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Semiconductor diode and method of manufacturing a semiconductor diode
A semiconductor diode includes a semiconductor body having opposite first and second sides. A first and a second semiconductor region are consecutively arranged...
Semiconductor arrangement with a load, a sense and a start-up transistor
A semiconductor arrangement includes a semiconductor body with a first active region, a second active region and an isolation region arranged between the first...
Electronic component with electronic chip between redistribution structure
and mounting structure
An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive...
Multichip device including a substrate
A device includes a substrate including an electrically insulating core, a first electrically conductive material arranged over a first main surface of the...
Glass carrier with embedded semiconductor device and metal layers on the
A device includes a semiconductor material having a first main surface, an opposite surface opposite to the first main surface and a side surface extending from...
Overmolded substrate-chip arrangement with heat sink
An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system...
Method for providing a self-aligned pad protection in a semiconductor
According to one embodiment, a method for processing a semiconductor device is provided including forming a final metal layer forming a passivation layer over...
Semiconductor component of semiconductor chip size with flip-chip-like
A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the...
Method of manufacturing a vertical semiconductor device
A method for producing a vertical semiconductor device includes providing a semiconductor substrate having a first surface and comprising an n-doped first...
Method of manufacturing a semiconductor device with a continuous silicate
A method of manufacturing a semiconductor device includes forming a continuous silicate glass structure over a first surface of a semiconductor body, including...
Smart card module, smart card body, smart card and smart card production
In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite...
Machine and methods for evaluating failing software programs
A machine for evaluating failing software programs, a non-transitory computer-readable storage medium with an error analysis program stored thereon and an error...
Circuits, methods, and computer programs to detect mechanical stress and
to monitor a system
Embodiments provide a circuit, a method, and a computer program configured to detect mechanical stress and a circuit, a method, and a computer program...
Through bias pole for IGMR speed sensing
One embodiment relates to a sensing system that includes a magnetic encoder wheel having alternating pole magnetic domains along a circumference thereof. The...
Micromechanical system and method for manufacturing a micromechanical
A method for manufacturing a micromechanical system is shown. The method comprises the steps of forming in a front end of line (FEOL) process a transistor in a...
Microphone package and method for providing a microphone package
A microphone package comprises a microphone. The microphone package also comprises a first analog-to-digital converter coupled to the microphone to provide a...
Circuit and method for operating a half-bridge
A circuit for operating a half-bridge is provided. The circuit may include a first multiplier circuit. The first multiplier circuit may be configured to...
Runtime compensated oscillator
Disclosed is a method for generating an oscillating signal and an oscillator circuit.
Electrical device and method for manufacturing same
An electrical device includes a first layer, a second layer and an intrinsic layer. The first layer is of a first conductivity type, wherein the second layer is...
Transistor having increased breakdown voltage
A transistor includes a source finger electrode having a source finger electrode beginning and a source finger electrode end. The transistor also includes a...
Method of forming a trench using epitaxial lateral overgrowth and deep
vertical trench structure
In one aspect, a method of forming a trench in a semiconductor material includes forming a first dielectric layer on a semiconductor substrate. The first...
An electronic device includes a first transistor device with first contact elements, a second transistor device with second contact elements, and an electrical...
Module comprising a semiconductor chip
A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a...
A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface....
Highly conductive source/drain contacts in III-nitride transistors
In one embodiment, a method for fabricating a III-Nitride transistor on a III-Nitride semiconductor body is disclosed. The method comprises etching dielectric...
Method for detecting damage to a semiconductor chip
A semiconductor chip having a current source coupled between a first potential and an electrical node, a detection circuit having an input coupled to the...
Voltage regulating circuit
In various embodiments, a circuit is provided including a supply terminal, a logic circuit, an inverter and a control transistor which may include a body...
Coverage enhancement and power aware clock system for structural
Methods and devices applying to a clock system of scan circuits to enhance the test coverage for structural delay-fault tests are provided. According to an...
Testing of semiconductor devices and devices, and designs thereof
In accordance with an embodiment of the present invention, a method of testing a plurality of semiconductor devices includes applying a stress voltage having a...
Method for manufacturing a micromechanical system
A method for manufacturing a micromechanical system includes forming in a Front-End-of-Line (FEOL) process transistors in a transistor region; after the...
Pulse width modulated (PWM) sensor interface using a terminated
symmetrical physical layer
A device, such as a transceiver or a sensor, is provided. An interface circuit of the device terminates a signal line with an impedance matching an impedance of...
Method for driving a load
An electronic switch includes a load path connected in series with the load and a drive terminal for receiving a drive signal. The electronic switch is operable...
System and method for a low noise amplifier
An embodiment described herein includes a low noise amplifier (LNA) including a plurality of separate input terminals, a plurality of transistors, and an output...
Stress-inducing structures, methods, and materials
Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a...
Insulated gate bipolar transistor
A semiconductor component is described herein. In accordance with one example of the invention, the semiconductor component includes a semiconductor body, which...
Field plate trench transistor and method for producing it
A field plate trench transistor having a semiconductor body. In one embodiment the semiconductor has a trench structure and an electrode structure embedded in...
Method for forming a semiconductor device with an integrated poly-diode
A method for forming a field effect power semiconductor device includes providing a semiconductor body comprising a main horizontal surface and a conductive...
Normally-off high electron mobility transistors
A normally-off transistor includes a first region of III-V semiconductor material, a second region of III-V semiconductor material on the first region, a third...
Bump package and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a...
Passivated copper chip pads
A structure and method of forming passivated copper chip pads is described. In various embodiments, the invention describes a substrate that includes active...
Hybrid semiconductor package
A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the...
High power electronic component with multiple leadframes
In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a...
Semiconductor assembly having a housing
A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides...
Circuits and methods for measuring a current
A circuit is provided, including a first resistor, a second resistor which may have an adjustable resistance, and a control unit. The control unit may be...
Power semiconductor module with current sensor
A power semiconductor module includes a power electronics substrate having a first surface, a second surface opposite the first surface, a first longitudinal...
Multi-function pin for light emitting diode (LED) driver
Techniques are described for a multi-function pin of a light emitting diode (LED) driver. The techniques utilize this multi-function pin for switching current...
Generation of Manchester-decoded binary values
A method for generating Manchester-decoded binary values is disclosed, in which a signal having signal edges is first of all read in. A first sequence of...
Detector circuit, transponder and method for detecting signal amplitudes
A transponder circuit for receiving and processing an ASK signal having modulated communication information is provided. The transponder circuit includes a data...
Photodetector and method for manufacturing the same
A photodetector includes a substrate and an insulating arrangement formed in the substrate. The insulating arrangement electrically insulates a confined region...
Superjunction device and semiconductor structure comprising the same
The present disclosure relates to a superjunction device and a semiconductor structure having the same. The superjunction device includes a body region of a...