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Patent # Description
US-9,893,618 Voltage regulator with fast feedback
In some examples, a voltage regulator comprises an amplifier stage and a pass element configured to receive an output of the amplifier stage and an output of a...
US-9,893,602 Switched-mode power converter with sampled feedback signal
In accordance with an embodiment, a method of operating a switched-mode power converter includes driving a switching element in successive drive cycles, in...
US-9,893,178 Semiconductor device having a channel separation trench
A semiconductor device includes a transistor formed in a semiconductor substrate having a main surface. The transistor includes a source region of a first...
US-9,893,175 Integrated circuit with a power transistor and a driver circuit integrated in a common semiconductor body
An integrated circuit includes a power transistor and a drive circuit. The drive circuit includes at least one drive transistor. The power transistor and the at...
US-9,893,158 Semiconductor device comprising a gradually increasing field dielectric layer and method of manufacturing a...
A semiconductor device is provided that includes a transistor in a semiconductor body having a main surface. The transistor includes a source region, a drain...
US-9,892,997 Adaptable molded leadframe package and related method
A semiconductor package includes at least one semiconductor device situated on a leadframe island, a first at least one lead protruding from a first side of the...
US-9,892,991 Connectable package extender for semiconductor device package
A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure...
US-9,892,851 DC-DC converter assembly, method of manufacturing a DC-DC converter assembly and method of manufacturing an...
A DC-DC converter assembly a power stage die of a DC-DC converter attached to a board, an output inductor attached to the board and electrically connected to an...
US-9,892,836 Rotary encoder with shielded magnet
A magnetic set-up for use in a rotary encoder is disclosed. The set-up includes a permanent magnet arrangement including at least one permanent magnet, which is...
US-9,892,765 Circuit for injecting compensating charge in a bias line
According to one embodiment, a circuit is described including a circuit component configured to switch from a first state into a second state including a node...
US-9,892,089 Arithmetic logical unit array, microprocessor, and method for driving an arithmetic logical unit array
In various embodiments an arithmetic logical unit array is provided, which may include: at least two data registers for storing data, a plurality of fixed...
US-9,891,917 System and method to increase lockstep core availability
A system and method for increasing lockstep core availability provides for writing a state of a main CPU core to a state buffer, executing one or more...
US-9,891,700 Power management for datacenter power architectures
A method of managing system resources managing resource utilization for a system board that includes a plurality of processors, memory associated with each of...
US-9,891,640 Sensing element for semiconductor
An embodiment relates to a device comprising a high-side semiconductor, a low-side semiconductor, a first sensing element arranged adjacent to the high-side...
US-9,891,295 Sensor device and sensor arrangement
A sensor arrangement according to an embodiment includes a board with a plurality of conductive lines of a first type, and a plurality of conductive lines of a...
US-9,891,268 Apparatus and method for generating signals for ESD stress testing an electronic device and system for...
An apparatus and a method for generating signals for ESD stress testing an electronic device are disclosed. In an embodiment the apparatus is configured to...
US-9,891,247 U-shaped vertical shunt resistor for Power Semiconductor module
A measurement resistor for current measurement is described. According to one exemplary embodiment, the measurement resistor includes a first and a second metal...
US-9,888,601 Semiconductor module arrangement and method for producing a semiconductor module arrangement
A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of...
US-9,888,563 Electronics assembly with interference-suppression capacitors
An electronics assembly includes a plurality of first semiconductor chips each having a first load terminal and a second load terminal, a conductor structure...
US-9,888,331 System and method for a transducer
According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal...
US-9,887,655 Excitation current-limited power generator
An excitation current-limited power generator includes a digital interface configured to be coupled to an engine control unit (ECU), a regulator coupled...
US-9,887,624 System and method for a switching converter
According to various embodiments, a method for operating a switching converter includes determining an operating parameter of the switching converter and, if...
US-9,887,619 System and method for a normally-on switched mode power supply
A method for operating a switched mode power supply (SMPS) during a start-up sequence includes receiving an input current at a bias supply circuit while a first...
US-9,887,564 Switched mode power supply circuit
A switched mode power supply circuit includes a switching converter receiving an input voltage and generating an output voltage from the input voltage in...
US-9,887,532 Power switch device
Devices and methods comprising a switch and an overload detection are disclosed. When an overload detection is detected, a first retry scheme followed by a...
US-9,887,355 Emitter and method for manufacturing the same
A method for manufacturing an emitter comprises providing a semiconductor substrate having a main surface, the semiconductor substrate comprising a cavity...
US-9,887,261 Charge compensation device and manufacturing therefor
A charge-compensation semiconductor device includes a semiconductor body having a first surface, a lateral edge delimiting the semiconductor body in a...
US-9,887,170 Multi-layer metal pads
A method for fabricating a semiconductor device includes forming a conductive liner over a first landing pad in a first region and over a second landing pad in...
US-9,887,152 Method for manufacturing semiconductor devices having a metallisation layer
A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to...
US-9,887,143 Surface mount device package having improved reliability
A semiconductor package for mounting to a printed circuit board (PCB) includes a case comprising a ceramic base, a semiconductor die in the case, a mounting pad...
US-9,887,139 Integrated heterojunction semiconductor device and method for producing an integrated heterojunction...
A method of producing a semiconductor component is provided. The method includes providing a silicon substrate having a <111>-surface defining a vertical...
US-9,887,125 Method of manufacturing a semiconductor device comprising field stop zone
A method of manufacturing a semiconductor device includes forming a field stop zone by irradiating a portion of a semiconductor body with a laser beam through a...
US-9,887,006 Nonvolatile memory device
A nonvolatile memory device having a first resistive element coupled between a common node and a bit line; a second resistive element coupled between the common...
US-9,886,660 Semiconductor device having one or more of a shock sensor and an acceleration sensor
A semiconductor device includes a semiconductor substrate having an upper first main face and first and second recess areas formed in the upper first main face,...
US-9,886,407 Connectivity of slave devices in mobile devices
In accordance with an embodiment of the present invention, a chip set for a mobile device includes a slave device chip and an interface circuit chip that...
US-9,885,749 Probe-pad qualification
A method in accordance with various embodiments may include: measuring a contact force between at least one probe and at least one contact pad for a plurality...
US-9,885,605 Photocell devices, systems and methods
Embodiments relate to photoreceivers, such as photodiodes. In one embodiment, an integrated circuit device comprises a photodiode, and an electrode arranged...
US-9,884,757 MEMS sensor package systems and methods
Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one...
US-9,882,579 Receiver, sender, method for retrieving an additional datum from a signal and method for transmitting a datum...
A receiver includes a receiver circuit to receive a first transition in a first direction, a second transition in a second, different direction after the first...
US-9,882,492 Control of asymmetric parallel synchronous rectifiers in power converter topologies
A power converter includes an input power source, a synchronous rectifier and a controller. The synchronous rectifier includes a plurality of actively...
US-9,882,481 Method and apparatus for limiting inrush current during startup of a buck converter
A method of regulating an output voltage of a buck converter during a startup period in which the buck converter is first enabled includes regulating the output...
US-9,882,476 Method and apparatus for phase current estimation in semi-resonant voltage converters
A resonant or semi-resonant voltage converter includes a synchronous rectification (SR) switch through which a current having a half-cycle sinusoidal-like shape...
US-9,882,038 Method of manufacturing a bipolar semiconductor switch
A method for forming a bipolar semiconductor switch includes providing a semiconductor body which has a main surface, a back surface arranged opposite to the...
US-9,881,991 Capacitor and method of forming a capacitor
A method for manufacturing a semiconductor device and a semiconductor device are disclosed. The method comprises forming a trench in a substrate, partially...
US-9,881,909 Method for attaching a semiconductor die to a carrier
A method for fabricating an electronic device includes providing a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a...
US-9,881,862 Top side cooling for GaN power device
A packaged semiconductor includes an electrically insulating encapsulant having opposite facing first and second planar sides. A thermally conductive substrate...
US-9,881,853 Semiconductor package having a source-down configured transistor die and a drain-down configured transistor die
A semiconductor package includes a substrate, a first transistor die secured to the substrate and a second transistor die secured to the substrate. The first...
US-9,875,926 Substrates with buried isolation layers and methods of formation thereof
A method for fabricating a semiconductor device includes forming an opening in a first epitaxial lateral overgrowth region to expose a surface of the...
US-9,872,111 Acoustic sensor package
Representative implementations of devices and techniques provide an improved signal receive time to a sensor component. The sensor component is enclosed within...
US-9,871,533 Hybrid digital/analog noise shaping in the sigma-delta conversion
An analog/digital converter (ADC) includes an analog stage with at least one first sigma-delta modulator and includes a digital stage with at least one second...
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