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Patent # Description
US-1,012,1690 Method of manufacturing a semiconductor component and semiconductor component
Various embodiments provide method of manufacturing a semiconductor component, wherein the method comprises providing a layer stack comprising a carrier and a...
US-1,012,0829 Bus device with programmable address
An embodiment bus device with a programmable address includes a bus communication circuit connected to a bus terminal, a first pin terminal, a memory having a...
US-1,012,0434 Semiconductor device chip package with electronic switching using dedicated ground pin coupled to a virtual...
A semiconductor device is described herein. In accordance with one exemplary embodiment the semiconductor device includes a chip package, which includes at...
US-1,012,0398 Temperature dependent current limiting
In one example, a method includes determining, by a temperature sensor, a temperature of a device that controls an amount of current flowing to a load, and...
US-1,012,0287 Particle irradiation apparatus, beam modifier device, and semiconductor device including a junction termination...
A beam modifier device is provided that includes scattering portions in which particles vertically impinging on an exposure surface of the beam modifier device...
US-1,011,9999 Circuit connectivity and conveyance of power status information
An example system comprises first circuitry (such as a first integrated circuit device having a limited number of input/output pins) and second circuitry (such...
US-1,011,9727 Mechanical relay and solid-state relay for controlling heating elements
A circuit comprises a mechanical relay and a solid-state relay. The mechanical relay is configured to switch a first supply current of the first heating element...
US-1,011,8816 Method of forming a protective coating for a packaged semiconductor device
A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device,...
US-1,011,7621 Implantable device and implantable system comprising the same
An implantable device includes a body part and a piezoelectric part. The body part is configured to grasp a pulsatile organic or inorganic tissue. The...
US-1,011,7321 Device including a printed circuit board and a metal workpiece
A device including a first semiconductor package that includes a semiconductor chip, an encapsulation material at least partly covering the semiconductor chip,...
US-1,011,6301 Cross-coupled, narrow pulse, high voltage level shifting circuit with voltage domain common mode rejection
A system for high voltage level shifting includes a level shifting circuit having a high side circuit that receives a mixed signal having a common mode signal...
US-1,011,6209 System and method for starting a switched-mode power supply
A method of operating a switched-mode power supply (SMPS) includes starting up the switched-mode power supply by determining a rate of increase of a duty cycle...
US-1,011,5817 Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes forming a first semiconductor layer on a semiconductor substrate of a first conductivity type having a...
US-1,011,5812 Semiconductor device having a superjunction structure
A semiconductor device includes a drift region of a first conductivity type, an anode region of a second conductivity type situated below the drift region, an...
US-1,011,5791 Semiconductor device including a super junction structure in a SiC semiconductor body
An embodiment of a semiconductor device includes a body region of a first conductivity type in a SiC semiconductor body of a second conductivity type. A super...
US-1,011,5688 Solder metallization stack and methods of formation thereof
A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact...
US-1,011,5646 Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power...
US-1,011,4992 Electronic identification document
An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave...
US-1,011,4685 System and method for error detection of executed program code employing compressed instruction signatures
A system comprising a first processor and a second processor is provided. The first processor is configured to load an instruction block from a first memory,...
US-1,011,4401 System and method for a serial bus interface
In accordance with an embodiment, a method of operating a charging port having a power connection and a first data connection includes determining whether a...
US-1,011,3884 Diversity in magnetic sensors
A magnetic angle sensor including a first Wheatstone bridge circuit having a plurality of first magnetoresistive elements; and a second Wheatstone bridge...
US-1,011,2861 Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of...
A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a...
US-1,011,1299 Adaptive overvoltage protection for multifunction LED chain
In one example, a method includes determining, by a device of a system, a voltage feedback value that represents a voltage level of a power signal being...
US-1,011,0230 Level shifter and method for operating the same
In various embodiments, a level shifter and a method for operating the same are provided. The level shifter may include a low supply voltage terminal, a high...
US-1,011,0120 Load adaptable boost DC-DC power converter
A boost DC-DC power converter comprising a semiconductor switch arrangement comprising a plurality of series connected semiconductor switches. A first capacitor...
US-1,010,9734 Semiconductor device comprising a transistor
A semiconductor device comprises a transistor in a semiconductor body having a first main surface. The transistor comprises a source region of a first...
US-1,010,9624 Semiconductor device comprising transistor cell units with different threshold voltages
An embodiment of a semiconductor device comprises a transistor cell array in a semiconductor body. The transistor cell array comprises transistor cell units....
US-1,010,9609 Connection structure and electronic component
A connection structure is provided that includes a semiconductor substrate, a first layer arranged on the semiconductor substrate, the first layer being...
US-1,010,9592 Semiconductor chip with electrically conducting layer
A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, and a side wall...
US-1,010,9544 Baseplate for an electronic module
Various embodiments provide an electronic module comprising a baseplate. A recess is formed in one main surface of the baseplate, wherein the recess is adapted...
US-1,010,9536 System and method for a microfabricated fracture test structure
According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a...
US-1,010,9489 Method for producing a superjunction device
Disclosed is a method that includes forming a plurality of semiconductor arrangements one above the other. In this method, forming each of the plurality of...
US-1,010,9372 Memory device and method for correcting a stored bit sequence
A memory device includes a memory with first memory cells and second memory cells, which are different from the first memory cells. In the first memory cells...
US-1,010,9367 Magnetic memory device and method for operating the same
A magnetic memory device is provided. The magnetic memory device includes a memory circuit comprising a first tunnel magnetoresistive element and a second...
US-1,010,7875 GMR sensor within molded magnetic material employing non-magnetic spacer
An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one...
US-1,010,7867 Sensor arrangement, battery cell and energy system
A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at...
US-1,010,6398 Micromechanical structure comprising carbon material and method for fabricating the same
A micromechanical structure comprises a substrate and a functional structure arranged at the substrate. The functional structure comprises a functional region...
US-1,010,4812 Elastic mounting of power modules
A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a...
US-1,010,4478 System and method for a perpendicular electrode transducer
According to an embodiment, a method of operating a microelectromechanical systems (MEMS) transducer that has a membrane includes transducing between...
US-1,010,3724 Dimension regulation of power device to eliminate hot spot generation
A parameter is compared to a lower threshold. The parameter is a gate-to-source voltage that is associated with a first transistor or a drain current that is...
US-1,010,3638 Flyback converter with capacitor module and switching module
In an example, a circuit for voltage regulation includes a capacitor module, a multiple winding transformer, and a switching module. The capacitor module...
US-1,010,3227 Method for manufacturing a power semiconductor device
A method for manufacturing a power semiconductor device includes: forming a drift region of a first conductivity type, a second emitter region of a second...
US-1,010,3123 Semiconductor devices and processing methods
Various embodiments provide a semiconductor device, including a final metal layer having a top side and at least one sidewall; and a passivation layer disposed...
US-1,010,3076 Semiconductor package including a semiconductor die having redistributed pads
A method includes coupling a first major surface of a semiconductor die to a metallic body, depositing an insulation body over said semiconductor die, and...
US-1,010,3050 System reference with compensation of electrical and mechanical stress and life-time drift effects
Stress compensated systems and methods of compensating for electrical and mechanical stress are discussed. One example system can include a first circuit and a...
US-1,010,2992 Switching apparatus, switching system and switching method
The present disclosure relates to a switching device, comprising an input for a sensor signal, the sensor signal having a sensor signal amplitude; and...
US-1,010,2967 Method of manufacturing an inductor core for a chip assembly and chip assembly
A method for manufacturing an inductor core is developed, wherein the method comprises the following: Forming a first electrical conductor on a first surface of...
US-1,010,1453 Time of flight apparatuses and an illumination source
An apparatus includes a detector circuit configured to receive a modulated electromagnetic wave signal from an illumination source and to provide a detection...
US-1,010,1379 Sensor self-diagnostics using multiple signal paths
Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and...
US-1,009,9519 Systems and methods using a reference marker
A tire pressure monitor sensor is disclosed. The sensor includes a wireless transmitter and a processing unit. The processing unit provides a time trigger...
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