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Patent # Description
US-9,452,923 Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole...
A method for manufacturing a micromechanical system includes creating a sacrificial layer at a substrate surface. A structural material is deposited at a...
US-9,450,933 Systems and methods for device and data authentication
Embodiments relate to systems and methods for authenticating devices and securing data. In embodiments, a session key for securing data between two devices can...
US-9,450,628 Receiver and transmitter receiver system
A receiver for receiving messages from a transmitter includes a controller and a driver stage for providing a supply voltage to the transmitter based on a...
US-9,450,613 Apparatus and method for error correction and error detection
A circuitry comprising a syndrome generator configured to generate a syndrome based on a parity check matrix and a binary word comprising a first set of bits...
US-9,450,494 Inductive compensation based control of synchronous rectification switch
An electronic device includes a synchronous rectification circuit having an actively controlled switching element through which resonant current flows during...
US-9,450,492 System and method for controlling a duty cycle of a switched-mode power supply
In accordance with an embodiment, a method for controlling a switched-mode power supply (SMPS), includes receiving a measurement of a supply voltage input of...
US-9,450,436 Active power factor corrector circuit
In accordance with an embodiment, a circuit includes a direct current (DC) output configured to be coupled to a rechargeable battery and a power factor...
US-9,450,085 Semiconductor device and method for producing a semiconductor device
A semiconductor device includes a semiconductor substrate having first regions of a first conductivity type and body regions of the first conductivity type,...
US-9,450,063 Semiconductor device and method
A semiconductor device is disclosed. One embodiment includes a lateral HEMT (High Electron Mobility Transistor) structure with a heterojunction between two...
US-9,450,062 Semiconductor device having polysilicon plugs with silicide crystallites
A semiconductor device includes a field effect transistor structure having source zones of a first conductivity type and body zones of a second conductivity...
US-9,450,019 Power semiconductor device, manufacturing method therefor, and method for operating the power semiconductor device
A power semiconductor device includes a semiconductor body including a first surface, an edge delimiting the semiconductor body in a horizontal direction...
US-9,449,968 Method for manufacturing a semiconductor device and a semiconductor device
A semiconductor device is formed by forming: a transistor in a semiconductor substrate having a main surface; a source region and a drain region; and a channel...
US-9,449,957 Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase and W-phase power switches situated on the PQFN leadframe...
US-9,449,928 Layer arrangement
A layer arrangement in accordance with various embodiments may include: a wafer; a passivation disposed over the wafer; a protection layer disposed over at...
US-9,449,902 Semiconductor packages having multiple lead frames and methods of formation thereof
In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead...
US-9,449,899 Semiconductor package with heat spreader
A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the...
US-9,449,895 Cooling system for molded modules and corresponding manufacturing methods
A cooling system for molded modules includes a plurality of individual modules each including a semiconductor die encapsulated by a mold compound, a plurality...
US-9,449,876 Singulation of semiconductor dies with contact metallization by electrical discharge machining
A method of separating individual dies of a semiconductor wafer includes forming a metal layer on a first surface of a semiconductor wafer, the semiconductor...
US-9,449,873 Method for processing a carrier and an electronic component
In various embodiments, a method for processing a carrier is provided. The method for processing a carrier may include: forming a first catalytic metal layer...
US-9,449,847 Method for manufacturing a semiconductor device by thermal treatment with hydrogen
A semiconductor device is manufactured by forming semiconductor elements extending between a front surface and a rear side of a semiconductor layer. This...
US-9,449,172 Memory arrangement and method for detecting an attack on a memory arrangement
According to various embodiments, a memory arrangement is described having a first bit line, a first precharge device for precharging the first bit line to a...
US-9,448,574 Low drop-out voltage regulator
A system including a first transistor, a first capacitor and a circuit. The first transistor has a first control input and is configured to regulate an output...
US-9,448,130 Sensor arrangement
A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising: a carrier; an...
US-9,448,126 Single diaphragm transducer structure
A transducer structure including a carrier with an opening and a suspended structure mounted on the carrier which extends at least partially over the opening in...
US-9,446,944 Sensor apparatus and method for producing a sensor apparatus
In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing...
US-9,445,173 System and method for a transducer system with wakeup detection
According to embodiments described herein, a circuit includes an interface circuit configured to be coupled to a transducer and a detection circuit. The...
US-9,445,079 Calibration of a 3D camera
A method for calibrating a 3D camera includes determining an actuation of an element by a person and calibrating the 3D camera based on the determining of the...
US-9,444,616 Transponder unit, system and method for contactless data transmission
A transponder unit for the contactless transmission of modulated data to a reader is provided. The transponder unit includes a clock generator configured to...
US-9,444,613 Sensor, control unit and method to communicate between sensors and control units
A sensor may include a clock generator configured to generate a clock. A receiver may be configured to receive signals from a control unit, and a transmitter...
US-9,444,468 Oscillator devices and methods
Oscillator devices and corresponding methods are disclosed. In some embodiments an apparatus includes an oscillator circuit arrangement, a frequency variable...
US-9,444,382 Optimized field oriented control strategies for permanent magnet synchronous motors
A motor control system and associated method includes a transform component configured to receive current values associated with a motor being driven by the...
US-9,444,363 Circuit arrangement with a rectifier circuit
In accordance with an embodiment, a method includes receiving by a drive circuit electrical power from a voltage tap of a first rectifier circuit that includes...
US-9,444,332 System and method for controlling a power supply during discontinuous conduction mode
In accordance with an embodiment, a controller for a switched mode power supply includes an average current comparator that determines whether an average...
US-9,444,331 System and method for a converter circuit
In accordance with an embodiment, a circuit includes a switch coupled between a first reference terminal and a first output terminal, an inductive element...
US-9,444,027 Thermoelectrical device and method for manufacturing same
A method for manufacturing a thermoelectrical device includes providing a substrate and also forming at least one deep trench into the substrate. The method...
US-9,443,973 Semiconductor device with charge compensation region underneath gate trench
A semiconductor substrate has a main surface and a rear surface vertically spaced apart from the main surface, a first doped region, a second doped region and a...
US-9,443,972 Semiconductor device with field electrode
A method of producing a semiconductor device includes providing a semiconductor body having a first surface and a dielectric layer arranged on the first surface...
US-9,443,971 Semiconductor to metal transition
A semiconductor device includes a diffusion barrier layer, a first semiconductor region having first charge carriers of a first conductivity type and a second...
US-9,443,941 Compound semiconductor transistor with self aligned gate
A transistor device includes a compound semiconductor body having a first surface and a two-dimensional charge carrier gas disposed below the first surface in...
US-9,443,807 Semiconductor device and method for manufacturing a semiconductor device
A device includes a semiconductor chip. An outline of a frontside of the semiconductor chip includes at least one of a polygonal line including two line...
US-9,443,798 Passive component as thermal capacitance and heat sink
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board...
US-9,443,795 Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase inverter situated on a leadframe. The PQFN package...
US-9,443,787 Electronic component and method
An electronic component includes a high-voltage depletion-mode transistor, a low-voltage enhancement-mode transistor arranged adjacent and spaced apart from the...
US-9,443,760 Multichip power semiconductor device
An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted...
US-9,443,583 Resistive memory and method
A memory device includes a multi gate field effect transistor (MuGFET) having a fin with a contact area. A programmable memory element abuts the fin contact area.
US-9,442,478 Systems, circuits and a method for generating a configurable feedback
A system can generate a configurable feedback. The system includes a number of circuitries that are coupled to a number of drivers and connected to each other...
US-9,439,017 Method for manufacturing a plurality of microphone structures, microphone and mobile device
In various embodiments, a method for manufacturing microphone structures is provided. The method may include: Providing a substrate having a front side and a...
US-9,438,979 MEMS sensor structure for sensing pressure waves and a change in ambient pressure
A sensor structure, including: a first diaphragm structure, an electrode element, and a second diaphragm structure arranged on an opposite side of the electrode...
US-9,438,452 System and method for multi-channel control system
A system having has a pulse width modulation controller to successively activate each of a plurality of channels each in its own individual channel time slot is...
US-9,438,221 Switch device
Switch devices with a first switching path and a second switching path are provided in some embodiments. When a voltage drop across the first switching path...
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