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Techniques for electrically characterizing tunnel junction film stacks with
little or no processing
Probes are electrically connected to a surface of a tunnel junction film stack comprising a free layer, a tunnel barrier, and a pinned layer. Resistances are...
Voltage generator arrangement
A voltage generator arrangement supplies a largely constant output voltage with a high current driver capability. A bandgap reference circuit drives a voltage...
Protective device with spacer for subassemblies
A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a...
Stack arrangement of a memory module
A stack arrangement of discrete components includes a carrier substrate and at least two discrete components, e.g., memory chips. The carrier substrate has line...
Method of forming a gate contact in a semiconductor device
A processing sequence for definition of gate contacts can be implemented using either a deep ultra-violet (DUV) or mid ultra-violet (MUV) positive resist...
Process to suppress lithography at a wafer edge
Damage to the rim of a semiconductor wafer caused by etching processes is reduced by forming a rim of photoresist or other material around the outer edge of the...
Integrated circuit and method for producing a composite comprising a tested
integrated circuit and an...
Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device. According to one embodiment, a method is...
Method for fabricating a transistor with a gate structure
A gate structure of a transistor is fabricated with an additional barrier formed on a metal layer of the gate structure before the deposition of a silicon oxide...
Field-effect-controllable semiconductor component and method for
fabricating the component
A method for fabricating a field-effect-controllable semiconductor component includes providing a configuration having a semiconductor body with a front side, a...
Pluggable transceiver latching mechanism
The invention features novel systems and methods for latching a pluggable transceiver to and unlatching the pluggable transceiver from a cage. In one aspect, a...
Method for producing large-area planar wave guide structures
A method and a device for producing large-area planar wave guide structures is described. A planar substrate is provided with channel-shaped structures and the...
Semiconductor memory having mutually crossing word and bit lines, at which
magnetoresistive memory cells are...
In the memory cell array of a semiconductor memory the memory elements or memory cells with a magnetoresistive effect can have a hard-magnetic memory layer and a...
Coil on a semiconductor substrate and method for its production
A coil apparatus includes a coil trace, a semiconductor substrate and a dielectric layer arranged on the semiconductor substrate, at least parts of the coil...
Phase locked loop
A phase locked loop has a voltage controlled oscillator with two tuning inputs. One tuning input can be supplied with a feedback signal via a frequency divider...
DLL circuit for stabilization of the initial transient phase
A DLL circuit for phase matching of a periodic input signal, having a variable delay unit, having a delay element and having a regulation unit which has a...
A buffer device includes a plurality of latch stages which each have a latch device and a multiplexer. At least the multiplexer of the first latch stage on the...
Differential to single-ended logic converter
The present invention is a converter stage for converting a differential logic input signal and a corresponding common mode differential logic signal each having...
Field-effect power transistor
The present invention provides a field-effect power transistor having a first semiconductor region (10) with first channels (20) having a large ratio of a...
Semiconductor device comprising a capacitor using a ferroelectric material
A semiconductor device comprises a bottom electrode, a top electrode, and a dielectric film provided between the bottom electrode and the top electrode and made...
Semiconductor device with perovskite capacitor
There is disclosed a semiconductor device comprising a semiconductor substrate, and a capacitor provided above the semiconductor substrate and comprising a...
Method for producing an electrically conductive contact
An electrically conductive contact can be used to connect an integrated component to an interconnect. A sacrificial layer is deposited on a liner and planarized...
Method for fabricating an integrated semiconductor component
A method for the fabrication of an integrated semiconductor component, in which at least one isolation trench is formed, a first layer of a nonconductive...
Method for producing a thyristor
A thyristor having a first zone, a second zone, a third zone, and a fourth zone. At least one control electrode is connected to the second and/or third zone. In...
Method for forming a ferroelectric capacitor device
A ferroelectric capacitor device, such as an FeRAM device is formed by forming a substrate extending in a first plane and comprising a number of layers of...
Memory, processor system and method for performing write operations on a
A memory is provided which has a memory region for storing data, an input for receiving a data bundle with a plurality of temporally sequential data blocks and...
Method and apparatus for clock timing recovery in .chi.DSL particularly
Method and modem for fast timing recovery of transmitted data between a master .chi.DSL modem and a slave .chi.DSL modem, over a noisy, high loss, high...
A laser device has a laser diode with an optical resonator. The resonator has an exit side for emitting light into an optical system. A monitor diode is provided...
Read-out circuit for a dynamic memory circuit, memory cell array, and
method for amplifying and reading data...
A read-out circuit for a dynamic memory circuit has an interchanging circuit. The interchanging circuit can apply the bit lines that are connected to the storage...
Device for connecting the terminal pins of a package for an optical
transmitting and/or receiving device to a...
The device has a package with a base plate, and at least two terminal pins perpendicularly protruding from the base plate of the package. At least one of the...
Memory module with a heat dissipation means
A memory module includes a board, a memory device attached to the board, and a heat dissipation means arranged between the memory device and the board.
Test system for laser diode far-field pattern measurement
A test system for positioning and measuring the far-field pattern of a laser diode under test (LDUT) using a single objective lens and two relay lenses....
Electronic circuit, sensor arrangement and method for processing a sensor
In a first phase a first sensor signal, essentially comprising the current offset signal of the sensor, is applied to the input of an electronic circuit. The...
Circuit configuration for signal balancing in antiphase bus drivers
A circuit configuration for signal balancing in antiphase bus drivers, particularly for a CAN bus, which have, in each driver path of the bus, a driver amplifier...
Transistor with dopant-bearing metal in source and drain
A transistor and method of manufacturing thereof. A gate dielectric and gate are formed over a workpiece, and the source and drain regions of a transistor are...
Method and apparatus for testing circuit modules
A method and apparatus for testing by sampling vectors circuit modules designated as channel models or as control modules and containing scan chains. Use is made...
Bank address mapping according to bank retention time in dynamic random
A system and method for refreshing data in a dynamic random access memory ("DRAM") is provided, where the system includes a data memory having a plurality of...
Method and apparatus for modular multiplying and calculating unit for
A multiplicand is multiplied by a multiplier using a modulus. The multiplicand, the multiplier and the modulus are polynomials of variable. A multiplication...
Electronic device having an operating mode and an energy saving standby
mode, and a method for switching...
An electronic device has an operating mode and an energy saving standby mode. The electronic device includes an input-side antenna element for receiving a signal...
Broadband driver for signals that are transmitted in different frequency ranges, comprising: (a) a first broadband driver circuit (19) for driving first signals...
Method for reading a memory cell in a semiconductor memory, and
In a semiconductor memory, there is capacitive coupling between bit lines that largely run in parallel. Outer sections of the bit lines are connected via...
Reducing effects of noise coupling in integrated circuits with memory
A method for reducing noise coupling in a memory array is disclosed. The memory array includes a plurality memory cells interconnected by wordlines, bitlines,...
Circuit arrangement for low-noise fully differential amplification
The invention relates to a circuit for low noise, fully differential amplification. A feedback signal (121) is detected in a differential output step of the...
The invention relates to a voltage regulating circuit arrangement for converting a first voltage (VEXT) applied to an input of said voltage regulating circuit...
Shielding device for integrated circuits
A shielding device includes optical and/or electrical shielding disposed on the side of the integrated circuit in the semiconductor chip facing the substrate....
Production method for a semiconductor component
A method for fabricating a semiconductor component includes: deposition of a polysilicon layer on a substrate, deposition of a precursor layer on the polysilicon...
Method for the solder-stop structuring of elevations on wafers
A method is provided for the solder-stop structuring of elevations on wafers, such as 3D contact structures in the form of resilient or compliant contact bumps,...
Semiconductor trench structure
A method for fabricating a semiconductor trench structure includes forming a trench in a semiconductor substrate and filling it with a filler. A first thermal...
Method for producing an antifuse in a substrate and an antifuse structure
for integration in a substrate
Method for producing an antifuse in a substrate, a first interconnect being applied to the substrate, a dielectric layer being applied at an end face of the...
Process for producing a semiconductor chip
A process for producing a semiconductor chip having contact elements protruding on one chip side within the context of wafer level packaging, the chip side...
Production method for a halftone phase mask
The present invention provides a production method for a halftone phase mask which has an SiO.sub.2 substrate, an overlying refractory metal Si.sub.x N.sub.y...