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Electronic device and method for fabricating an electronic device
An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and...
Semiconductor device having a corrosion-resistant metallization and method
for manufacturing thereof
A semiconductor device includes a semiconductor substrate having a first side, a second side opposite the first side, an active area, an outer rim, and an edge...
Semiconductor device with self-aligned contact plugs
A semiconductor device includes subsurface structures extending from a main surface into a semiconductor portion, each subsurface structure including a gate...
Power semiconductor module having low gate drive inductance flexible board
A power semiconductor module includes a metallization layer and a power semiconductor die attached to the metallization layer. The die has a first terminal and...
Method of manufacturing an integrated circuit having field effect
transistors including a peak in a body dopant...
An integrated circuit having field effect transistors and manufacturing method. One embodiment provides an integrated circuit including a first FET and a second...
Semiconductor device including a dielectric material
A method for manufacturing a semiconductor device includes providing a carrier and a semiconductor wafer having a first side and a second side opposite to the...
Off-axis magnetic field angle sensors
Embodiments relate to magnetic field angle sensing systems and methods. In an embodiment, a magnetic field angle sensing system configured to determine a...
System-on-chip with master/slave debug interface
A System-on-Chip (SOC) debugging system comprising a plurality of SOCs connected to a shared bus, at least one of the plurality of SOCs being a master SOC and...
Device having a plurality of driver circuits to provide a current to a
plurality of loads and method of...
In various embodiments, a device is provided. The device includes a substrate having a first side and a second side opposite the first side. The substrate...
System and method for generating an auxiliary voltage
In accordance with an embodiment, a circuit includes a first normally-on transistor having a drain coupled to a first switching output node, a normally-off...
Switching regulator with increased light load efficiency in pulse
frequency modulation mode
A switching regulator includes a multiphase converter which includes a plurality of main phases configured to covert a power supply voltage to a lower voltage...
Semiconductor device and method of manufacturing the same
A semiconductor device includes a vertical IGFET in a first area of a semiconductor body, the vertical IGFET having a drift zone between a body zone and a drain...
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes forming a transistor in a semiconductor substrate having a first main surface. The transistor is...
Method of manufacturing a multi-channel HEMT
A method of manufacturing a transistor device includes forming a semiconductor heterostructure including a plurality of alternating two-dimensional electron...
Composite wafer for bonding and encapsulating an SiC-based functional
A composite wafer includes a substrate and a SiC-based functional layer. The substrate includes a porous carbon substrate core and an encapsulating layer...
Adjusting the charge carrier lifetime in a bipolar semiconductor device
Disclosed are a method and a semiconductor device. The method includes implanting recombination center atoms via a first surface into a semiconductor body, and...
Semiconductor switching device with different local threshold voltage
A semiconductor device includes a semiconductor substrate having a plurality of switchable cells defining an active area of the semiconductor device, an outer...
A layer arrangement in accordance with various embodiments may include: a first layer having a side; one or more nanoholes in the first layer that are open...
Super junction semiconductor device having columnar super junction regions
A super junction semiconductor device includes a semiconductor portion with a first surface and a second surface parallel to the first surface. The...
Depletion mode group III-V transistor with high voltage group IV enable
There are disclosed herein various implementations of a half-bridge or multiple half-bridge switch configurations used in a voltage converter circuit using at...
Electronic component with sheet-like redistribution structure
An electronic component comprising an electrically conductive chip carrier comprising an electrically insulating core structure at least partially covered with...
Integrated antennas in wafer level package
A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least...
Chip arrangement and method of manufacturing the same
A chip arrangement is provided which comprises a carrier; and at least two chips arranged over the carrier; wherein a continuous insulating layer is arranged...
Stacked half-bridge package with a common leadframe
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input,...
Device and method for bypassing a first program code portion with a
replacement program code portion
A device comprises a processor configured to execute a sequence of program instructions, a first storage configured to store a first memory address, a second...
Touchdown monitoring for individual dies of a semiconductor wafer
A prober system comprises a chuck, sensor and processing circuit. The chuck is configured to horizontally move a semiconductor wafer having a plurality of dies...
Fluid sensor chip and method for manufacturing the same
A fluid sensor chip includes an isolator substrate including amorphous carbon, an electrical conductor including graphite and an active material including...
Lead frame based MEMS sensor structure
A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS...
Sensor self-diagnostics using multiple signal paths
Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and...
Inverse current protection circuit sensed with vertical source follower
A monolithic integrated circuit includes a low-voltage control circuit, a vertical power transistor, and a source follower. The vertical power transistor...
System and method for a voltage controlled oscillator
In accordance with an embodiment, an oscillator includes a tank circuit and an oscillator core circuit having a plurality of cross-coupled compound transistors...
Driving circuit for a transistor
In various embodiments, a driving circuit for a transistor is provided, wherein the transistor may include a transistor having a control terminal, a diode, a...
Interrupt protection circuits, systems and methods for sensors and other
Embodiments relate to circuits, systems and methods for providing interruption protection for sensors and other devices. One example embodiment includes an...
Active power factor corrector circuit
An electronic device includes a controller configured to apply slope compensation to a reference signal in a power factor corrector. The device also configured...
Normally-off semiconductor switches and normally-off JFETs
A normally-off JFET is provided. The normally-off JFET includes a channel region of a first conductivity type, a floating semiconductor region of a second...
Semiconductor device having a dense trench transistor cell array
One embodiment of a semiconductor device includes a dense trench transistor cell array. The dense trench transistor cell array includes a plurality of...
Dual-gated group III-V merged transistor
There are disclosed herein various implementations of a group III-V merged cascode transistor. Such a group III-V merged cascode transistor includes a group...
Stacked composite device including a group III-V transistor and a group IV
In one implementation, a stacked composite device comprises a group IV vertical transistor and a group III-V transistor stacked over the group IV vertical...
Method of connecting a semiconductor package to a board
A method of connecting a semiconductor package to a board includes providing a board having a plurality of contact regions, providing a semiconductor package...
Semiconductor component with integrated crack sensor and method for
detecting a crack in a semiconductor component
A first embodiment relates to a semiconductor component. The semiconductor component has a semiconductor body with a bottom side and a top side spaced distant...
Word line address scan
A system and method for performing three scans for testing an address decoder and word line drive circuits is disclosed. The first scan determines whether only...
Electric circuit and terminal
In a system, there is communication between an electric circuit and a terminal within a scope of a terminal session, wherein the electric circuit has a current...
Processing device and method for multiplying polynomials
According to one embodiment, a processing device for multiplying a first polynomial with a second polynomial is described including a first memory storing a...
Systems and methods having omnipolar comparators for magnetic switches
An omnipolar magnetic sensor system includes an input stage and a behavior component. The input stage is configured to receive a source signal and to...
Repeater for tire pressure monitoring system (TPMS) auto localization
A TPMS auto localization system for on-demand tire parameter acquisition and an associated method includes a central unit configured to receive and transmit...
Method of processing a substrate
In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, a stamp device may be disposed at least in the...
Spatial intensity distribution controlled flash
This disclosure describes techniques for outputting light with a controlled spatial intensity distribution. According to some examples, this disclosure...
Microphone, a microphone arrangement and a method for processing signals
in a microphone
A microphone includes a first signal input, a second signal input and a control unit coupled to the first signal input and the second signal input. The control...
Circuit assembly for processing an input signal, microphone assembly and
method for following an input signal
A circuit assembly and a method for processing an input signal are disclosed. In one embodiment a circuit assembly comprises a voltage provider configured to...
Electronic circuit with a reverse-conducting IGBT and gate driver circuit
An electronic circuit includes a reverse-conducting IGBT and a driver circuit. A first diode emitter efficiency of the reverse-conducting IGBT at a first...