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Micromechanical system and method for manufacturing a micromechanical
A method for manufacturing a micromechanical system is shown. The method comprises the steps of forming in a front end of line (FEOL) process a transistor in a...
Microphone package and method for providing a microphone package
A microphone package comprises a microphone. The microphone package also comprises a first analog-to-digital converter coupled to the microphone to provide a...
Circuit and method for operating a half-bridge
A circuit for operating a half-bridge is provided. The circuit may include a first multiplier circuit. The first multiplier circuit may be configured to...
Runtime compensated oscillator
Disclosed is a method for generating an oscillating signal and an oscillator circuit.
Electrical device and method for manufacturing same
An electrical device includes a first layer, a second layer and an intrinsic layer. The first layer is of a first conductivity type, wherein the second layer is...
Transistor having increased breakdown voltage
A transistor includes a source finger electrode having a source finger electrode beginning and a source finger electrode end. The transistor also includes a...
Method of forming a trench using epitaxial lateral overgrowth and deep
vertical trench structure
In one aspect, a method of forming a trench in a semiconductor material includes forming a first dielectric layer on a semiconductor substrate. The first...
An electronic device includes a first transistor device with first contact elements, a second transistor device with second contact elements, and an electrical...
Module comprising a semiconductor chip
A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a...
A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface....
Highly conductive source/drain contacts in III-nitride transistors
In one embodiment, a method for fabricating a III-Nitride transistor on a III-Nitride semiconductor body is disclosed. The method comprises etching dielectric...
Method for detecting damage to a semiconductor chip
A semiconductor chip having a current source coupled between a first potential and an electrical node, a detection circuit having an input coupled to the...
Voltage regulating circuit
In various embodiments, a circuit is provided including a supply terminal, a logic circuit, an inverter and a control transistor which may include a body...
Coverage enhancement and power aware clock system for structural
Methods and devices applying to a clock system of scan circuits to enhance the test coverage for structural delay-fault tests are provided. According to an...
Testing of semiconductor devices and devices, and designs thereof
In accordance with an embodiment of the present invention, a method of testing a plurality of semiconductor devices includes applying a stress voltage having a...
Method for manufacturing a micromechanical system
A method for manufacturing a micromechanical system includes forming in a Front-End-of-Line (FEOL) process transistors in a transistor region; after the...
Pulse width modulated (PWM) sensor interface using a terminated
symmetrical physical layer
A device, such as a transceiver or a sensor, is provided. An interface circuit of the device terminates a signal line with an impedance matching an impedance of...
Method for driving a load
An electronic switch includes a load path connected in series with the load and a drive terminal for receiving a drive signal. The electronic switch is operable...
System and method for a low noise amplifier
An embodiment described herein includes a low noise amplifier (LNA) including a plurality of separate input terminals, a plurality of transistors, and an output...
Stress-inducing structures, methods, and materials
Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a...
Insulated gate bipolar transistor
A semiconductor component is described herein. In accordance with one example of the invention, the semiconductor component includes a semiconductor body, which...
Field plate trench transistor and method for producing it
A field plate trench transistor having a semiconductor body. In one embodiment the semiconductor has a trench structure and an electrode structure embedded in...
Method for forming a semiconductor device with an integrated poly-diode
A method for forming a field effect power semiconductor device includes providing a semiconductor body comprising a main horizontal surface and a conductive...
Normally-off high electron mobility transistors
A normally-off transistor includes a first region of III-V semiconductor material, a second region of III-V semiconductor material on the first region, a third...
Bump package and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a...
Passivated copper chip pads
A structure and method of forming passivated copper chip pads is described. In various embodiments, the invention describes a substrate that includes active...
Hybrid semiconductor package
A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the...
High power electronic component with multiple leadframes
In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a...
Semiconductor assembly having a housing
A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides...
Circuits and methods for measuring a current
A circuit is provided, including a first resistor, a second resistor which may have an adjustable resistance, and a control unit. The control unit may be...
Power semiconductor module with current sensor
A power semiconductor module includes a power electronics substrate having a first surface, a second surface opposite the first surface, a first longitudinal...
Multi-function pin for light emitting diode (LED) driver
Techniques are described for a multi-function pin of a light emitting diode (LED) driver. The techniques utilize this multi-function pin for switching current...
Generation of Manchester-decoded binary values
A method for generating Manchester-decoded binary values is disclosed, in which a signal having signal edges is first of all read in. A first sequence of...
Detector circuit, transponder and method for detecting signal amplitudes
A transponder circuit for receiving and processing an ASK signal having modulated communication information is provided. The transponder circuit includes a data...
Photodetector and method for manufacturing the same
A photodetector includes a substrate and an insulating arrangement formed in the substrate. The insulating arrangement electrically insulates a confined region...
Superjunction device and semiconductor structure comprising the same
The present disclosure relates to a superjunction device and a semiconductor structure having the same. The superjunction device includes a body region of a...
Methods for manufacturing a semiconductor device
In various embodiments, a method for manufacturing a semiconductor device is provided. The method for manufacturing a semiconductor device may include forming a...
Electronic device and method for production
An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or...
Source down semiconductor devices and methods of formation thereof
A method for forming a semiconductor device includes forming device regions in a semiconductor substrate having a first side and a second side. The device...
In an embodiment, an electronic component includes a dielectric layer, a semiconductor device embedded in the dielectric layer, an electrically conductive...
In an embodiment, an electronic component includes a housing, a die pad having a first surface and a second surface opposing the first surface, a first high...
Method of manufacturing a semiconductor device with buried channel/body
zone and semiconductor device
A semiconductor device includes a source zone of a first conductivity type formed in a first electrode fin that extends from a first surface into a...
Sensor package and method for producing a sensor package having alignment
marks or structures
Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first...
A current sensor includes a conductive element, and at least two magnetic field sensors arranged on the conductive element and configured to sense a magnetic...
Pressure sensor package with integrated sealing
A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side...
Method for fabricating a cavity structure, for fabricating a cavity
structure for a semiconductor structure and...
Embodiments show a method for fabricating a cavity structure, a semiconductor structure, a cavity structure for a semiconductor device and a semiconductor...
Efficient error correction of multi-bit errors
A circuitry for error correction includes a plurality of subcircuits for determining intermediate values Zw.sub.0, Zw.sub.1, Zw.sub.2, Zw.sub.3 to be used as...
High performance CRC calculation with small footprint
A cyclic redundancy check (CRC) can be determined with fewer resources within a communication system. A CRC interface component is configured to receive an...
Composite semiconductor device with turn-on prevention control
There are disclosed herein various implementations of composite III-nitride semiconductor devices having turn-on prevention control. In one exemplary...
Plate, transducer and methods for making and operating a transducer
A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a...