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Patent # Description
US-1,009,9411 Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips
A mold injection tool includes a first mold plate having first and second columns of mold cavities, each of the cavities and a first cull block arranged between...
US-1,009,7918 Chip arrangement and a method for manufacturing the same
In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip...
US-1,009,7115 Auto-synchronization of brushless DC motors
A controller for controlling a multiphase brushless direct current (BLDC) motor is described. The controller may be configured to determine that the multiphase...
US-1,009,7010 Control of freewheeling voltage
In one example, a circuit includes a voltage source, an inductive load, a capacitor, a switching unit, and a load unit. The switching unit is configured to...
US-1,009,6902 Antenna arrangement, communication appliance and antenna structure
In various embodiments, an antenna arrangement is provided. The antenna arrangement may include at least one integrated circuit; at least one loop antenna that...
US-1,009,6705 Integrated high side gate driver structure and circuit for driving high side power transistors
An integrated high side gate driver structure for driving a power transistor. The structure includes a semiconductor substrate having a first polarity...
US-1,009,6704 Semiconductor device having a non-depletable doping region
A semiconductor device includes a plurality of compensation regions of a vertical electrical element arrangement, a plurality of drift regions of the vertical...
US-1,009,6701 Gallium nitride materials and methods associated with the same
Semiconductor materials including a gallium nitride material region and methods associated with such structures are provided. The semiconductor structures...
US-1,009,6677 Methods for forming a semiconductor device and a semiconductor device
A method for forming a semiconductor device includes implanting a predefined dose of protons into a semiconductor substrate. Further, the method comprises...
US-1,009,6584 Method for producing a power semiconductor module
In order to produce a power semiconductor module, a circuit carrier is populated with a semiconductor chip and with an electrically conductive contact element....
US-1,009,6531 Semiconductor device with sensor potential in the active region
A semiconductor device includes semiconductor body region and a surface region, the semiconductor body region including a first conductivity type first...
US-1,009,6511 Carrier and a method for processing a carrier
According to various embodiments, a carrier may be provided, the carrier including: a hollow chamber spaced apart from a surface of the carrier; a trench...
US-1,009,6508 Assembly for handling a semiconductor die and method of handling a semiconductor die
In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also...
US-1,009,6507 Thin substrate electrostatic chuck system and method
In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate...
US-1,009,5301 Interconnect serialization system and method
A method and system to reduce power consumption are described. The system can include a first device and a second device of a plurality of devices. The second...
US-1,009,4913 Radar circuit, radar system and method for testing
A radar circuit for controlling a radar antenna in a vehicle comprises an antenna connection for connection of a radar antenna, a radar circuit for transmission...
US-1,009,4889 Systems and arrangements of three-contact hall-effect devices and related methods
Embodiments relate to vertical Hall effect devices comprising Hall effect structures with three contacts in each Hall effect region. In one embodiment, the...
US-1,009,3137 Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
Embodiments provide a device, a system, a method and a computer program for locating a plurality of positions of a plurality of wheels on a vehicle. The device...
US-1,009,2974 Method for producing a circuit carrier and for connecting an electrical conductor to a metallization layer of a...
One aspect of the invention relates to a method for producing a circuit carrier. For this purpose, an electrically insulating carrier is provided, having an...
US-1,009,1492 Imaging apparatuses and a time of flight imaging method
The imaging apparatus includes an image sensor circuit comprising a time of flight sensor pixel. The imaging apparatus further includes a first light emitter...
US-1,009,0965 Electronic circuit and method for transferring data between clock domains
According to one embodiment, an electronic circuit is described comprising a first clock domain configured to operate according to a first clock signal, a...
US-1,009,0939 Integrated RF circuit with phase-noise test capability
An integrated circuit is described herein. According to one or more embodiments, the integrated circuit includes a local oscillator with a voltage-controlled...
US-1,009,0765 Multi-phase converter controller using dynamic hysteresis value
In one example, a circuit for controlling a multi-phase converter is configured to determine an operating condition at a multi-phase converter module. Each...
US-1,009,0406 Non-planar normally off compound semiconductor device
A normally-off compound semiconductor device includes a first III-nitride semiconductor having a first sloped transition region in which the first III-nitride...
US-1,009,0265 Semiconductor device with metal structure electrically connected to a conductive structure
A semiconductor device includes a semiconductor die that having a conductive structure. A metal structure is electrically connected to the conductive structure...
US-1,009,0251 Semiconductor chip having a dense arrangement of contact terminals
A semiconductor chip includes a semiconductor body having an active device region, one or more metallization layers insulated from the semiconductor body and...
US-1,009,0216 Semiconductor package with interlocked connection
A semiconductor package includes a block having opposing first and second main surfaces and sides between the first and second main surfaces, and an...
US-1,009,0215 System and method for dual-region singulation
A semiconductor die includes a semiconductor circuit disposed within or over a substrate. A conductive contact pad is disposed over the substrate outside the...
US-1,009,0214 Wafer and method for processing a wafer
A wafer in accordance with various embodiments may include: at least one metallization structure including at least one opening; and at least one separation...
US-1,009,0192 Method for producing a conductor line
A method for producing a rounded conductor line of a semiconductor component is disclosed. In that method, a partially completed semiconductor component is...
US-1,008,9430 Integrated circuits and methods of design and manufacture thereof
Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes using a first mask to pattern a...
US-1,008,8855 Corrected temperature sensor measurement
Representative implementations of devices and techniques provide correction for temperature sensor measurement error. In an example, the temperature sensor...
US-1,008,7872 System and method for a synchronized driver circuit
According to an embodiment, a controller system that is configured to drive a power switch includes a driver integrated circuit (IC), which includes an...
US-1,008,7866 Detecting fuel injector timing with current sensing
A fuel injection system for an internal combustion engine includes a fuel injector and an engine control system. The engine control system is configured to send...
US-1,008,6370 Microfluidic device and method
A microfluidic device includes a semiconductor chip having a main chip surface. The microfluidic device further includes an encapsulation body embedding the...
US-1,008,5353 Solder bridging prevention structures for circuit boards and semiconductor packages
A board for mechanically supporting and electrically connecting electronic components includes a non-conductive substrate, a plurality of electrically...
US-1,008,5314 Light emitting diode driver for load changes
A device for regulating a voltage includes a first branch switch, a second branch switch, and a control module. The control module is configured to determine an...
US-1,008,4451 Level shifter circuit
Techniques are disclosed for a level shifter configured to adjust current flow in response to measured current fluctuations due to common mode noise in the...
US-1,008,4441 Electronic switching and reverse polarity protection circuit
An electronic circuit includes a first transistor device and a second transistor device of the same conductivity type. The first transistor device is integrated...
US-1,008,4317 Power converter circuit with AC output
A power converter circuit includes output terminals configured to receive an external voltage. A series circuit with a number of converter units is connected...
US-1,008,4101 Graded-index structure for optical systems
An optical system and photo sensor pixel are provided. The photo sensor pixel includes a substrate including an active region and a peripheral region that is...
US-1,008,4047 Group III-V device structure with variable impurity concentration
A semiconductor structure includes a substrate, a transition body over the substrate, a group III-V intermediate body having a bottom surface over the...
US-1,008,4038 Semiconductor device with drift zone and backside emitter and method of manufacturing thereof
An epitaxial layer is formed by epitaxy on a base substrate at a front side. From opposite to the front side, at least a portion of the base substrate is...
US-1,008,3960 Power semiconductor device having fully depleted channel regions
A power semiconductor device includes a semiconductor body coupled to first and second load terminal structures, and first and second cells each configured for...
US-1,008,3899 Semiconductor package with heat slug and rivet free die attach area
A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower...
US-1,008,3884 Compact high-voltage semiconductor package
There are disclosed herein various implementations of a compact high-voltage semiconductor package. In one exemplary implementation, such a semiconductor...
US-1,008,3835 Forming electrode trenches by using a directed ion beam and semiconductor device with trench electrode structures
By directing an ion beam with a beam divergence .theta. on a process surface of a semiconductor substrate, parallel electrode trenches are formed in the...
US-1,008,3743 Memory unit and method of operating a memory unit sector
Disclosed is a memory unit that includes a sector of memory cells. The sector includes a first memory cell configured to selectively take on a state...
US-1,008,2484 Gas-sensitive hall device
A chemically sensitive Hall device is described herein. In accordance with one example of the present invention, a Hall device comprises a substrate and a...
US-1,008,1533 Micromechanical structure and method for fabricating the same
A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region...
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