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Patent # Description
US-1,013,4835 Power semiconductor device having fully depleted channel regions
A power semiconductor device is disclosed. The device includes a semiconductor body coupled to a first load terminal structure and a second load terminal...
US-1,013,4697 Semiconductor chip and method of processing a semiconductor chip
Various embodiments provide a semiconductor chip, wherein the semiconductor chip comprises a first contact area and a second contact area both formed at a...
US-1,013,4654 Double-encapsulated power semiconductor module and method for producing the same
One aspect relates to a power semiconductor module. The module includes a module housing, a substrate, and a semiconductor chip attached to the substrate. The...
US-1,013,4636 Methods for producing semiconductor devices
A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first...
US-1,013,4603 Method of planarising a surface
In an embodiment, a method of planarizing a surface includes applying a first layer to a surface including a protruding region including at least one compound...
US-1,013,4452 Memory arrangement and method for reading a memory cell of a memory
According to one embodiment, a memory arrangement is described a memory including a memory cell and a sense amplifier coupled to the memory cell having a node...
US-1,013,3626 Error correction using WOM codes
A method is proposed for storing bits in memory cells of a memory, wherein in two successive write operations first and second wits are written to identical...
US-1,013,2843 Detector and a voltage converter
A detector for detecting an occurrence of a current strength of interest of a current of a signal to be sensed includes a magnetoresistive structure and a...
US-1,013,2765 Method and apparatus for determining lattice parameters of a strained III-V semiconductor layer
A multi-layer arrangement of III-V semiconductor layers includes a strained III-V semiconductor layer having a concentration of a constituent element which...
US-1,013,2696 Integrated temperature sensor for discrete semiconductor devices
A semiconductor die includes a discrete semiconductor device and at least one diode. The temperature of the discrete semiconductor device is determined by...
US-1,013,2654 Error compensation in an angle sensor
Embodiments provide a method for determining sine or cosine correction values for an error compensation in an angle sensor. At least three pairs of values for...
US-1,013,2626 Adaptive distance estimation
Representative implementations of devices and techniques provide adaptive distance estimation for imaging devices and systems. Distance estimation may be based...
US-1,012,9676 MEMS microphone, apparatus comprising a MEMS microphone and method for fabricating a MEMS microphone
A MEMS microphone and a method for manufacturing a MEMS microphone are disclosed. Embodiments of the invention provide a MEMS microphone including a MEMS...
US-1,012,8962 RF front-end with power sensor calibration
One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor,...
US-1,012,8787 Detection of rotor lock
In some examples, a controller device is configured to generate control signals for a power-conversion circuit that drives an electric motor including a rotor....
US-1,012,8783 Synchronization of internal oscillators of components sharing a communications bus
A drive circuit includes an internal oscillator and a pre-drive controller coupled to the internal oscillator. The pre-drive controller can have a switch...
US-1,012,8752 Controller tuning using perturbation sequence
In an example, a device for operating a switching converter is configured to determine a set of perturbed duty cycle values for a converter. A perturbation...
US-1,012,8750 Switched-mode power converter with an inductive storage element and a cascode circuit
A switched-mode power converter includes an inductive storage element and a cascode circuit. The cascode circuit includes a double-gate field effect transistor....
US-1,012,8738 Determination of entering and exiting safe mode
The disclosure describes examples of integrate circuit (IC) chips. An IC chip includes a first detector configured to generate information indicative of whether...
US-1,012,8736 Rectifier device
A rectifier device is described herein. In accordance with one exemplary embodiment, the rectifier device includes a semiconductor substrate doped with dopants...
US-1,012,8367 Transistor device with increased gate-drain capacitance
Disclosed is a transistor device. The transistor device includes: a semiconductor body with an active region and a pad region; at least one transistor cell...
US-1,012,8358 Transistor having a monocrystalline connection
A transistor comprising a semiconductor substrate comprising a collector region extending from a main surface of the semiconductor substrate into a substrate...
US-1,012,8328 Method of manufacturing semiconductor devices and semiconductor device containing hydrogen-related donors
Crystal lattice defects are generated in a horizontal surface portion of a semiconductor substrate and hydrogen-related donors are formed in the surface...
US-1,012,8228 Type III-V semiconductor device with integrated diode
A semiconductor device includes a type IV semiconductor base substrate, a first type III-V semiconductor layer formed over the base substrate, a second type...
US-1,012,8204 RF module
In accordance with an embodiment, an RF module includes a bulk semiconductor substrate with at least one integrated RF component integrated in a first main...
US-1,012,8180 Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an...
US-1,012,8173 Common contact leadframe for multiphase applications
In some examples, a device includes an input leadframe segment and a reference leadframe segment that is electrically isolated from the input leadframe segment....
US-1,012,8165 Package with vertically spaced partially encapsulated contact structures
A package comprising at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, a first electrically...
US-1,012,8133 Method of conditioning an etch chamber for contaminant free etching of a semiconductor device
An etching tool that includes an interior chamber is provided. A plurality of type III-V semiconductor wafers is provided. A process cycle is performed for each...
US-1,012,7176 Receiver architecture
In accordance with an embodiment, a receiver includes a receiving unit configured to receive a first received bus signal and a second received bus signal based...
US-1,012,7171 Circuit arrangement, network-on-chip and method for transmitting information
A circuit arrangement, network-on-chip, and a method for transmitting information are disclosed. In one embodiment, an electrical circuit is provided comprising...
US-1,012,6773 Circuit and method for providing a secondary reference voltage from an initial reference voltage
According one embodiment, a circuit is described comprising a first reference voltage generating circuit comprising an output to provide a first reference...
US-1,012,6355 Semiconductor probe test card with integrated hall measurement features
A probe test card for testing semiconductor devices includes a printed circuit board, a pair of electrically conductive probes extending towards one another and...
US-1,012,6353 Verification of gate driver protection logic
A gate driver is described that includes a gate signal module configured to output a gate signal of the gate driver for driving a gate terminal of a...
US-1,012,6347 Passive bridge circuit with oxide windows as leakage sink
Leakage current detection systems and detection methods are provided. A leakage current detection system includes a passive bridge circuit including a first...
US-1,012,5012 MEMS device
A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main...
US-1,012,3429 Mounting of components on a printed circuit board
A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed...
US-1,012,3103 Sigma delta modulator for sensors
In various embodiments, a circuit is provided. The circuit includes: a voltage biasing circuit coupled to a microelectro-mechanical system (MEMS) microphone...
US-1,012,2449 Access control devices and a transceiver device
An access control device includes a time of flight circuit configured to determine a distance information related to a distance between the access control...
US-1,012,2374 Method and apparatus for analog-to-digital conversion using a tank capacitor
An apparatus for converting an analog signal to a digital signal comprises an input node to be set to an input voltage that is based on the analog signal. The...
US-1,012,2362 Dynamic biasing circuitry for level-shifter circuitry
In some examples, a device includes level-shifter circuitry and biasing circuitry including at least four diodes, wherein each diode of the at least four diodes...
US-1,012,2293 Power module package having a multi-phase inverter and power factor correction
According to an exemplary implementation, a power module package includes a multi-phase inverter. The power module package also includes a multi-phase inverter...
US-1,012,2287 Power supply systems and feedback through a transformer
A power converter circuit includes a transformer. The transformer includes a primary winding and a secondary winding. A primary circuit is coupled to the...
US-1,012,2276 Method for operating a power converter circuit and power converter circuit
In accordance with an embodiment, a method includes converting power by a power converter circuit having a plurality of converter cells coupled to a supply...
US-1,012,2256 Method and apparatus for zero-current switching control in switched-capacitor converters
A switched-capacitor converter includes a plurality of legs coupled between the input and a rectifier at the output. Each leg includes a capacitor. A first...
US-1,012,1859 Method of manufacturing semiconductor devices with transistor cells and semiconductor device
First reinforcement stripes are formed on a process surface of a base substrate. A first epitaxial layer covering the first reinforcement stripes is formed on...
US-1,012,1753 Enhanced solder pad
A solder pad includes a surface. A tin layer is arranged on the surface. At least one out of a bismuth layer, an antimony layer and a nickel layer is arranged...
US-1,012,1751 Integrated antennas in wafer level package
A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially...
US-1,012,1723 Semiconductor component and method for producing a semiconductor component
According to an embodiment of a method, the method includes forming a first thermally conductive layer on an outer surface of a semiconductor package. The first...
US-1,012,1691 Semiconductor substrate arrangements and a method for forming a semiconductor substrate arrangement
A semiconductor substrate arrangement includes a carrier wafer and a plurality of semiconductor substrate pieces fixed to the carrier wafer and distributed...
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