circuit to a second operating condition...
The invention provides a method for switching from a first operating condition of an integrated circuit to a second operating condition of the integrated circuit...
Circuit configuration and sensor device
The circuit configuration converts an input signal into a binary output signal. The circuit has at least one comparator, at least one demodulation unit, and at...
Connection device and method for producing the same
A connection device for a circuitry device connects a circuitry unit with a contact device to thermo-mechanically uncouple the circuitry unit and the contact...
A semiconductor component that is suitable for wafer level packaging contains a plurality of contact elements that are elevated relative to a main body of the...
Transfer wafer level packaging
A semiconductor structure and a method for forming the semiconductor structure, including a semiconductor chip and a conductive layer disposed over a portion of...
Semiconductor chip assembly system with a suction nipple for removing a
A semiconductor chip assembly system has a suction nipple for picking up a semiconductor chip from a carrier film. For this purpose, the suction nipple has a...
Micromechanical differential pressure sensor device
A micromechanical differential pressure sensor device for measuring a pressure difference between two mutually separated spaces or media, in which two absolute...